| Project/Area Number |
22KJ0667
|
|---|
| Project/Area Number (Other) |
21J22172 (2021-2022)
|
|---|
| Research Category |
Grant-in-Aid for JSPS Fellows
|
| Allocation Type | Multi-year Fund (2023)
Single-year Grants (2021-2022) |
|---|
| Section | 国内 |
|---|
| Review Section |
Basic Section 33020:Synthetic organic chemistry-related
|
|---|
| Research Institution | The University of Tokyo |
|---|
Principal Investigator |
陳 夢青 東京大学, 理学系研究科, 特別研究員(DC1)
|
|---|
| Project Period (FY) |
2023-03-08 – 2024-03-31
|
| Project Status |
Completed (Fiscal Year 2023)
|
| Budget Amount *help |
¥2,200,000 (Direct Cost: ¥2,200,000)
Fiscal Year 2023: ¥700,000 (Direct Cost: ¥700,000)
Fiscal Year 2022: ¥700,000 (Direct Cost: ¥700,000)
Fiscal Year 2021: ¥800,000 (Direct Cost: ¥800,000)
|
|---|
| Keywords | iron / oligophenylenevinylenes / tetra-annulation / spiro / Iron / optoelectronic |
|---|
| Outline of Research at the Start |
I developed environmentally benign organic synthesis using iron catalysis constructing strained complicated π-conjugated framework which provides expeditious access to a series of fused thiophene-containing molecules with high HOMO level and narrow HOMO－LUMO gap useful for narrow band gap materials.
|
| Outline of Annual Research Achievements |
Despite the great potential of organic electronic materials in revolutionizing electronics compared to traditional silicon-based counterparts, large-scale production still faces several challenges. One significant challenge is precisely controlling synthesis demands over molecular structure and properties. Constructing oligophenylenevinylene structures, pioneered by the Nakamura lab, which features a flat-strained-chemically stable framework conducive to optoelectronic applications, heavily relies on harsh conditions. In this research, by leveraging the reactivity of organoiron species to lower the activation energy of key synthetic transformations, such as 5-endo-dig cyclization, we managed to construct highly strained oligophenylenevinylenes and protocol chemical-electronic application.
|
