Hybrid Machining by Micro Saw Wire Bonded with Diamond Grains using Metal Solder
Project/Area Number |
23560113
|
Research Category |
Grant-in-Aid for Scientific Research (C)
|
Allocation Type | Multi-year Fund |
Section | 一般 |
Research Field |
Production engineering/Processing studies
|
Research Institution | Akita University |
Principal Investigator |
KAMIYA Osamu 秋田大学, 工学(系)研究科(研究院), 教授 (60113891)
|
Project Period (FY) |
2011 – 2013
|
Project Status |
Completed (Fiscal Year 2013)
|
Budget Amount *help |
¥5,330,000 (Direct Cost: ¥4,100,000、Indirect Cost: ¥1,230,000)
Fiscal Year 2013: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2012: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2011: ¥2,860,000 (Direct Cost: ¥2,200,000、Indirect Cost: ¥660,000)
|
Keywords | ダイヤモンドソーワイヤ / 固定砥粒 / 金属ろう材 / ハイブリッド加工 / 放電加工 / ジェット水流 / 超音波 / ダイヤモンド形状 / ハイブリッド / ジェット流 / 固定砥粒型 / 切断加工 |
Research Abstract |
I studied the effects of the electrical discharge, the water pulsejet and the ultrasonic wave on the cutting processing by using the fixed grain type diamond saw wires of 100-200 micrometers diameter. Moreover, I tried to improve the mechanical properties of diamond saw wire itself. As a result, cutting speed can be improved into about 5 times by the size of a diamond grain being 30 micrometers from 10 micrometers. Furthermore, cutting speed was able to be further raised 30% by adding an ultrasonic wave and carrying out hybrid processing.
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Report
(4 results)
Research Products
(14 results)