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Acceleration of Stress Migration Using Thermal Control and itsApplication in Mass Fabrication of Micro/Nano Materials

Research Project

Project/Area Number 23656076
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeMulti-year Fund
Research Field Materials/Mechanics of materials
Research InstitutionTohoku University

Principal Investigator

SAKA Masumi  東北大学, 大学院・工学研究科, 教授 (20158918)

Co-Investigator(Kenkyū-buntansha) RI Shien  独立行政法人産業技術総合研究所, 計測フ ロンティア研究部門, 主任研究員 (70509710)
Project Period (FY) 2011 – 2012
Project Status Completed (Fiscal Year 2012)
Budget Amount *help
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2012: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2011: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
Keywords材料設計・プロセス・物性・評価 / ストレスマイグレーション / 原子拡散 / 金属ナノ・マイクロ材料 / 熱サイクル試験 / 薄膜 / 大量創製 / 熱疲労 / ウィスカ
Research Abstract

To realize the mass fabrication of various metallic micro/nano materials using stress migration (SM), the effect of thermal control including thermal cycle and atmosphere cooling was investigated systematically by carrying out a series of annealing experiments on different metallic thin films samples. The investigation on the suitable condition of thermal control for effective atomic diffusion and discharge indicates that the induced promotion of both atomic mobility and driving force can increase the absolute value of the atomic flux divergence and accelerate SM, which makes a significant contribution to mass fabrication of various metallic micro/nano materials.

Report

(3 results)
  • 2012 Annual Research Report   Final Research Report ( PDF )
  • 2011 Research-status Report
  • Research Products

    (15 results)

All 2013 2012 Other

All Journal Article (1 results) (of which Peer Reviewed: 1 results) Presentation (12 results) Remarks (2 results)

  • [Journal Article] Diffusion-fatigue Interaction Effect on Hillock Formation in Aluminum Thin Films under Thermal Cycle Testing2012

    • Author(s)
      S. Ri, M. Saka
    • Journal Title

      Mater. Lett

      Volume: 79 Pages: 139-141

    • DOI

      10.1016/j.matlet.2012.03.109

    • Related Report
      2012 Final Research Report 2011 Research-status Report
    • Peer Reviewed
  • [Presentation] Evaluation on the Factors Influencing Thermal-stress-induced Growth of Sn Nanowires2013

    • Author(s)
      Y. Li, K. Miura, S. Ri and M. Saka
    • Organizer
      The 13^<th> International Conference on Fracture
    • Place of Presentation
      北京, 中国
    • Related Report
      2012 Final Research Report
  • [Presentation] Evaluation on the Factors Influencing Thermal-stress-induced Growth of Sn Nanowires2013

    • Author(s)
      Y. Li, K. Miura, S. Ri, M. Saka
    • Organizer
      The 13th International Conference on Fracture
    • Place of Presentation
      The Olympic Green(Beijing, China)
    • Related Report
      2012 Annual Research Report
  • [Presentation] 熱応力誘起によるSnウィスカの作製2012

    • Author(s)
      李渊,金井敏行,三浦健太郎,李志遠,坂真澄
    • Organizer
      日本機械学会東北支部第48期秋季講演会
    • Place of Presentation
      八戸市
    • Year and Date
      2012-09-22
    • Related Report
      2012 Final Research Report
  • [Presentation] 金属薄膜材料のストレスマイグレーション現象における原子拡散・熱疲労の相互作用効果2012

    • Author(s)
      李志遠,坂真澄
    • Organizer
      日本機械学会2012年度年次大会
    • Place of Presentation
      金沢市
    • Year and Date
      2012-09-10
    • Related Report
      2012 Final Research Report
  • [Presentation] ストレスマイグレーションにおける効果的影響因子の作用を考慮した金属ナノワイヤの創製2012

    • Author(s)
      三浦健太郎,李渊,坂真澄
    • Organizer
      日本機械学会2012年度年次大会
    • Place of Presentation
      金沢市
    • Year and Date
      2012-09-10
    • Related Report
      2012 Final Research Report
  • [Presentation] Acceleration Factors for Stress-induced Growth of Metallic Nanowire2012

    • Author(s)
      Y. Li, K. Miura, T. Kanai, S. Ri and M. Saka
    • Organizer
      The 8^<th> International Forum on Advanced Materials Science and Technology
    • Place of Presentation
      福岡市
    • Year and Date
      2012-08-03
    • Related Report
      2012 Final Research Report
  • [Presentation] ストレスマイグレーションによるAg微細材料の創製と諸因子の影響に関する研究2012

    • Author(s)
      藤田邦男,坂真澄
    • Organizer
      日本機械学会東北支部第47期総会・講演会
    • Place of Presentation
      仙台市
    • Year and Date
      2012-03-13
    • Related Report
      2012 Final Research Report
  • [Presentation] 熱応力誘起によるSnウィスカの作製

    • Author(s)
      李渊,金井敏行,三浦健太郎,李志遠,坂真澄
    • Organizer
      日本機械学会東北支部第48期秋季講演会
    • Place of Presentation
      八戸工業高等専門学校(八戸市)
    • Related Report
      2012 Annual Research Report
  • [Presentation] 金属薄膜材料のストレスマイグレーション現象における原子拡散・熱疲労の相互作用効果

    • Author(s)
      李志遠,坂真澄
    • Organizer
      日本機械学会2012年度年次大会
    • Place of Presentation
      金沢大学(金沢市)
    • Related Report
      2012 Annual Research Report
  • [Presentation] ストレスマイグレーションにおける効果的影響因子の作用を考慮した金属ナノワイヤの創製

    • Author(s)
      三浦健太郎,李渊,坂真澄
    • Organizer
      日本機械学会2012年度年次大会
    • Place of Presentation
      金沢大学(金沢市)
    • Related Report
      2012 Annual Research Report
  • [Presentation] Acceleration Factors for Stress-induced Growth of Metallic Nanowire

    • Author(s)
      Y. Li, K. Miura, T. Kanai, S. Ri, M. Saka
    • Organizer
      The 8th International Forum on Advanced Materials Science and Technology
    • Place of Presentation
      福岡工業大学(福岡市)
    • Related Report
      2012 Annual Research Report
  • [Presentation] ストレスマイグレーションによるAg微細材料の創製と諸因子の影響に関する研究

    • Author(s)
      藤田 邦男、坂 真澄
    • Organizer
      日本機械学会東北支部第47期総会・講演会
    • Place of Presentation
      東北大学工学部機械系講義棟
    • Related Report
      2011 Research-status Report
  • [Remarks]

    • URL

      http://king.mech.tohoku.ac.jp/saka/index.htm

    • Related Report
      2012 Final Research Report
  • [Remarks]

    • URL

      http://king.mech.tohoku.ac.jp/saka/index.htm

    • Related Report
      2011 Research-status Report

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Published: 2011-08-05   Modified: 2019-07-29  

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