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Development and Application of Multi-scale Simulation System for the Fabrication of Through Silicon Via

Research Project

Project/Area Number 23560067
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Engineering fundamentals
Research InstitutionKyoto University

Principal Investigator

KANEKO Yutaka  京都大学, 情報学研究科, 助教 (00169583)

Project Period (FY) 2011 – 2013
Project Status Completed (Fiscal Year 2013)
Budget Amount *help
¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2013: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2012: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2011: ¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000)
Keywordsシリコン貫通電極 / 動的モンテカルロ法 / 空孔 / 添加剤 / パルスめっき / 攪拌 / モンテカルロシミュレーション / 電気化学 / めっき
Research Abstract

Through silicon via (TSV) is a promising technique to realize short connects among the stacked chips in three dimensional packaging in microelectronics, which would reduce signal delays to allow high-density and high-speed performance. The crucial point in TSV technology is to fill high aspect ratio via holes without creating voids. In this work we studied the optimal conditions for TSV filling by using kinetic Monte Carlo simulation. In copper electrodeposition, four kinds of additives are included. We have performed a series of simulations for various deposition conditions by changing additive concentrations and current patterns. We found optimal conditions of additive concentrations and current patterns, and obtained a lot of results on the mechanism of TSV filling. These results corresponds to experiments and are expected to contribute to TSV technology.

Report

(4 results)
  • 2013 Annual Research Report   Final Research Report ( PDF )
  • 2012 Research-status Report
  • 2011 Research-status Report
  • Research Products

    (19 results)

All 2013 2012 2011

All Journal Article (6 results) (of which Peer Reviewed: 2 results) Presentation (13 results) (of which Invited: 1 results)

  • [Journal Article] Kinetic Monte Carlo Simulation of Three-dimensional Shape Evolution using Solid-by-Solid Model : Application to Via and Trench Filling2013

    • Author(s)
      Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
    • Journal Title

      Electrochimica Acta

      Volume: 100 Pages: 321-328

    • Related Report
      2013 Final Research Report
  • [Journal Article] Synergistic Effects of Additives on the Filling Process of High-Aspect-Ratio TSV - Kinetic Monte Carlo Simulation2013

    • Author(s)
      Y. Fukiage, Y. Kaneko, T. Hayashi, K. Kondo, K. Ohara and F. Asa
    • Journal Title

      ECS Transaction - Honolulu, USA

      Volume: 50(32) Pages: 41-55

    • Related Report
      2013 Final Research Report
  • [Journal Article] Synergistic Effects of Additives on the Filling Process of High-Aspect-Ratio TSV - Kinetic Monte Carlo Simulation2013

    • Author(s)
      吹上悠貴、金子豊、林太郎、近藤和夫、小原勝彦、浅富士夫
    • Journal Title

      ECS Transaction

      Volume: 50(32) Issue: 32 Pages: 321-328

    • DOI

      10.1149/05032.0041ecst

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Kinetic Monte Carlo simulation of three-dimensional shape evolution using Solid-by-Solid model: Application to via and trench filling2013

    • Author(s)
      金子豊、樋渡保秋、小原勝彦、浅富士夫
    • Journal Title

      Electrochimica Acta

      Volume: 100C Pages: 321-328

    • DOI

      10.1016/j.electacta.2013.01.076

    • Related Report
      2012 Research-status Report
    • Peer Reviewed
  • [Journal Article] Multi-Scale Kinetic Monte Carlo Simulation of Electrodeposition and Its Application to Industries2011

    • Author(s)
      Y. Kaneko, Y. Hiwatari, K. Ohara and Asa
    • Journal Title

      Advances in Applied Surface Engineering, (Research Publishing, Singapore)

      Pages: 102-109

    • Related Report
      2013 Final Research Report
  • [Journal Article] Kinetic Monte Carlo Approach to the Effects of Additives in Electrodeposition2011

    • Author(s)
      Y. Kaneko, Y. Hiwatari, K. Ohara and Asa
    • Journal Title

      ECS Transaction - Montreal, CANADA

      Volume: 35(27) Pages: 7-12

    • Related Report
      2013 Final Research Report
  • [Presentation] Kinetic Monte Carlo Simulation of Filling High Aspect-Ratio Through Silicon Via II2013

    • Author(s)
      Y. Fukiage, Y. Kaneko, T. Hayashi, K. Kondo, K. Ohara and F. Asa
    • Organizer
      The 224th Meeting of the Electrochemical Society
    • Place of Presentation
      San Francisco (USA)
    • Year and Date
      2013-10-29
    • Related Report
      2013 Annual Research Report 2013 Final Research Report
  • [Presentation] Synergistic Effects of Additives on the Filling Process of High-Aspect-Ratio TSV - Kinetic Monte Carlo Simulation -2012

