| Budget Amount *help |
¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000)
Fiscal Year 2012: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2011: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2010: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
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| Research Abstract |
Ultra-fine copper (Cu) interconnects used for integrated circuit are composed with fine crystal Cu grains. In this study, new annealing methods for enlargingthe grain sizes which lead to less scattering of electrons at the grain boundaries and the reduction of interconnect resistance. It was found that annealing in supercritical fluid (SC annealing) or under current stress (EM annealing) can enhance the grain growth by cleaning effect of supercritical fluids on Cu surfaces and electromigration (EM) effect, respectively. It was also found that an anisotropic grain growth along the current direction was obtained by EM effect with EM annealing. The obtained results will lead to the reduction of interconnect resistance and improved reliability.
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