Budget Amount *help |
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2011: ¥520,000 (Direct Cost: ¥400,000、Indirect Cost: ¥120,000)
Fiscal Year 2010: ¥260,000 (Direct Cost: ¥200,000、Indirect Cost: ¥60,000)
Fiscal Year 2009: ¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
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Research Abstract |
Atomic layer deposition(ALD) is the powerful processing method for the formation of nano thin films with finite thickness control. Low pressure plasma is applied for ALD process to enhance the surface reaction for the reduction of the film impurities. In the paper, HfO2 film deposition from Tetrakis EthylMethyl Amino Hafnium(TEMAH) and Ar diluted O2 plasma is shown as an example. The films are analyzed by X-ray Photoelectron Spectroscopy(XPS), Atomic Force Microscopy(AFM).
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