Investigation on the flexible printed circuit fabricated by direct electroless Cu plating on a polyimide film.
| Project/Area Number |
21760260
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
Electron device/Electronic equipment
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| Research Institution | Kyushu University |
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Principal Investigator |
IKEDA Akihiro 九州大学, 大学院・システム情報科学研究院, 助教 (60315124)
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| Project Period (FY) |
2009 – 2011
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| Project Status |
Completed (Fiscal Year 2011)
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| Budget Amount *help |
¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000)
Fiscal Year 2011: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2010: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2009: ¥3,380,000 (Direct Cost: ¥2,600,000、Indirect Cost: ¥780,000)
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| Keywords | プラズマ改質 / 無電解めっき / FPC / 高周波信号 / バンドパスフィルタ / フィルム直接めっき / PEN / シランカップリング / FT-IR / 無電解銅めっき / ポリイミド / KOH改質 |
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| Research Abstract |
I have developed the electroless Cu plating directly on polyimide and poly-ethylene naphthalate films by KOH and O2 plasma modifications on the film surfaces, respectively. Using the electroless plating technique, flexible printed circuits(FPC) were formed on the films. I confirmed that these FPC showed smaller signal transmission losses for GHz signals in comparison to a conventional Cu foil laminated FPC. Also, I have fabricated the low loss band pass filter using the electroless Cu plating for 5 GHz wireless band.
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Report
(4 results)
Research Products
(23 results)
