Research Project
Grant-in-Aid for Young Scientists (B)
Fundamental thermal performance of a liquid cooling system for small electronic equipment has been examined. A liquid cooling system is attracting attention because an increase of heat generation density in electronic components requires effective cooling. The cooling system proposed in this study uses a mini-pipe and a microencapsulated phase change material (MEPCM). The coolant including the MEPCM with an average diameter of 3μm was supplied into the mini-pipe having a diameter of 1mm. The mass concentration of MEPCM was changed from 0 to 5%. The increase of the mass concentration reduces the temperature rise of the heated pipe wall.
All 2010 2009 Other
All Journal Article (1 results) Presentation (10 results)
Proceedings of The 4th International Symposium on Advanced Fluid/Solid Science and Technology in Experimental Mechanics (4th ISEM)