    • Author(s)
      Y. Fukiage, Y. Kaneko, T. Hayashi, K. Kondo, K. Ohara and F. Asa
    • Organizer
      The 222th Meeting of the Electrochemical Society (PRiME2012)
    • Place of Presentation
      Honolulu (USA)
    • Year and Date
      2012-10-09
    • Related Report
      2013 Final Research Report
  • [Presentation] Multi-Scale Simulation of Synergistic Effects of Additives in Damascene Electroplating2012

    • Author(s)
      Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
    • Organizer
      The 221th Meeting of the Electrochemical Society
    • Place of Presentation
      Seattle (USA)
    • Year and Date
      2012-05-07
    • Related Report
      2013 Final Research Report 2012 Research-status Report
  • [Presentation] Synergistic Effects of Additives on the Filling Process of High-Aspect-Ratio TSV - Kinetic Monte Carlo Simulation -2012

    • Author(s)
      吹上悠貴、金子豊、林太郎、近藤和夫、小原勝彦、浅富士夫
    • Organizer
      Pecific Rim Meeting on Electrochemical and Solid-State Science
    • Place of Presentation
      Honolulu (USA)
    • Related Report
      2012 Research-status Report
  • [Presentation] 動的モンテカルロ法によるLSI配線用銅めっきの分子シミュレーション2012

    • Author(s)
      金子豊
    • Organizer
      電子材料めっき研究会
    • Place of Presentation
      大阪府立大学
    • Related Report
      2012 Research-status Report
    • Invited
  • [Presentation] Kinetic Monte Carlo Simulation of Filling High Aspect-Ratio Through Silicon Via2011

    • Author(s)
      Y. Fukiage, Y. Kaneko, K. Ohara and F. Asa
    • Organizer
      The 220th Meeting of the Electrochemical Society
    • Place of Presentation
      Boston (USA)
    • Year and Date
      2011-10-11
    • Related Report
      2013 Final Research Report
  • [Presentation] Multi-Scale Simulation System for Electrochemical Nucleation and Growth : Application to Device Fabrication2011

    • Author(s)
      Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
    • Organizer
      International Symposium on Renewable Energy and Materials Tailoring
    • Place of Presentation
      京都市
    • Year and Date
      2011-09-19
    • Related Report
      2013 Final Research Report
  • [Presentation] Kinetic Monte Carlo Simulation System for Electrochemical Fabrication of 3D Micro-Architectures2011

    • Author(s)
      Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
    • Organizer
      The 62nd Annual Meeting of the International Society of Electrochemistry
    • Place of Presentation
      新潟市
    • Year and Date
      2011-09-14
    • Related Report
      2013 Final Research Report
  • [Presentation] めっきによるシリコン貫通電極作成のモンテカルロシミュレーション2011

    • Author(s)
      吹上悠貴、金子豊,小原勝彦,浅富士夫
    • Organizer
      電気化学会秋季大会
    • Place of Presentation
      新潟市
    • Year and Date
      2011-09-09
    • Related Report
      2013 Final Research Report
  • [Presentation] Kinetic Monte Carlo Approach to the Effects of Additives in Electrodeposition2011

    • Author(s)
      Y. Kaneko, Y. Hiwatari, K. Ohara and F. Asa
    • Organizer
      The 219th Meeting of the Electrochemical Society
    • Place of Presentation
      Montreal (Canada)
    • Year and Date
      2011-05-03
    • Related Report
      2013 Final Research Report
  • [Presentation] めっきによるシリコン貫通電極「作成のモンテカルロシミュレーション2011

    • Author(s)
      吹上悠貴
    • Organizer
      2011年電気化学会秋季大会
    • Place of Presentation
      朱鷺メッセ(新潟市)
    • Related Report
      2011 Research-status Report
  • [Presentation] Kinetic Monte Carlo Simulation of Filling High-Aspect-Ratio Through Silicon Via2011

    • Author(s)
      金子豊
    • Organizer
      220th ECS Meeting
    • Place of Presentation
      Boston (USA)
    • Related Report
      2011 Research-status Report
  • [Presentation] Multi-Scale Simulation System for Electrochemical Nucleation and Growth : Application to Device Fabrications2011

    • Author(s)
      金子豊
    • Organizer
      International Symposium on Renewable Energy and Materials Tailoring
    • Place of Presentation
      京都大学(京都市)
    • Related Report
      2011 Research-status Report

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Published: 2011-08-05   Modified: 2019-07-29  

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