| Project/Area Number |
23560888
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Material processing/treatments
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| Research Institution | Hyogo Prefectural Institute of Technology |
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Principal Investigator |
SHIBAHARA Masafumi 兵庫県立工業技術センター, その他部局等, 主席研究員 (80470219)
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| Co-Investigator(Kenkyū-buntansha) |
本田 幸司 兵庫県立工業技術センター, その他部局等, 主任研究員 (20553085)
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| Research Collaborator |
HONDA Kohji (20553085)
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| Project Period (FY) |
2011 – 2013
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| Project Status |
Completed (Fiscal Year 2013)
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| Budget Amount *help |
¥5,330,000 (Direct Cost: ¥4,100,000、Indirect Cost: ¥1,230,000)
Fiscal Year 2013: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
Fiscal Year 2012: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2011: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
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| Keywords | 高周波 / プリント回路基板 / PTFEシート / 銅被膜 / 平滑化 / 密着強度 / 大気圧プラズマ / 表面改質 |
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| Research Abstract |
Electroless copper plating on resin substrates has been studied as method for producing flexible printed circuit boards [PCB] . For increased speed of future high-frequency electronics devices, resin substrate having a characteristic of low dielectric loss is necessary. Polytetrafluoroethylene [PTFE] is the most ideal material among resins. However, the adhesion strength between copper layers and PTFE surface is greatly weak, because the PTFE surface is low surface free energy. Therefore, surface modification of PTFE has been required. Furthermore, in order to reduce the signal interconnection delay, it is necessary to keep the smooth PTFE surface.
In this study, we tried to modify the PTFE surface by combination of atmospheric-pressure plasma [APP] treatment and coating formation of surface modification. Then, it was possible to improve the adhesion of PTFE as well as smoothing.
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