Investigation on the flexible printed circuit fabricated by direct electroless Cu plating on a polyimide film.

• Project/Area Number: 21760260
• Research Category: Grant-in-Aid for Young Scientists (B)
• Allocation Type: Single-year Grants
• Research Field: Electron device/Electronic equipment
• Research Institution: Kyushu University
• Principal Investigator: IKEDA Akihiro 九州大学, 大学院・システム情報科学研究院, 助教 (60315124)
• Project Period (FY): 2009 – 2011
• Project Status: Completed (Fiscal Year 2011)
• Budget Amount: ¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000); Fiscal Year 2011: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000); Fiscal Year 2010: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000); Fiscal Year 2009: ¥3,380,000 (Direct Cost: ¥2,600,000、Indirect Cost: ¥780,000)
• Keywords: プラズマ改質 / 無電解めっき / FPC / 高周波信号 / バンドパスフィルタ / フィルム直接めっき / PEN / シランカップリング / FT-IR / 無電解銅めっき / ポリイミド / KOH改質

Research Abstract

I have developed the electroless Cu plating directly on polyimide and poly-ethylene naphthalate films by KOH and O2 plasma modifications on the film surfaces, respectively. Using the electroless plating technique, flexible printed circuits(FPC) were formed on the films. I confirmed that these FPC showed smaller signal transmission losses for GHz signals in comparison to a conventional Cu foil laminated FPC. Also, I have fabricated the low loss band pass filter using the electroless Cu plating for 5 GHz wireless band.

