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Digital monitoring for prognostics to defects due to atomic migration

Research Project

Project/Area Number 21760068
Research Category

Grant-in-Aid for Young Scientists (B)

Allocation TypeSingle-year Grants
Research Field Materials/Mechanics of materials
Research InstitutionYokohama National University

Principal Investigator

SHIBUTANI Tadahiro  Yokohama National University, 環境情報研究院, 准教授 (10332644)

Project Period (FY) 2009 – 2010
Project Status Completed (Fiscal Year 2010)
Budget Amount *help
¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2010: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
Fiscal Year 2009: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Keywords原子輸送 / 微小欠陥 / 応力 / 破壊予知 / モニタリング
Research Abstract

The aim of this project is to establish a methodology of in-situ observation for phenomena of small defects due to atomic transportation. Key technology is to predict the site of defects under some environmental conditions. In this study, pressure-induced tin whisker test was conducted for silver doped tin surface finish. Since doped silver can mitigates tin whiskers, it is not suitable for monitoring of tin whisker. On the other hand, long whiskers were observed under corroded samples with electric currents. The driving force of tin whiskers, stress gradient in the surface finish, was generated by surface oxides and distorted electric currents. Based on the above mechanism of tin whiskers, In-situ observation system for tin whiskers were proposed by using micro-manipurator and atomic force microscopy.

Report

(3 results)
  • 2010 Annual Research Report   Final Research Report ( PDF )
  • 2009 Annual Research Report
  • Research Products

    (8 results)

All 2010 2009

All Journal Article (5 results) (of which Peer Reviewed: 2 results) Presentation (3 results)

  • [Journal Article] Effect of Grain Size on Pressure Induced Tin Whisker Formation2010

    • Author(s)
      Tadahiro Shibutani
    • Journal Title

      IEEE Transactions on Electronics Packaging & Manufacturing Vol.33, Issue 3

      Pages: 177-182

    • Related Report
      2010 Final Research Report
    • Peer Reviewed
  • [Journal Article] Effect of Grain Size on Pressure Induced Tin Whisker Formation2010

    • Author(s)
      T.Shibutani
    • Journal Title

      IEEE Transactions on Electronics Packaging & Manufacturing

      Volume: 33 Pages: 177-182

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Tin Whisker Reliability in Microelectronics2009

    • Author(s)
      T.Shibutani, et.al.
    • Journal Title

      Micromaterials and Nanomaterials No.9

      Pages: 49-53

    • Related Report
      2010 Final Research Report
  • [Journal Article] Tin Whisker Reliability in Microelectronics2009

    • Author(s)
      Tadahiro Shibutani, 他
    • Journal Title

      Micromaterials and Nanomaterials No.9

      Pages: 49-53

    • Related Report
      2009 Annual Research Report
  • [Journal Article] 錫ウィスカ発生におけるAg添加の影響2009

    • Author(s)
      澁谷忠弘
    • Journal Title

      日本機械学会2009年度次大会講演論文集 No.09-1

      Pages: 41-42

    • Related Report
      2009 Annual Research Report
  • [Presentation] 錫ウィスカ発生におけるAg添加の影響2009

    • Author(s)
      澁谷忠弘
    • Organizer
      日本機械学会2009年度年次大会講演会 pp.41-42 No.09-1
    • Year and Date
      2009-09-14
    • Related Report
      2010 Final Research Report
  • [Presentation] Effect of grain size on pressure induced tin whiskers2009

    • Author(s)
      T.Shibutani
    • Organizer
      3^<rd> International Symposium on Tin Whiskers
    • Year and Date
      2009-06-23
    • Related Report
      2010 Final Research Report
  • [Presentation] Effect of grain size on pressure induced tin whiskers2009

    • Author(s)
      澁谷忠弘
    • Organizer
      3rd International Symposium on Tin Whiskers
    • Place of Presentation
      デンマーク工科大学
    • Year and Date
      2009-06-23
    • Related Report
      2009 Annual Research Report

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Published: 2009-04-01   Modified: 2016-04-21  

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