Key technology for wires and powders assisted plasma arc additive manufacturing of gamm a-TiAl alloys
| Project/Area Number |
21F31063
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| Research Category |
Grant-in-Aid for JSPS Fellows
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| Allocation Type | Single-year Grants |
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| Section | 外国 |
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| Review Section |
Basic Section 18020:Manufacturing and production engineering-related
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| Research Institution | Osaka University |
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Principal Investigator |
麻 寧緒 大阪大学, 接合科学研究所, 教授 (10263328)
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| Co-Investigator(Kenkyū-buntansha) |
WU DONGSHENG 大阪大学, 接合科学研究所, 外国人特別研究員
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| Project Period (FY) |
2021-07-28 – 2023-03-31
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| Project Status |
Completed (Fiscal Year 2022)
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| Budget Amount *help |
¥2,300,000 (Direct Cost: ¥2,300,000)
Fiscal Year 2022: ¥1,100,000 (Direct Cost: ¥1,100,000)
Fiscal Year 2021: ¥1,200,000 (Direct Cost: ¥1,200,000)
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| Keywords | ワイヤアーク積層造形 / アルミニウム / チタン / TiAl合金化 / 溶融池 / 数値解析 / 実験観察 / アークワイヤ積層 / アルミ / チタンとアルミの合金化 / 熱流動数値解析 / 高速カメラ観察 |
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| Outline of Research at the Start |
A novel wires and powders cooperatively assisted plasma arc additive manufacturing process is developed for manufacturing γ-TiAl alloys. The performances of the alloys are improved by adding alloying elements, and homogenization-recrystallization heat treatment. Coupled CFD, Lagrangian particle and FEM numerical models are developed to investigate the alloy elements transportation, and the residual stress distribution of the alloys, respectively. The transportation mechanisms of alloy elements of the wires, powders and weld pool are revealed.
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| Outline of Annual Research Achievements |
This research reveals the homogenization mechanism of Al element and crack suppressing mechanism in wire arc additive manufacturing of Gama-TiAl alloy, which provides solid theoretical support for additive manufacturing of Gama-TiAl alloy. During the research period, Post doctor researcher wins the IIW 2023 Henry Granjon Award from the International Institute of Welding.
The multi-physical simulation and experimental observation showed that the Ti/Al elements can be transferred to the molten pool through a liquid TiAl bridge. The wetting ability of the liquid TiAl metal on the Ti wire surface can be used to predict the possibility of the liquid TiAl bridge breakup. The surface tension causes backward flow and growth of a liquid TiAl droplet and thus suppresses the droplet transfer.
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| Research Progress Status |
令和4年度が最終年度であるため、記入しない。
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| Strategy for Future Research Activity |
令和4年度が最終年度であるため、記入しない。
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Report
(2 results)
Research Products
(5 results)