Research Products

• [Journal Article] High Frequency Signal Transmission Characteristics of Cone Bump Interconnections (2012)
  • Author(s): A. Ikeda, N. Watanabe, T. Asano
  • Journal Title: Technical Digest of the IEEE International 3D System Integration Conference
  • Peer Reviewed
• [Journal Article] High Frequency Signal Transmission Characteristics of Cone Bump Interconnections (2012)
  • Author(s): Akihiro Ikeda, Naoya Watanabe Tanemasa Asano
  • Journal Title: Technical Digest of the IEEE International 3D System Integration Conference Volume: (CD-ROM)
  • Peer Reviewed
• [Journal Article] Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Flexible Electronics (2011)
  • Author(s): T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, T. Asano
  • Journal Title: Proceedings of the 61st ECTC Pages: 1770-1774
  • Peer Reviewed
• [Journal Article] Microjoining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump (2011)
  • Author(s): T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, T. Asano
  • Journal Title: Jpn. J. Appl. Phys Volume: Vol.50
  • NAID: 210000070770
  • Peer Reviewed
• [Journal Article] Micro-joining of LSI Chips on Poly(ethylene naphthalate) Using Compliant Bump (2011)
  • Author(s): Takanori Shuto, Naoya Watanabe, Akihiro Ikeda Tanemasa Asano
  • Journal Title: Japanese Journal of Applied Physics Volume: Vol.50
  • NAID: 210000070770
  • Peer Reviewed
• [Journal Article] Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Fjexible Electronics (2011)
  • Author(s): Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Takao Higashimachi, Tanemasa Asano
  • Journal Title: Proceedings of the 61st Electronic Components and Technology Conference Pages: 1770-1774
  • Peer Reviewed
• [Journal Article] Direct Bonding of LSI Chips to Flexible Substrate using Compliant Bump (2010)
  • Author(s): T. Shuto, N. Watanabe, A. Ikeda, T. Higashimahi, T. Asano
  • Journal Title: Proceedings of The 17th international Display Workshops Pages: 1717-1720
  • Peer Reviewed
• [Journal Article] High-Frequency Signal Transmission Characteristics of Coplanar Waveguides with Cone Bump Interconnections (2010)
  • Author(s): A. IKEDA, K. KAJIWARA, N. WATANABE, T. ASANO
  • Journal Title: Proceedings of IEEE TENCON 2010 Pages: 21-24
  • Peer Reviewed
• [Journal Article] Effect of Argon/Hydrogen Plasma Cleaning on Electroless Ni Deposition on Small-Area Al Pads (2010)
  • Author(s): A. Ikeda, K. Kajiwara, N. Watanabe, T. Asano
  • Journal Title: Jpn. J. Appl. Phys Volume: Vol.49
  • NAID: 210000069047
  • Peer Reviewed
• [Journal Article] Effect of Argon/Hydrogen Plasma Cleaning on Electroless Ni Deposition on Small-Area Al Pads (2010)
  • Author(s): A.Ikeda, K.Kajiwara, N.Watanabe, T.Asano
  • Journal Title: Jpn.J.Appl.Phys Volume: Vol.49
  • NAID: 210000069047
  • Peer Reviewed
• [Journal Article] High-Frequency Signal Transmission Characteristics of Coplanar Waveguides with Cone Bump Interconnections (2010)
  • Author(s): A.Ikeda, K.Kajiwara, N.Watanabe, T.Asano
  • Journal Title: Proceedings of IEEE TENCON 2010 Pages: 2191-2195
  • Peer Reviewed
• [Journal Article] Direct Bonding of LSI Chips to Flexible Substrate using Compliant Bump (2010)
  • Author(s): T.Shuto, N.Watanabe, A.Ikeda, T.Higashimachi, T.Asano
  • Journal Title: Proceedings of IDW'10, The 17th International Display Workshops Pages: 1717-1720
  • Peer Reviewed
• [Journal Article] Electroless Ni-B plating on SiO2 with 3-aminopropyl-triethoxysilane as a barrier layer against Cu diffusion for through-Si via interconnections in a 3-dimensional multi-chip package (2009)
  • Author(s): Akihiro Ikeda, Atsushi Sakamoto, Reiji Hattori, Yukinori Kuroki
  • Journal Title: Thin Solid Films 517 Pages: 1740-1745
  • Peer Reviewed
• [Journal Article] Lows Threshold Blue Emission from First-Order Organic DFB Laser Using 2, 7-bis[4-(N-carbazole)phenylvinyl]-9, 9'-Spirobifluorene as Active Gain Medium (2009)
  • Author(s): M.Hirade, H.Nakanotani, R.Hattori, A.Ikeda, M.Yahiro, C.Adachi
  • Journal Title: Molecular Crystals and Liquid Crystals 504 Pages: 1-8
  • Peer Reviewed
• [Journal Article] Compliant Bump Technology for Back-Side IIIuminated CMOS Image Sensor (2009)
  • Author(s): T.Asano, N.Watanabe, A.Ikeda, et al.
  • Journal Title: Proceedings of 59th Electronic Components and technology Conference Pages: 40-45
  • Peer Reviewed
• [Presentation] High Frequency Signal Transmission Characteristics of Cone Bump Interconnections (2012)
  • Author(s): A. Ikeda, N. Watanabe, T. Asano
  • Organizer: IEEE International 3D System Integration Conference
  • Place of Presentation: 吹田市
  • Year and Date: 2012-02-01
• [Presentation] コンプライアントバンプを用いたかしめ接合によるPENフィルム上へのLSIチップの常温実装 (2011)
  • Author(s): 首藤高徳,渡辺直也,池田晃裕,浅野種正
  • Organizer: 第72回応用物理学会学術講演会
  • Place of Presentation: 東京都
  • Year and Date: 2011-09-02
• [Presentation] コンプライアントバンプを用いたかしめ接合によるPENフィルム上へのLSIチップの常温実装 (2011)
  • Author(s): 首藤高徳, 渡辺直也, 池田晃裕, 浅野種正
  • Organizer: 秋季第72回応用物理学会学術講演会
  • Place of Presentation: 山形大学
  • Year and Date: 2011-09-02
• [Presentation] High-Frequency Signal Transmission Characteristics of Coplanar Waveguides with Cone Bump Interconnections (2010)
  • Author(s): A. IKEDA, K. KAJIWARA, N. WATANABE, T. ASANO
  • Organizer: IEEE TENCON 2010
  • Place of Presentation: 福岡市
  • Year and Date: 2010-11-23
• [Presentation] Direct Bonding of LSI Chips to Flexible Substrate using Compliant Bump (2010)
  • Author(s): (3)T. Shuto, N. Watanabe, A. Ikeda, T. Higashimachi, T. Asano
  • Organizer: 23rd International Microprocesses and Nanotechnology Conference
  • Place of Presentation: 福岡市
  • Year and Date: 2010-10-10
• [Presentation] Ar/H2 plasma cleaning effect on electroless Ni plating for micro-bump formation (2009)
  • Author(s): A. Ikeda, K. Kajiwara, N. Watanabe, T. Asano
  • Organizer: INTERNATIONAL SYMPOSIUM ON DRY PROCESS
  • Place of Presentation: 韓国,釜山
  • Year and Date: 2009-09-25
• [Presentation] Ar/H2 plasma cleaning effect on electroless Ni plating for micro-bump formation (2009)
  • Author(s): A.Ikeda, K.Kajiwara, N.Watanabe, T.Asano
  • Organizer: 31st International Symposium on Dry Process
  • Place of Presentation: 韓国・釜山
  • Year and Date: 2009-09-25
• [Remarks]
  • URL: http://hyoka.ofc.kyushu-u.ac.jp/search/details/K000268/research.html