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眼球内埋め込み用低電力三次元積層型人工網膜システムの研究

Research Project

Project/Area Number 22246045
Research Category

Grant-in-Aid for Scientific Research (A)

Allocation TypeSingle-year Grants
Section一般
Research Field Electron device/Electronic equipment
Research InstitutionTohoku University

Principal Investigator

田中 徹  東北大学, 大学院・医工学研究科, 教授 (40417382)

Co-Investigator(Kenkyū-buntansha) 富田 浩史  東北大学, 国際高等研究教育機構, 准教授 (40302088)
福島 誉史  東北大学, 未来科学技術共同研究センター, 准教授 (10374969)
清山 浩司  長崎総合科学大学, 工学部, 講師 (60412722)
小柳 光正  東北大学, 未来科学技術共同研究センター, 教授 (60205531)
Project Period (FY) 2010 – 2011
Project Status Completed (Fiscal Year 2011)
Budget Amount *help
¥35,360,000 (Direct Cost: ¥27,200,000、Indirect Cost: ¥8,160,000)
Fiscal Year 2011: ¥15,340,000 (Direct Cost: ¥11,800,000、Indirect Cost: ¥3,540,000)
Fiscal Year 2010: ¥20,020,000 (Direct Cost: ¥15,400,000、Indirect Cost: ¥4,620,000)
Keywords医用マイクロ・ナノシステム / 人工網膜 / 三次元集積回路 / 低消費電力 / ラプラシアンフィルタ / 埋め込み術式 / EEP / 生体適合性 / Cyclic Voltammetry / Charge Injection Capacity
Research Abstract

(1)LSIチップ積層化技術及び眼球内に埋め込む各部品の一体化集積技術
導電性高分子であるPEDOT電極の作製技術、及び人工網膜チップのフレキシブルケーブル実装技術を確立した。チップの実装にはフレキシブルケーブル上のAu配線の拡散断線防止を工夫したCuSnマイクロバンプを用いて、300℃以下の低温接合を実現した。また、フォトダイオード受光用貫通孔を有する網膜下刺激フレキシブルケーブルの開発に成功し、網膜内に埋め込まれた人工網膜チップにおいて外界からの光を適切に受光することが可能となった。これらを組み合わせて、人工網膜チップ動作に悪影響を与えない一体化集積技術を確立し、網膜下刺激人工網膜モジュールの電気特性の取得にも成功した。
(2)眼球内で長期間安全に動作する超低消費電力人工網膜LSI回路技術
1300画素の感度切替型光電変換回路チップと近傍4画素ラプラシアン法を用いた視覚情報処理回路チップの設計、及びファウンドリによるチップ試作を行った。人の眼球における明暗感度を忠実に再現する回路を検討するとともに、使用環境に応じた感度手動切替型の高感度受光回路の設計を行った。試作チップを評価した結果、仕様を満たす感度曲線が得られることを確認した。また、4近傍ラプラシアンフィルタを用いた完全埋め込み型人工網膜のためのエッジ強調回路を設計した。画素回路面積は75μm角、画素数は約1300である。試作チップを評価した結果、視覚情報のエッジを強調する十分な性能を確認した。この回路を実装した人工網膜により失明患者に高いQOLを提供することが可能である。
(3)眼球内埋め込みモジュールの生物・臨床評価
今年度開発した網膜下刺激人工網膜モジュールを眼球内に埋め込む術式を確立した。透明ガイドを用いることで眼球に大きなダメージを与えることなく網膜下へのモジュール挿入を可能とした。網膜下へ埋め込むことで、従来使用していた金属タックを使用せずに人工網膜モジュールの固定が可能となった。また、網膜下に埋め込んだPEDOT刺激電極から網膜刺激を行い、EEPの取得にも成功した。

Report

(2 results)
  • 2011 Annual Research Report
  • 2010 Annual Research Report
  • Research Products

    (37 results)

All 2012 2011 2010

All Journal Article (5 results) (of which Peer Reviewed: 5 results) Presentation (32 results)

  • [Journal Article] Evaluation of Cu Diffusion from Cu Through-Silicon Via (TSV) in 3-D LSI by Transient Capacitance Measurement2011

    • Author(s)
      J-C.Bea, K.W.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
    • Journal Title

      IEEE Electron Device Letters

      Volume: Volume 32 Issue: 7 Pages: 940-942

    • DOI

      10.1109/led.2011.2141109

    • Related Report
      2011 Annual Research Report
    • Peer Reviewed
  • [Journal Article] シリコンバンプ上に積層した薄化チップの曲げ応力とデバイス特性評価2011

    • Author(s)
      木野久志, マリアッパン ムルゲサン, 小島俊哉, 福島誉史, 田中徹, 小柳光正
    • Journal Title

      電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)

