Liquid-vapor structure under boiling bubbles on MEMS heat transfer surfaces during high heat flux boiling
| Project/Area Number |
21860016
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| Research Category |
Grant-in-Aid for Research Activity Start-up
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| Allocation Type | Single-year Grants |
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| Research Field |
Thermal engineering
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| Research Institution | Shibaura Institute of Technology (2010)
The University of Tokyo (2009) |
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Principal Investigator |
TANGE Manabu Shibaura Institute of Technology, 工学部, 助教 (70549584)
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| Project Period (FY) |
2009 – 2010
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| Project Status |
Completed (Fiscal Year 2010)
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| Budget Amount *help |
¥2,574,000 (Direct Cost: ¥1,980,000、Indirect Cost: ¥594,000)
Fiscal Year 2010: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2009: ¥1,404,000 (Direct Cost: ¥1,080,000、Indirect Cost: ¥324,000)
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| Keywords | 沸騰熱伝達 / MEMS加工 / 気泡核生成 / サブクール沸騰 / 薄膜熱電対 / MEMS |
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| Research Abstract |
This research aims to reveal the liquid-vapor structure beneath the coalescing boiling bubbles by realizing the minimum unit of boiling phenomena, a pair of coalescing bubbles. First, we have conducted the ordinary boiling experiment in a confined space (Hele-Shaw cell). We found the coalescence of the bubble and liquid portion under the bubble. In accordance with the experimental results, we design an MEMS heat transfer surface with 1) Thin film heaters for transient heating, 2) Nickel electrodes for making a tiny hydrogen bubble as boiling nuclei, and 3) thin film thermocouples.
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Report
(3 results)
Research Products
(2 results)
