| Budget Amount *help |
¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000)
Fiscal Year 2012: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2011: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Fiscal Year 2010: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
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| Research Abstract |
In this study, the pure copper film of 100μm thickness with a 0.5mm notch hole was fatigued and the fatigue damage such as a slip initiation was observed. Moreover, a misorientation and a misorientation axis were computed from crystal orientation matrices obtained by using the EBSD (Electron Backscatter Diffraction) method. As a result, a misorientation angle increased with fatigue testing in almost all the grains of the copper film. In the crystal grain in which slip lines are generated, misorientation axes are inclined to the same direction by fatigue testing, while those turn to a scattering directions for the static loading. From the change of a misorientation axis element, the misorientation axes are inclined toward the transverse direction to the loading direction and in face of the film. Subsequently, the axes tended to the loading direction and the slip lines were initiated.
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