| Budget Amount *help |
¥5,330,000 (Direct Cost: ¥4,100,000、Indirect Cost: ¥1,230,000)
Fiscal Year 2013: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2012: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2011: ¥2,860,000 (Direct Cost: ¥2,200,000、Indirect Cost: ¥660,000)
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| Research Abstract |
I studied the effects of the electrical discharge, the water pulsejet and the ultrasonic wave on the cutting processing by using the fixed grain type diamond saw wires of 100-200 micrometers diameter. Moreover, I tried to improve the mechanical properties of diamond saw wire itself. As a result, cutting speed can be improved into about 5 times by the size of a diamond grain being 30 micrometers from 10 micrometers. Furthermore, cutting speed was able to be further raised 30% by adding an ultrasonic wave and carrying out hybrid processing.
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