| Budget Amount *help |
¥51,090,000 (Direct Cost: ¥39,300,000、Indirect Cost: ¥11,790,000)
Fiscal Year 2013: ¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2012: ¥6,240,000 (Direct Cost: ¥4,800,000、Indirect Cost: ¥1,440,000)
Fiscal Year 2011: ¥40,950,000 (Direct Cost: ¥31,500,000、Indirect Cost: ¥9,450,000)
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| Research Abstract |
We developed an experimental setup for clarifying the mechanics and mechanisms of fracture in freestanding submicron-thick metallic films. This system can conduct in situ FESEM observation of deformation/fracture and EBSD crystallographic analysis on the local region at stress concentration sites such as crack tips under controlled mechanical conditions. Systematic experiments clarified the thickness effect on fracture toughness in copper nano-films where the fracture toughness decreases with a decrease in thickness, the characteristic fatigue crack growth mechanism of copper films where a fatigue crack propagates through intrusions/extrusions formed ahead of the crack tip, the presence of fatigue crack closure and the impact on the fatigue crack propagation property, and the effect of thickness on creep properties of aluminum nano-films.
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