Molecular design of copper Damascene additive which fills via by only one organic additive

• Project/Area Number: 23560872
• Research Category: Grant-in-Aid for Scientific Research (C)
• Allocation Type: Multi-year Fund
• Section: 一般
• Research Field: Material processing/treatments
• Research Institution: Osaka Prefecture University
• Principal Investigator: KONDO Kazuo 大阪府立大学, 工学(系)研究科(研究院), 教授 (50250478)
• Project Period (FY): 2011 – 2013
• Project Status: Completed (Fiscal Year 2013)
• Budget Amount: ¥4,810,000 (Direct Cost: ¥3,700,000、Indirect Cost: ¥1,110,000); Fiscal Year 2013: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000); Fiscal Year 2012: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000); Fiscal Year 2011: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
• Keywords: めっき / 銅ダマシン / 有機添加剤 / 単一 / ｼﾞｱﾘﾙｱﾐﾝ / 有機添加物 / ジアリルアミン

Research Abstract

We have found that instead of the conventional four additive, only one organic additive is effective to fill the via. Electrochemical measurements and QCM explains the filling mechanism. By newly designing the side chain we have foud the new additives. The diallylamine additive is also effective to use as the leveler for the conventional four additive.

Research Products

• [Journal Article] Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition (2014)
  • Author(s): Y. Yamada, K. Kondoa, M. Takeuchia, N. Okamotoa, T. Saitoa, M. Bunyab and Y. Yokoi
  • Journal Title: ECS Trans. Volume: 58 Issue: 17 Pages: 97-107
  • DOI: 10.1149/05817.0097ecst
  • Peer Reviewed
• [Journal Article] Effect of Counter Ions in a Diallylamine-type Copolymer Additive on Via-filling by Copper Electrodeposition (2014)
  • Author(s): M. Takeuchi, Y. Anami, Y. Yamada, M. Bunnya, S. Okada, N. Okamoto, T. Saito, M. Yokoi,K. Kondo
  • Journal Title: Electrochemistry Volume: in print
  • NAID: 130004562475
  • Peer Reviewed
• [Journal Article] Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition (2013)
  • Author(s): M. Takeuchi, Y.Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, and K. Kondo
  • Journal Title: J. Electrochem. Soc. Volume: 160 (12) Pages: 3110-3115
  • Peer Reviewed
• [Journal Article] Effect of Basicity of Amino Group at Side Chain in Diallylamine-Type Copolymer Additive on Via-Filling by Copper (2013)
  • Author(s): M. Takeuchi, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, and K. Kondo
  • Journal Title: ECS Volume: 160 Issue: 12 Pages: D3110-D3115
  • DOI: 10.1149/2.021312jes
• [Journal Article] 銅穴埋めめっきにおけるジアリルアミン系レベラーの側鎖の影響 (2013)
  • Author(s): 山田康貴,竹内 実,岡本尚樹,齊藤丈靖,文屋 勝,横井昌幸,近藤和夫
  • Journal Title: マイクロエレクトロニクスシンポジュム Volume: なし Pages: 211-214
  • NAID: 130007887239
  • Peer Reviewed
• [Journal Article] Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition (2012)