      Volume: Vol.J94-C Pages: 411-418

    • NAID

      110008761544

    • Related Report
      2011 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 三次元チップ積層のための電解めっきと蒸着法を用いた高密度Cu/Snマイクロバンプ形成技術2011

    • Author(s)
      大原悠希, 乗木暁博, 李康旭, 福島誉史, 田中徹, 小柳光正
    • Journal Title

      電子情報通信学会論文誌C(電子デバイスの高速・高密度実装とインテグレーション技術論文特集)

      Volume: Vol.J94-C Pages: 394-401

    • NAID

      110008761542

    • Related Report
      2011 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Evaluation of Cu Contamination at Backside Surface of Thinned Wafer in 3-D Integration by Transient-Capacitance Measurement2011

    • Author(s)
      Jichel Bea
    • Journal Title

      IEEE ELECTRON DEVICE LETTERS

      Volume: Vol.32 Pages: 66-68

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Wafer Thinning, Bonding, and Interconnects Induced Local Strain/Stress in 3D-LSIs with Fine-Pitch High-Density Microbumps and Through-Si Vias2010

    • Author(s)
      M.Murugesan
    • Journal Title

      Technical Digest of International Electron Devices Meeting 2010

      Pages: 30-33

    • Related Report
      2010 Annual Research Report
    • Peer Reviewed
  • [Presentation] Fabrication Process Development in Three Dimensional Retinal Prothesis Chip for Subretinal Stimulation2012

    • Author(s)
      Yuki Ohara, Yoshitomo Watanabe, Tetsu Tanaka
    • Organizer
      18th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre
    • Place of Presentation
      Sendai, Japan
    • Year and Date
      2012-03-05
    • Related Report
      2011 Annual Research Report
  • [Presentation] High-Endurance SPRAM for Fully Implantable Retinal Prosthesis2012

    • Author(s)
      Hisashi Kino, Tetsu Tanaka
    • Organizer
      18th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre
    • Place of Presentation
      Sendai, Japan
    • Year and Date
      2012-03-05
    • Related Report
      2011 Annual Research Report
  • [Presentation] Development of Fully Implantable Retinal Prosthesis with 3-Dimensionally Stacked LSI2012

    • Author(s)
      Tetsu Tanaka
    • Organizer
      18th International Symposium of Tohoku University Global COE Programme Global Nano-Biomedical Engineering Education and Research Network Centre
    • Place of Presentation
      Sendai, Japan
    • Year and Date
      2012-03-05
    • Related Report
      2011 Annual Research Report
  • [Presentation] High Density Cu-TSVs and Reliability Issues2012

    • Author(s)
      M.Murugesan, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC) 2011
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      2012-02-02
    • Related Report
      2011 Annual Research Report
  • [Presentation] W/Cu TSVs for 3D-LSI with Minimum Thermo-Mechanical Stress2012

    • Author(s)
      M.Murugesan, H.Hashiguchi, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC) 2011
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      2012-02-02
    • Related Report
      2011 Annual Research Report
  • [Presentation] Novel Detachable Bonding Process with Wettability Control of Bonding Surface for Versatile Chip-Level 3D Integration2012

    • Author(s)
      Y.Ohara, K.-W.Lee, T.Fukushima, T.Tanaka, M.Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC) 2011
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      2012-02-01
    • Related Report
      2011 Annual Research Report
  • [Presentation] Temporary Bonding Strength Control for Self-Assembly-Based 3D Integration2012

    • Author(s)
      Takafumi Fukushima, Yuki Ohara, Jicheol Bea, Mariappan Murugesan, Kang-Wook Lee, Tetsu Tanaka, Mitsumasa Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC) 2011
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      2012-02-01
    • Related Report
      2011 Annual Research Report
  • [Presentation] A Very Low Area ADC for 3-D Stacked CMOS Image Processing System2012

    • Author(s)
      K.Kiyoyama, K.W.Lee, T.Fukushima, H.Naganuma, H.Kobayashi, T.Tanaka, M.Koyanagi
    • Organizer
      IEEE International 3D System Integration Conference (3DIC) 2011
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      2012-02-01
    • Related Report
      2011 Annual Research Report
  • [Presentation] Novel Current Mode Edge Detection for High Accuracy Visual Recognition in Retinal prosthesis2011

    • Author(s)
      Hideki Naganuma, Kouji Kiyoyama, Ryuta Nakazawa, Tetsu Tanaka
    • Organizer
      5th East Asian Pacific Student Workshop on Nano-Biomedical Engineering
    • Place of Presentation
      National University of Singapore, Singapore
    • Year and Date
      2011-12-14
    • Related Report
      2011 Annual Research Report
  • [Presentation] Development of Flexible Cable Electrode for Biosignal Recording Elicited from Optical/Electrical Stimulation in Retinal Prosthesis2011

