Environmental application of novel surface treatment method for electronic packaging
| Project/Area Number |
22681009
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| Research Category |
Grant-in-Aid for Young Scientists (A)
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| Allocation Type | Single-year Grants |
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| Research Field |
Environmental technology/Environmental materials
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| Research Institution | Tohoku University |
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Principal Investigator |
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| Project Period (FY) |
2010 – 2011
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| Project Status |
Completed (Fiscal Year 2011)
|
| Budget Amount *help |
¥26,000,000 (Direct Cost: ¥20,000,000、Indirect Cost: ¥6,000,000)
Fiscal Year 2011: ¥7,540,000 (Direct Cost: ¥5,800,000、Indirect Cost: ¥1,740,000)
Fiscal Year 2010: ¥18,460,000 (Direct Cost: ¥14,200,000、Indirect Cost: ¥4,260,000)
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| Keywords | 環境技術 / 環境材料 / 環境負荷低減 / ハロゲン / はんだ |
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| Research Abstract |
In this research, the idea based on lowering the amount of oxidized layer and stabilizing the surface of solder particle was introduced into the development of new type of halogen-free solder paste. Oxide layer of solder particles were removed and little amount of halogen (5 times lower than 900ppm)were remained on the surface of solder particles. Solder paste, synthesized by treated powder and non-halogen surfactant, showed excellent performance for integration, regardless halogen content was 70-180ppm. Reaction mechanism was also investigated and it was applied to establish for another metallic nano particles paste.
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Report
(3 results)
Research Products
(19 results)
