STUDY ON ELECTRONIC EQUIPMENT COOLING WITH MICROENCAPSULATED PHASE CHANGE MATERIAL SUSPENSIONS FLOWING IN MINI-PIPE
| Project/Area Number |
21760160
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
Thermal engineering
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| Research Institution | Toyama Prefectural University |
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Principal Investigator |
NAKAGAWA Shinji Toyama Prefectural University, 工学部・機械システム工学科, 准教授 (30337878)
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| Project Period (FY) |
2009 – 2010
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| Project Status |
Completed (Fiscal Year 2010)
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| Budget Amount *help |
¥4,420,000 (Direct Cost: ¥3,400,000、Indirect Cost: ¥1,020,000)
Fiscal Year 2010: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2009: ¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000)
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| Keywords | 伝熱機器 / 相変化マイクロカプセル / 電子機器冷却 / 液冷 / 潜熱輸送 / 微細流路 / 熱伝達 |
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| Research Abstract |
Fundamental thermal performance of a liquid cooling system for small electronic equipment has been examined. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a mini-pipe and a microencapsulated phase change material (MEPCM). The coolant including the MEPCM with an average diameter of 3μm was supplied into the mini-pipe having a diameter of 1mm. The mass concentration of MEPCM was changed from 0 to 5%. The increase of the mass concentration reduces the temperature rise of the heated pipe wall.
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Report
(3 results)
Research Products
(11 results)