    • Author(s)
      Chikashi Kigure, Yoshitomo Watanabe, Tetsu Tanaka
    • Organizer
      5th East Asian Pacific Student Workshop on Nano-Biomedical Engineering
    • Place of Presentation
      National University of Singapore, Singapore
    • Year and Date
      2011-12-13
    • Related Report
      2011 Annual Research Report
  • [Presentation] High Density 3D LSI Technology using W/Cu Hybrid TSVs2011

    • Author(s)
      M.Murugesan, H.Kino, A.Hashiguchi, C.Miyazaki, H.Shimamoto, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
    • Organizer
      IEEE International Electron Devices Meeting (IEDM2011)
    • Place of Presentation
      WashingtonD.C, USA
    • Year and Date
      2011-12-05
    • Related Report
      2011 Annual Research Report
  • [Presentation] Evaluation of Thermo-Mechanical Stress Induced by W-TSVs in 3D-LSI with W/Cu Hybrid TSVs2011

    • Author(s)
      H.Hashiguchi, M.Murugesan, J.C.Bea, K.W.Lee, T.Fukushima, H.Kobayashi, T.Tanaka, M.Koyanagi
    • Organizer
      2011 International Conference on Solid State Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya, Japan
    • Year and Date
      2011-09-30
    • Related Report
      2011 Annual Research Report
  • [Presentation] Thinning Process Induced Surface Defects in Ultra-Thin Si Wafer2011

    • Author(s)
      M.Murugesan, H.Nohira, C.Miyazaki, H.Shimamoto, H.Kobayashi, T.Fukushima, T.Tanaka, M.Koyanagi
    • Organizer
      2011 International Conference on Solid state Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya, Japan
    • Year and Date
      2011-09-29
    • Related Report
      2011 Annual Research Report
  • [Presentation] Development of Pillar-Shaped Stimulus Electrode Array for High Efficient Stimulation of Fully Implantable Retinal Prosthesis2011

    • Author(s)
      Yoshitomo Watanabe, Chikashi Kigure, Kangwook Lee, Takafumi Fukushima, Mitsumasa Koyanagi, Tetsu Tanaka
    • Organizer
      2011 International Conference on Solid State Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya, Japan
    • Year and Date
      2011-09-29
    • Related Report
      2011 Annual Research Report
  • [Presentation] Impacts of Microbump-Induced Local Bending Stress in 3D-LSI2011

    • Author(s)
      H.Kino, M.Murugesan, K.-W.Lee, J.-C.Bea, C.Miyazaki, H.Kobayashi, H.Shimamoto, T.Fukushima, T.Tanaka, M.Koyanagi
    • Organizer
      2011 International Conference on Solid State Devices and Materials (SSDM2011)
    • Place of Presentation
      Nagoya, Japan
    • Year and Date
      2011-09-29
    • Related Report
      2011 Annual Research Report
  • [Presentation] 三次元積層時の局所応力がMOSFETの特性に与える影響2011

    • Author(s)
      木野久志, Murugesan Mariappan, Jichel Bea, 李康旭, 福島誉史, 小柳光正, 田中徹
    • Organizer
      2011年秋季第72回応用物理学会学術講演会
    • Place of Presentation
      山形大学,山形
    • Year and Date
      2011-09-01
    • Related Report
      2011 Annual Research Report
  • [Presentation] 光・電気刺激に対する網膜応答記録用フレキシブルケーブル電極の作製2011

    • Author(s)
      木暮爾, 渡辺慶朋, 笹木悠一郎, 李康旭, 福島誉史, 小柳光正, 田中徹
    • Organizer
      2011年秋季第72回応用物理学会学術講演会
    • Place of Presentation
      山形大学,山形
    • Year and Date
      2011-08-30
    • Related Report
      2011 Annual Research Report
  • [Presentation] 電極間クロストークを抑制した人工網膜用ピラー型刺激電極アレイの開発2011

    • Author(s)
      渡辺慶朋, 木暮爾, 李康旭, 福島誉史, 小柳光正, 田中徹
    • Organizer
      2011年秋季第72回応用物理学会学術講演会
    • Place of Presentation
      山形大学,山形
    • Year and Date
      2011-08-30
    • Related Report
      2011 Annual Research Report
  • [Presentation] 3D LSI Technology and Reliability Issues2011

    • Author(s)
      T.Tanaka, J.Bea, M.Murugesan, K.Lee, T.Fukushima, M.Koyanagi
    • Organizer
      2011 Symposium on VLSI Technology
    • Place of Presentation
      Kyoto, Japan(招待)
    • Year and Date
      2011-06-16
    • Related Report
      2011 Annual Research Report
  • [Presentation] Development of 5 μm Diameter Backside Cu TSV Technology for 3D LSI2011

