A Study on education system for packaging reliability of next generation Sic power device.
| Project/Area Number |
22360047
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Yokohama National University |
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Principal Investigator |
YU Qiang 横浜国立大学, 大学院・工学研究院, 教授 (80242379)
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| Co-Investigator(Kenkyū-buntansha) |
SHIBUTANI Tadahiro 横浜国立大学, 環境情報研究院, 准教授 (10332644)
SHIRATORI Masaki 横浜国立大学, 安心・安全の科学教育センター, 特任教授 (60017986)
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| Project Period (FY) |
2010 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
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| Budget Amount *help |
¥18,850,000 (Direct Cost: ¥14,500,000、Indirect Cost: ¥4,350,000)
Fiscal Year 2012: ¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
Fiscal Year 2011: ¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2010: ¥10,010,000 (Direct Cost: ¥7,700,000、Indirect Cost: ¥2,310,000)
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| Keywords | 疲労 / 接合技術 / 信頼性 / 計算力学 |
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| Research Abstract |
A new evaluation system for next generation SiC power device was established. The new experimental measurement method and the reliability evaluation approach have been proposed for the new Ag nano joints. And a new simulation system considering the fatigue process has been developed to assess the reliability behavior of the power modules.
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Report
(4 results)
Research Products
(51 results)
