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Development of laser-assisted three-dimensional-wiring technology inside insulated substrates by short pulse irradiation

Research Project

Project/Area Number 21760095
Research Category

Grant-in-Aid for Young Scientists (B)

Allocation TypeSingle-year Grants
Research Field Production engineering/Processing studies
Research InstitutionIbaraki University

Principal Investigator

YAMASAKI Kazuhiko  Ibaraki University, 工学部, 助教 (30436240)

Project Period (FY) 2009 – 2010
Project Status Completed (Fiscal Year 2010)
Budget Amount *help
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2010: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2009: ¥3,120,000 (Direct Cost: ¥2,400,000、Indirect Cost: ¥720,000)
Keywordsナノ・マイクロ加工 / レーザ焼結
Research Abstract

To confirm the feasibility of the laser-assisted three-dimensional-wiring technology, near-infrared short pulses were irradiated inside polyimide substrates. As a result, formation of modified polyimide with 20-30 μm in width and 250-270 μm in length was observed. The regions consist of a lot of micro voids with 20 μm or less in size. Although fabrication of continuous micro-channels inside the substrate could not be achieved, we succeeded in carrying out laser sintering of Ag nano-particles under oxygen-free condition. This indicates possibility of the laser sintering of the particles in micro-channels.

Report

(4 results)
  • 2010 Annual Research Report   Final Research Report ( PDF )
  • 2009 Annual Research Report
  • Products Report
  • Research Products

    (1 results)

All 2011

All Presentation (1 results)

  • [Presentation] 短パルスレーザによる絶縁基板内部の3次元微細加工2011

    • Author(s)
      山崎 和彦
    • Organizer
      日本機械学会 第19回 茨城講演会
    • Place of Presentation
      茨城大学(日立キャンパス)
    • Year and Date
      2011-08-26
    • Related Report
      Products Report

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Published: 2009-04-01   Modified: 2016-09-09  

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