| Project/Area Number |
23560875
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | University of Hyogo |
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Principal Investigator |
YAE Shinji 兵庫県立大学, 工学(系)研究科(研究院), 准教授 (00239716)
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| Co-Investigator(Kenkyū-buntansha) |
MATSUDA Hitoshi 兵庫県立大学, 大学院工学研究科, 教授 (60118015)
FUKUMURO Naoki 兵庫県立大学, 大学院工学研究科, 助教 (10347528)
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| Project Period (FY) |
2011 – 2013
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| Project Status |
Completed (Fiscal Year 2013)
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| Budget Amount *help |
¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2013: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2012: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2011: ¥2,080,000 (Direct Cost: ¥1,600,000、Indirect Cost: ¥480,000)
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| Keywords | めっきプロセス / 密着性 / 触媒活性 / ナノ粒子 / 配線 / 金-シリコン合金 / 拡散 / 無電解めっき / 金－シリコン合金 / コンタクト抵抗 / 無電解ニッケルめっき |
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| Research Abstract |
Gold nanoparticles on silicon work not only as catalysts to initiate autocatalytic electroless metal deposition but also as binding points between the deposited metal film and the silicon surface. Gold nanoparticles can directly produce adhesive metal films on flat silicon surfaces without any treatments. Crosssectional transmission electron microscopic observation reveals that gold nanoparticles form an alloy with silicon at the room temperature. This alloy improves the adhesion of metal film on silicon. A sharp and clear metal pattern in tens-micron-scale was formed on the silicon surface by using a photoresist pattern and the present plating method. The contact resistivity between the electrolessly deposited metal film and silicon was as low as that for the conventional metallization methods.
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