A Low-Temperature Bonding Process Using Nanoparticles Derived from Reduction Reaction and Its Application to Micro Joining
| Project/Area Number |
23360322
|
|---|
| Research Category |
Grant-in-Aid for Scientific Research (B)
|
| Allocation Type | Single-year Grants |
|---|
| Section | 一般 |
|---|
| Research Field |
Material processing/treatments
|
|---|
| Research Institution | Osaka University |
|---|
Principal Investigator |
HIROSE Akio 大阪大学, 工学(系)研究科(研究院), 教授 (70144433)
|
|---|
| Co-Investigator(Kenkyū-buntansha) |
SANO Tomokazu 大阪大学, 大学院・工学研究科, 准教授 (30314371)
OGURA Tomo 大阪大学, 大学院・工学研究科, 助教 (90505984)
|
|---|
| Project Period (FY) |
2011-04-01 – 2014-03-31
|
| Project Status |
Completed (Fiscal Year 2013)
|
| Budget Amount *help |
¥17,940,000 (Direct Cost: ¥13,800,000、Indirect Cost: ¥4,140,000)
Fiscal Year 2013: ¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000)
Fiscal Year 2012: ¥6,370,000 (Direct Cost: ¥4,900,000、Indirect Cost: ¥1,470,000)
Fiscal Year 2011: ¥7,020,000 (Direct Cost: ¥5,400,000、Indirect Cost: ¥1,620,000)
|
|---|
| Keywords | 接合 / ナノ材料 / 界面制御 / 焼結 / 還元反応 / 有機溶剤 / 実装 / 材料加工・処理 / 高密度実装 / 材料加工処理 |
|---|
| Research Abstract |
We have developed a low-temperature bonding process utilizing low-temperature sintering ability of nanoparticles derived from reducing metallic oxides, such as the silver oxide, by organic solvents. Gold, copper, nickel and aluminum can be bonded using this bonding process. Gold having no surface oxide layer has been directly bonded by sintered silver particles. In copper and nickel, bonding has been accomplished after reducing their natural oxides layers by the organic solvents during bonding process. Bonding of aluminum has been achieved through its natural oxide layer, which cannot be reduced by the organic solvents. Bondability of copper has been improved by applying a paste made by mixing the copper oxide with the silver oxide to an adequate ratio.
|
Report
(4 results)
Research Products
(54 results)