  • Author(s): M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, and T. Saito
  • Journal Title: J. Electrochem. Soc. Volume: 159 (4) Pages: 230-234
  • Peer Reviewed
• [Journal Article] Cu-filled through-hole electrode for ZnS using high adhesive strength Ni-P thin film (2012)
  • Author(s): N. Okamoto, M. Miyamoto, T. Saito, K. Kondo, T. Fukumoto and M. Hirota
  • Journal Title: ELECTROCHIMICA ACTA Volume: 82 Pages: 363-366
  • DOI: 10.1016/j.electacta.2012.04.151
  • Peer Reviewed
• [Journal Article] Adsorption Kinetic Study of Poly(ethylene glycol) during Copper Electrodeposition by a Microfluidic Device (2012)
  • Author(s): T. Saito, Y. Miyamoto, S. Hattori, N. Okamoto, K. Kondo
  • Journal Title: Japanese Journal of Applied Physics Volume: 51(5) Issue: 5S Pages: 05EA03-05EA03
  • DOI: 10.1143/jjap.51.05ea03
  • NAID: 210000140634
  • Peer Reviewed
• [Journal Article] M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, and T. Saito (2012)
  • Author(s): Single Diallylamine-Type Copolymer Additive Which Perfectly Bottom-Up Fills Cu Electrodeposition
  • Journal Title: JOURNAL OF THE ELECTROCHEMICAL SOCIETY Volume: 159 Issue: 4 Pages: D230-D234
  • DOI: 10.1149/2.080204jes
  • Peer Reviewed
• [Journal Article] High-Speed Through Silicon Via (TSV) Filling Using Diallylamine Additive (2011)
  • Author(s): T. Hayashi, K. Kondo, T. Saito, M. Takeuchi, and N. Okamoto
  • Journal Title: J. Electrochem. Soc. Volume: 158 (12) Pages: 715-718
  • Peer Reviewed
• [Journal Article] ジアリルアミン添加剤を用いた銅穴埋めめっき (2011)
  • Author(s): 阿南善裕, 竹内実, 岡本尚樹, 齊藤丈靖, 文屋勝, 近藤和夫
  • Journal Title: 表面技術協会誌 Volume: Vol.62, No.12
  • NAID: 10030476193
  • Peer Reviewed
• [Journal Article] Effect of Counter ions in a Diallylamine-Type Copolymer Additive on Via-Filling by Copper Electrodeposition
  • Author(s): M. Takeuchi, Y.Anami, Y. Yamada, M. Bunya, S. Okada, N. Okamoto, T. Saito, M. Yokoi, and K. Kondo
  • Journal Title: J. Electrochemistry Volume: (校正完了し掲載待ち)
  • NAID: 130004562475
  • Peer Reviewed
• [Presentation] Diallylamine levelers side chains effect on copper via filling (2013)
  • Author(s): Y. Yamada, K. Kondo, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya and M. Yokoi
  • Organizer: 224th ECS 2013 Meeting
  • Place of Presentation: San Francisco
• [Presentation] Reduction of thermal expansion coefficient of electrodeposited copper for TSV (2013)
  • Author(s): S. Mukahara, K. Kondo, T. Hayashi, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya and M. Yokoi
  • Organizer: 224th ECS 2013 Meeting
  • Place of Presentation: San Francisco
• [Presentation] 銅穴埋めめっきにおけるジアリルアミン系レベラーの影響 (2013)
  • Author(s): 山田康貴, 竹内実, 岡本尚樹, 齋藤丈靖, 文屋勝, 横井昌幸, 近藤和夫
  • Organizer: 化学工学会第45回秋季大会
  • Place of Presentation: 岡山大学
• [Presentation] 銅穴埋めめっきにおけるジアリルアミン系レベラーの側鎖の影響 (2013)
