Control of thermal resistance over liquid-solid interfaces based on molecular energy transport mechanism
| Project/Area Number |
23360099
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| Research Category |
Grant-in-Aid for Scientific Research (B)
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| Allocation Type | Single-year Grants |
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| Section | 一般 |
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| Research Field |
Thermal engineering
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| Research Institution | Osaka University |
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Principal Investigator |
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| Project Period (FY) |
2011-04-01 – 2015-03-31
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| Project Status |
Completed (Fiscal Year 2014)
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| Budget Amount *help |
¥18,720,000 (Direct Cost: ¥14,400,000、Indirect Cost: ¥4,320,000)
Fiscal Year 2014: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Fiscal Year 2013: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
Fiscal Year 2012: ¥2,990,000 (Direct Cost: ¥2,300,000、Indirect Cost: ¥690,000)
Fiscal Year 2011: ¥11,050,000 (Direct Cost: ¥8,500,000、Indirect Cost: ¥2,550,000)
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| Keywords | 界面熱抵抗 / 固液界面 / エネルギー輸送機構 / 非平衡分子動力学 / ナノ構造 / エネルギー伝達機構 / 分子動力学解析 / ナノ粒子 |
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| Outline of Final Research Achievements |
In order to develop technology to reduce thermal resistance over a liquid-solid interface and to predict variation of interfacial thermal resistance by structures at nanometer-precision, influences of structures at nanometer-precision on interfacial thermal resistance and thermal energy transport mechanisms at a liquid-solid interface are investigated directly by non-equilibrium classical molecular dynamics simulations. The thermal energy transport mechanism at a liquid-solid interface varies depending on the structure geometry at the nanometer scale and the liquid-solid interaction intensity, which causes changes in the interfacial thermal resistances that are quantitatively evaluated in the present study.
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Report
(5 results)
Research Products
(40 results)
