Molecular design of copper Damascene additive which fills via by only one organic additive
| Project/Area Number |
23560872
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Osaka Prefecture University |
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Principal Investigator |
KONDO Kazuo 大阪府立大学, 工学(系)研究科(研究院), 教授 (50250478)
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| Project Period (FY) |
2011 – 2013
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| Project Status |
Completed (Fiscal Year 2013)
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| Budget Amount *help |
¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000)
Fiscal Year 2013: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2012: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2011: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
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| Keywords | めっき / 銅ダマシン / 有機添加剤 / 単一 / ｼﾞｱﾘﾙｱﾐﾝ / 有機添加物 / ジアリルアミン |
|---|
| Research Abstract |
We have found that instead of the conventional four additive, only one organic additive is effective to fill the via. Electrochemical measurements and QCM explains the filling mechanism. By newly designing the side chain we have foud the new additives. The diallylamine additive is also effective to use as the leveler for the conventional four additive.
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Report
(4 results)
Research Products
(29 results)
