Low temperature bonding using activated transparent thin film in air

• Project/Area Number: 21K18729
• Research Category: Grant-in-Aid for Challenging Research (Exploratory)
• Allocation Type: Multi-year Fund
• Review Section: Medium-sized Section 21:Electrical and electronic engineering and related fields
• Research Institution: Kyushu University
• Principal Investigator: Takigawa Ryo 九州大学, システム情報科学研究院, 准教授 (80706846)
• Project Period (FY): 2021-07-09 – 2024-03-31
• Project Status: Completed (Fiscal Year 2023)
• Budget Amount: ¥6,240,000 (Direct Cost: ¥4,800,000、Indirect Cost: ¥1,440,000); Fiscal Year 2023: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000); Fiscal Year 2022: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000); Fiscal Year 2021: ¥3,380,000 (Direct Cost: ¥2,600,000、Indirect Cost: ¥780,000)
• Keywords: 大気低温接合 / 光実装・集積 / 低温集積技術 / 活性化薄膜形成 / 活性透明膜形成

Outline of Research at the Start

本研究では、次世代の低コスト異種材料集積法の創成に向けて、活性透明膜を利用した大気室温接合技術の開発に挑戦する。大気下における活性透明膜形成・室温接合の検証を通じ、接合メカニズムについて理解を深めるとともに光・電子材料の異種材料接合への展開を検討する。

Outline of Final Research Achievements

In this study, Low temperature chip bonding method using activated transparent thin films in air is investigated for heterogeneous optical devices. Formation method of activated transparent thin films is proposed. Findings of both bond characteristics obtained from the vacuum and atmospheric processes is useful for for the mechanism of room temperature bonding and manufacture of future low-cost bonding machines.

Academic Significance and Societal Importance of the Research Achievements

真空・大気下における接合メカニズムの解明に向けて多くの知見を得ることができたため、本研究成果の学術的な価値は高い。また、将来の大気下室温接合の実現に寄与する可能性があり、簡便な光デバイス製造装置開発に繋がれば産業的にも価値があると考えられる。

Research Products

• [Journal Article] Room-Temperature Bonding of Indium Phosphide Wafers and Their Atomic Structure at the Bond Interface (2023)
  • Author(s): Zhang Gufei、Murakami Seigo、Takigawa Ryo
  • Journal Title: ACS Applied Electronic Materials Volume: 5 Issue: 11 Pages: 5995-6002
  • DOI: 10.1021/acsaelm.3c00971
  • Peer Reviewed
• [Journal Article] Fabrication of heterogeneous LNOI photonics wafers through room temperature wafer bonding using activated Si atomic layer of LiNbO3, glass, and sapphire (2023)
  • Author(s): Watanabe Kaname、Takigawa Ryo
  • Journal Title: Applied Surface Science Volume: 620 Pages: 156666-156666
  • DOI: 10.1016/j.apsusc.2023.156666
  • Peer Reviewed
• [Journal Article] Investigation of the interface between LiNbO3 and Si fabricated via room-temperature bonding method using activated Si nano layer (2023)
  • Author(s): Murakami Seigo、Watanabe Kaname、Takigawa Ryo
  • Journal Title: Japanese Journal of Applied Physics Volume: 62 Issue: SG Pages: SG1041-SG1041
  • DOI: 10.35848/1347-4065/acc2cb
  • Peer Reviewed
• [Journal Article] Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition (2023)
  • Author(s): Takakura Ryo、Murakami Seigo、Watanabe Kaname、Takigawa Ryo
  • Journal Title: Scientific Reports Volume: 13 Issue: 1 Pages: 3581-3581
  • DOI: 10.1038/s41598-023-30376-7
  • Peer Reviewed / Open Access
• [Presentation] Surface-activated wafer bonding of ALD Al2O3 ultrathin films (2023)
  • Author(s): Kenji Uno and Ryo Takigawa
  • Organizer: 36rd International Microprocesses and Nanotechnology Conference (MNC 2023)
  • Int'l Joint Research
• [Presentation] Surface activated bonding of Lithium Niobate wafers (2023)
  • Author(s): Takeru Moritomo and Ryo Takigawa
  • Organizer: 36rd International Microprocesses and Nanotechnology Conference (MNC 2023)
  • Int'l Joint Research
• [Presentation] Investigation of surface activation of Si wafer for room temperature direct bonding (2023)
  • Author(s): Seigo Murakami and Ryo Takigawa
  • Organizer: 36rd International Microprocesses and Nanotechnology Conference (MNC 2023)
  • Int'l Joint Research
• [Presentation] 室温接合法により形成されたLiNbO3/Si接合界面の原子スケール解析 (2023)
  • Author(s): 村上 誠悟, 渡辺 要, 多喜川 良
  • Organizer: 第37回エレクトロニクス実装学会春季講演大会
• [Presentation] 表面活性化室温接合法によるInP-on-Insulatorウエハの作製 (2023)
  • Author(s): 章 固非, 村上 誠悟, 渡辺 要, 多喜川 良
  • Organizer: 第37回エレクトロニクス実装学会春季講演大会
• [Presentation] リン化インジウム/シリコンカーバイド常温接合界面の評価 (2023)
  • Author(s): 渡辺 要, 範云翰, 前川 敏輝, 多喜川 良
  • Organizer: 第37回エレクトロニクス実装学会春季講演大会
• [Presentation] Fabrication of LiTaO3/SiC hybrid wafer using surface activated bonding method (2022)
  • Author(s): Seigo Murakami, Ryo Takigawa
  • Organizer: The 13th Japan-China-Korea Joint Conference on MEMS/NEMS
  • Int'l Joint Research
• [Presentation] Fabrication of LNOI/Si optical modulator using room temperature wafer bonding method (2022)
  • Author(s): Kaname Watanabe, Ryo Takigawa
  • Organizer: The 13th Japan-China-Korea Joint Conference on MEMS/NEMS
  • Int'l Joint Research
• [Presentation] Fabrication of LiNbO3/Si bond interface using room temperature direct bonding (2022)
  • Author(s): Seigo Murakami, Kaname Watanabe, Ryo Takigawa
  • Organizer: 35rd International Microprocesses and Nanotechnology Conference (MNC 2022)
  • Int'l Joint Research
• [Presentation] Modified surface activated bonding of InP and SiO2 at room temperature (2022)
  • Author(s): Zhang Gufei, Kaname Watanabe and Ryo Takigawa,
  • Organizer: 35rd International Microprocesses and Nanotechnology Conference (MNC 2022)
  • Int'l Joint Research
• [Presentation] Surface activated bonding of Au thin microbumps using ultra-violet treatment (2021)
  • Author(s): Toshiki Maeakawa, Kaname Watanabe, Hirofumi Nogami, Yuichiro Kurokawa, Yusuke Tahara, and Ryo Takigawa,
  • Organizer: 34th International Microprocesses and Nanotechnology Conference (MNC 2021)
  • Int'l Joint Research