    • Author(s)
      Yuki Ohara, Yoshitomo Watanabe, Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi
    • Organizer
      International Conference on Electronics Packaging 2011 (ICEP2011)
    • Place of Presentation
      Nara, Japan
    • Year and Date
      2011-04-14
    • Related Report
      2011 Annual Research Report
  • [Presentation] Development of Fully Implantable Retinal Prosthesis with 3-Dimensionally Stacked LSI2011

    • Author(s)
      Yoshitomo Watanabe
    • Organizer
      The 1st Tohoku International Symposium on Multidisciplinary Neuroscience
    • Place of Presentation
      Sendai, Japan
    • Year and Date
      2011-01-21
    • Related Report
      2010 Annual Research Report
  • [Presentation] Development of Fine Sized Cu Through-Si Via Technology for Three-Dimensional Stacked Retinal Prosthesis Chip2010

    • Author(s)
      Y.Ohara
    • Organizer
      4th East Asian Pacific Student Workshop on Nano-Biomedical Engineering
    • Place of Presentation
      Singapore
    • Year and Date
      2010-12-15
    • Related Report
      2010 Annual Research Report
  • [Presentation] Impact of Microbump Induced Stress in Thinned 3D-1SIs after Wafer Bonding2010

    • Author(s)
      M.Murugesan
    • Organizer
      IEEE International 3D System Integration Conference 2010 (3DIC2010)
    • Place of Presentation
      Munich, Germany
    • Year and Date
      2010-11-17
    • Related Report
      2010 Annual Research Report
  • [Presentation] A Block-Parallel Signal Processing System for CMOS Image Sensor with Three-Dimenional Structure2010

    • Author(s)
      K.Kiyoyama
    • Organizer
      IEEE International 3D System Integration Conference 2010 (3DIC2010)
    • Place of Presentation
      Munich, Germany
    • Year and Date
      2010-11-16
    • Related Report
      2010 Annual Research Report
  • [Presentation] Metal micro-bump induced stress in3D-LSIs_micro-Raman Study2010

    • Author(s)
      M.Murugesan
    • Organizer
      The 2010 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2010-09-24
    • Related Report
      2010 Annual Research Report
  • [Presentation] Evaluation of Copper Diffusion in Thinned Wafer with Extrinsic Gettering for 3D-LSI by Capacitance-Time (C-t) measurement2010

    • Author(s)
      J.-C.Bea
    • Organizer
      The 2010 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2010-09-24
    • Related Report
      2010 Annual Research Report
  • [Presentation] Development of Versatile Backside Via Technology for 3D System on Chip2010

    • Author(s)
      Y.Ohara
    • Organizer
      The 2010 International Conference on Solid State Devices and Materials
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2010-09-23
    • Related Report
      2010 Annual Research Report
  • [Presentation] LSI積層による曲げ応力がデバイス特性に与える影響に関する研究2010

    • Author(s)
      木野久志
    • Organizer
      第71回応用物理学会学術講演会
    • Place of Presentation
      長崎大学(長崎)
    • Year and Date
      2010-09-15
    • Related Report
      2010 Annual Research Report
  • [Presentation] Circuit Design Optimization of Retinal Prosthesis Chip to Achieve Adequate Light Sensitivity for ADLs2010

    • Author(s)
      Yoshiho Yukita
    • Organizer
      14th International Symposium of Tohoku University Global COE Programme "GlobalNano-Biomedical Engineering Education and Research Network Centre"
    • Place of Presentation
      Korea Institute of Science and Technology (KIST), Seoul, Korea
    • Year and Date
      2010-08-31
    • Related Report
      2010 Annual Research Report
  • [Presentation] Electrically-Evoked Potential Evaluation of In-vivo Experiments with Implanted Retinal Prosthesis Chip2010

    • Author(s)
      Tetsu Tanaka
    • Organizer
      14th International Symposium of Tohoku University Global COE Programme "GlobalNano-Biomedical Engineering Education and Research Network Centre"
    • Place of Presentation
      Korea Institute of Science and Technology (KIST), Seoul, Korea
    • Year and Date
      2010-08-31
    • Related Report
      2010 Annual Research Report
  • [Presentation] 機能性高分子を用いた次世代集積回路の作製技術と人工網膜への応用2010

    • Author(s)
      福島誉史
    • Organizer
      第55回高分子夏季大学
    • Place of Presentation
      秋保温泉岩沼屋(仙台)
    • Year and Date
      2010-07-14
    • Related Report
      2010 Annual Research Report
  • [Presentation] 3D-LSI/TSVの技術動向と新領域への展開2010

    • Author(s)
      田中徹
    • Organizer
      Semi Forum Japan 2010 TSV/3次元実装セミナー
    • Place of Presentation
      グランキューブ大阪
    • Year and Date
      2010-06-01
    • Related Report
      2010 Annual Research Report

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Published: 2010-08-23   Modified: 2016-04-21  

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