Damage-free etching of organic materials with mesoscopic cluster beams
| Project/Area Number |
23310080
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Nanomaterials/Nanobioscience
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| Research Institution | University of Hyogo |
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Principal Investigator |
TOYODA Noriaki 兵庫県立大学, 工学(系)研究科(研究院), 准教授 (00382276)
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| Project Period (FY) |
2011-04-01 – 2014-03-31
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| Project Status |
Completed (Fiscal Year 2013)
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| Budget Amount *help |
¥18,850,000 (Direct Cost: ¥14,500,000、Indirect Cost: ¥4,350,000)
Fiscal Year 2013: ¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2012: ¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2011: ¥7,930,000 (Direct Cost: ¥6,100,000、Indirect Cost: ¥1,830,000)
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| Keywords | クラスター / 有機材料 / ナノ加工 / ダメージフリー / クラスターイオン / 有機電子材料 |
|---|
| Research Abstract |
Damage-free processing of organic materials with mesoscopic cluster ion beam was developed using pickup cell and by controlling charge state, cluster-size, and environment gas during irradiations. An in-situ XPS system connected to cluster ion beam system was used for damage evaluation of organic materials. It has been clarified that low-ionization voltage is required to suppress formation of multiply charged cluster ions. Besides, large cluster ions, and control of environment gas during irradiation is effective for low-damage processing of organic materials.
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Report
(4 results)
Research Products
(48 results)
