Innovative 3D Design for the New Generation Vector Microarchitecture
| Project/Area Number |
22300013
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Computer system/Network
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| Research Institution | Tohoku University |
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Principal Investigator |
KOBAYASHI Hiroaki 東北大学, サイバーサイエンスセンター, 教授 (40205480)
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| Co-Investigator(Renkei-kenkyūsha) |
TAKIZAWA Hiroyuki 東北大学, 大学院・情報科学研究科, 准教 授 (70323996)
EGAWA Ryusuke 東北大学, サイバーサイエンスセンター, 助教 (80374990)
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| Project Period (FY) |
2010 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
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| Budget Amount *help |
¥17,940,000 (Direct Cost: ¥13,800,000、Indirect Cost: ¥4,140,000)
Fiscal Year 2012: ¥6,370,000 (Direct Cost: ¥4,900,000、Indirect Cost: ¥1,470,000)
Fiscal Year 2011: ¥6,630,000 (Direct Cost: ¥5,100,000、Indirect Cost: ¥1,530,000)
Fiscal Year 2010: ¥4,940,000 (Direct Cost: ¥3,800,000、Indirect Cost: ¥1,140,000)
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| Keywords | 計算機アーキテクチャ / 3次元集積技術 / ベクトルアーキテクチャ / 3次元実装技術 / 3次元プロセッサアーキテクチャ / ベクトルプロセッサ / オンチップベクトルキャッシュ / 高性能計算 / 3次元積層技術 / コンピュータアーキテクチャ |
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| Research Abstract |
This study discusses a new design methodology for a microarchitecture of next-generation, low-power high-performance vector processors by using 3D die-stacking technology. A strategy for mixed design of conventional 2D design and TSV (Through-Silicon-Via)-based 3D design that realizes a good trade-off between them in the all level of on-chip units design has also been proposed. Through the performance evaluation of a prototyped 3D vector processor, the effectiveness of 3D design regarding power consumption and performance has been clarified.
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Report
(4 results)
Research Products
(70 results)
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[Presentation] Designing a 3D stacked Vector Cache2012
Author(s)
Ryusuke Egawa, Yusuke Endo, Jubee Tada, Hiroyuki Takizawa, Gensuke Goto, Hiroaki Kobayashi
Organizer
DATE 2012 Workshop on 3D Integration-Application, Technology, Architecture, Automation and Tests
Place of Presentation
Dresden, Germany
Year and Date
2012-03-16
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[Book] Resch, M.; Wang, X.; Focht, E.; Kobayashi, H.; Roller, S.2012
Author(s)
Resch, M.; Wang, X.; Focht, E.; Kobayashi, H.; Roller, S.
Total Pages
194
Publisher
Springer
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