Interface structures and bonding strength between metallic glass thin films and substrates towards MEMS applications.
| Project/Area Number |
22760552
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Single-year Grants |
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| Research Field |
Material processing/treatments
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| Research Institution | Tohoku University |
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Principal Investigator |
LIU Yanhui 東北大学, 原子分子材料科学高等研究機構, 助教 (70506469)
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| Project Period (FY) |
2010 – 2011
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| Project Status |
Completed (Fiscal Year 2011)
|
| Budget Amount *help |
¥4,160,000 (Direct Cost: ¥3,200,000、Indirect Cost: ¥960,000)
Fiscal Year 2011: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2010: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
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| Keywords | 金属ガラス / 薄膜 / MEMS |
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| Research Abstract |
With the financial support, the parameters that affect the growth and bonding film are found, which are very helpful for the fabrication of MEMS devices and processing of the metallic glass films. The mechanical properties of the films are characterized by using nanoindentation. By employing the atomic force microscopy, the metallic glass is revealed to be inhomogeneous on scale of ~ 2. 5 nm, which is consistent with many glass models and theories.
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Report
(3 results)
Research Products
(6 results)