  • Author(s): 山田康貴, 竹内実, 岡本尚樹, 齋藤丈靖, 文屋勝, 横井昌幸, 近藤和夫
  • Organizer: MES 2013
  • Place of Presentation: 大阪大学
• [Presentation] 穴埋め電解銅めっき用の新規添加剤の開発 (2013)
  • Author(s): 竹内実, 近藤和夫, 山田康貴, 岡本尚樹, 齋藤丈靖, 文屋勝, 岡田笑子
  • Organizer: 2013アカデミックプラザ
  • Place of Presentation: 東京ビッグサイト
• [Presentation] Diallylamine levelers side chains effect on copper via filling (2013)
  • Author(s): Y. Yamada, K. Kondo, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya and M. Yokoi
  • Organizer: 224th Meeting ECS
  • Place of Presentation: The Hilton San Francisco Hotel
• [Presentation] 銅穴埋めめっきにおけるジアリルアミン系レベラーの影響 (2013)
  • Author(s): 山田康貴、竹内実、岡本尚樹、齊藤丈靖、文屋勝、横井昌幸、近藤和夫
  • Organizer: 化学工学会第45回秋季大会
  • Place of Presentation: 岡山大学津島東キャンパス
• [Presentation] スパッタイオンプレーティング法によるCuシード膜の作製 (2013)
  • Author(s): 丸中 正雄、土屋 貴之、林 太郎、岡本 尚樹 、齊藤 丈靖、横井 昌幸、近藤 和夫
  • Organizer: 化学工学会第78年会
  • Place of Presentation: 大阪大学
• [Presentation] 銅穴埋めめっきにおけるジアリルアミン系レベラーの作用 (2013)
  • Author(s): 阿南善裕，竹内 実，岡本尚樹，齊藤丈靖，文屋 勝，横井昌幸，近藤和夫
  • Organizer: エレクトロニクス実装学会第27回春季講演大会
  • Place of Presentation: 東北大学
• [Presentation] 電解銅めっきにおけるPRパルス電流制御による直径4μmビア完全充填 (2012)
  • Author(s): 林太郎, 竹内実, 岡本尚樹, 齋藤丈靖, 近藤和夫, 横井昌幸, 丸中正雄, 土屋貴之, 文屋勝
  • Organizer: MES2012
  • Place of Presentation: 大阪府立大
  • Year and Date: 2012-09-12
• [Presentation] Via Filling Electrodeposition of 4μm Diameter via by Periodical reverse Current (2012)
  • Author(s): T. Hayashi, K. Kondo, M. Takeuchi, T. Saito, N. Okamoto, M. Bunya, and M. Yokoi
  • Organizer: ECS2012 Fall Meeting
  • Place of Presentation: Honolulu,Hawai
• [Presentation] PRパルス電流制御による微細ビア充填とCu(I)生成評価 (2012)
  • Author(s): 林太郎, 竹内実, 岡本尚樹, 齋藤丈靖, 近藤和夫, 横井昌幸, 丸中正雄, 土屋貴之, 文屋勝
  • Organizer: 化学工学会第44回秋季大会
  • Place of Presentation: 東北大学
• [Presentation] ジアリルアミン系低分子添加剤を用いたCu配線形成とナノ構造の評価 (2012)
  • Author(s): 荒山卓也, 横山貴大, 玉橋邦裕, 滑川孝, 大貫仁, 近藤和夫, 竹内実
  • Organizer: 日本金属学会,秋季大会
  • Place of Presentation: 愛媛大学
• [Presentation] The Wire Grid Polarizer made by Electro- and electroless- Deposition Processes (2012)
  • Author(s): N.Okamoto,Y.Ikeda,Y.Koyama,Y.Kawazu,T.Saito and K.Kondo
  • Organizer: ECS 222nd Meeting
  • Place of Presentation: Honolulu
• [Presentation] Single Diallyamine Type Copolymer Additive Which Perfectly Bottom-up Fills Cu Electrodeposition (2011)
  • Author(s): M. Takeuchi, K. Kondo, H. Kuri, M. Bunya, N. Okamoto, T. saito
  • Organizer: ICEP2011国際会議
  • Place of Presentation: 奈良
  • Year and Date: 2011-04-15
• [Presentation] 穴埋め電解銅めっき用新規添加剤の開発 (2011)
  • Author(s): 竹内実, 近藤和夫, 久利英之, 岡本尚樹, 齋藤丈靖, 文屋勝
  • Organizer: 2011アカデミックプラザ
  • Place of Presentation: 東京ビッグサイト
• [Presentation] Single Diallylamine Type Copolymer Additive which Perfectly Fills Cu Electrodeposition with only 1ppm (2011)
  • Author(s): K.Kondo, M.Takauchi, H.Kuri, M.Bunya, N.Okamoto and T.Saito
  • Organizer: ECS
  • Place of Presentation: Boston