全印刷フレキシブル電子デバイスの実現に向けたナノ材料の機能性制御
| Project/Area Number |
21J13108
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| Research Category |
Grant-in-Aid for JSPS Fellows
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| Allocation Type | Single-year Grants |
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| Section | 国内 |
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| Review Section |
Basic Section 21050:Electric and electronic materials-related
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| Research Institution | National Institute for Materials Science (2022)
University of Tsukuba (2021) |
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Principal Investigator |
李 玲穎 国立研究開発法人物質・材料研究機構, 機能性材料研究拠点, 特別研究員(PD)
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| Project Period (FY) |
2021-04-28 – 2023-03-31
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| Project Status |
Completed (Fiscal Year 2022)
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| Budget Amount *help |
¥1,500,000 (Direct Cost: ¥1,500,000)
Fiscal Year 2022: ¥700,000 (Direct Cost: ¥700,000)
Fiscal Year 2021: ¥800,000 (Direct Cost: ¥800,000)
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| Keywords | directed self-assembly / soft electronics / interfacial engineering / printed electronics / patterning / nanowires / ソフトエレクトロニクス / 自己組織化リソグラフィ / 表面・界面物性 / パターニング / 付加製造 / 有機トランジスタ / 透明導電フィルム / プリンテッドエレクトロニクス |
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| Outline of Research at the Start |
This research aims at the directed self-assembly of the soft electronics by room-temperature and solution-processable printing technologies. By exploring the interfacial interaction mechanism between aqueous inks and flexible substrates, diverse directed self-assembly systems are proposed for spontaneously patterning the conductive circuits to cope with the manufacturing challenges from the emerging electronic devices.
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| Outline of Annual Research Achievements |
Soft electronics, referring to electronic devices that are flexible, stretchable, and/or conformable to arbitrary surfaces, are expected to bring about a radical transformation in the period of the industrial revolution owing to their unparallel potential for numerous applications in advanced manufacturing fields. However, fabricating soft electronics that can replace existing products and be put into service in our daily lives is a grand challenge due to the lack of sustainable fabrication processes and competitive performance. Using an independently developed dual-surface-architectonic (DSA) strategy, a novel technology for solid-liquid interfacial engineering has been further demonstrated this year. This technology enables the spontaneous patterning of one-dimensional (1D) functional nanomaterials on polymer substrates in an ordered and scalable manner under ambient conditions. The unique liquid-solid interaction has been thoroughly explored and applied in the practical fabrication of cross-linked silver nanowires (AgNW) soft circuits as well as stretchable tension sensors with prominent conductivity and deformability. This breakthrough opens up new possibilities for liquid-mediated self-assembly technologies in the sustainable manufacturing of soft electronics, particularly for highly conformable skin-integrated sensor devices.
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| Research Progress Status |
令和4年度が最終年度であるため、記入しない。
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| Strategy for Future Research Activity |
令和4年度が最終年度であるため、記入しない。
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Report
(2 results)
Research Products
(12 results)
