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Nano-mechanical investigation of the effects of mechanical strain on semiconductor devices

Research Project

Project/Area Number 23656083
Research Category

Grant-in-Aid for Challenging Exploratory Research

Allocation TypeMulti-year Fund
Research Field Materials/Mechanics of materials
Research InstitutionKagoshima University (2012-2013)
Kyoto University (2011)

Principal Investigator

IKEDA Toru  鹿児島大学, 理工学研究科, 教授 (40243894)

Co-Investigator(Renkei-kenkyūsha) KOGANEMARU Masaaki  福岡県産業, 科学技術振興財団 (20416506)
Project Period (FY) 2011 – 2013
Project Status Completed (Fiscal Year 2013)
Budget Amount *help
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2013: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2012: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2011: ¥2,210,000 (Direct Cost: ¥1,700,000、Indirect Cost: ¥510,000)
Keywords材料設計 / プロセス / 物性 / 評価 / ひずみ効果 / 半導体 / 応力 / トランジスタ / 電気特性変動 / nMOSFET / pMOSFET / シリコン / 電子移動度 / デバイスシミュレーション / 移動度
Research Abstract

This study discusses a numerical model for analyzing the effects of mechanical stress on semiconductor devices. In other words, drift-diffusion device simulation is conducted using a physical model incorporating the effects of mechanical stress. Then, each impact of the stress-induced physical phenomena is analyzed. In our previous study, three physical phenomena that were attributed to mechanical stress have been modeled in our electron mobility model, i.e., the changes in relative population, the momentum relaxation time and the effective mass of electrons in conduction-band valleys. In this study, the stress-induced change of intrinsic carrier density is modeled. Stress-induce variations of drain current characteristics on nMOSFETs are evaluated using a drift-diffusion device simulator including above mentioned physical models. It is demonstrated that the impact of stress-induced change of intrinsic carrier density is small for our evaluated nMOSFETs.

Report

(4 results)
  • 2013 Annual Research Report   Final Research Report ( PDF )
  • 2012 Research-status Report
  • 2011 Research-status Report
  • Research Products

    (53 results)

All 2013 2012 2011

All Journal Article (15 results) (of which Peer Reviewed: 14 results) Presentation (38 results) (of which Invited: 1 results)

  • [Journal Article] SEM-DICMによる3次元積層チップの熱ひずみ計測に基づく非線形有限要素解析精度の評価・改善2013

    • Author(s)
      岡大智, 池田徹, 宮 崎 則 幸, 田 中 宏 之, 畑尾卓也, 松本圭司, 小原さゆり, 折井靖光, 山田文明, 嘉田守宏
    • Journal Title

      電子情報通信学会論文誌

      Volume: Vol.J96-C, No.11 Pages: 352-360

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] 樹脂封止された積層半導体チップの残留応力に起因する電気特性変動評価手法2013

    • Author(s)
      松田和敏, 池田徹, 小金丸正明, 宮崎則幸
    • Journal Title

      日本機械学会論文集(A編)

      Volume: 第79巻,第797号 Pages: 74-88

    • NAID

      130003374587

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] SEM-DICMによる3次元積層チップの熱ひずみ計測に基づく非線形有限要素解析精度の評価・改善2013

    • Author(s)
      岡 大智,池田 徹,宮崎 則幸,田中 宏之,畑尾 卓也,松本 圭司,小原 さゆり,折井 靖光,山田 文明,嘉田 守宏
    • Journal Title

      電子情報通信学会論文誌

      Volume: Vol. J96-C,No.11 Pages: 352-360

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Hygromechanical analysis of liquid crystal display panels, Journal of Electronic Packaging2013

    • Author(s)
      Toru Ikeda, Tomonori Mizutani, Kiyoshi Miyake, Noriyuki Miyazaki
    • Journal Title

      Journal of Electronic Packaging, Trans. ASME

      Volume: Vol. 135, No. 4 Pages: 41005-41005

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Nonlinear FEA for a 3D SIC package improved by the digital image correlation with SEM2013

    • Author(s)
      Toru IKEDA, Masatoshi OKA, Noriyuki MIYAZAKI, Kenji MATSUMOTO, Sayuri KOHARA, Yasumitsu ORII, Fumiaki YAMADA and Morihiro KADA
    • Journal Title

      Proceedings of 13th International Symposium on Electronics Packaging (ICEP 2013)

      Volume: Proceedings Pages: 22-25

    • Related Report
      2013 Annual Research Report
  • [Journal Article] Reliablility evaluation of a 3D SIC package by the combination of the SEM-DIC and the FEM2013

    • Author(s)
      Toru Ikeda, Masatoshi Oka and Noriyuki Miyazaki
    • Journal Title

      The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)

      Volume: Proceedings

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs: The inpaacts of stress-induced change of intrinsic carriear density2013

    • Author(s)
      Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
    • Journal Title

      The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)

      Volume: Proceedings

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 樹脂封止された積層半導体チップの残留応力に起因する電気特性変動評価手法2013

    • Author(s)
      松田和敏, 池田 徹, 小金丸 正明,宮崎則幸
    • Journal Title

      日本機械学会論文集 (A編)

      Volume: 第79巻, 第797号 Pages: 74-88

    • NAID

      130003374587

    • Related Report
      2012 Research-status Report
    • Peer Reviewed
  • [Journal Article] ドリフト拡散デバイスシミュレーションを用いた1軸負荷に起因するnMOSFET の電気特性変動評価手法2012

    • Author(s)
      小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇
    • Journal Title

      エレクトロニクス実装学会誌

      Volume: 第15巻, 第6号 Pages: 483-491

    • NAID

      10030878367

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] 機械学会における電子実装の信頼性と熱制御に関する研究分科会活動について2012

    • Author(s)
      池田徹
    • Journal Title

      エレクトニクス実装学会誌

      Volume: 第15巻第5号 Pages: 323-326

    • NAID

      10030506718

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] ドリフト拡散デバイスシミュレーションを用いた1軸負荷に起因するnMOSFETの電気特性変動評価手法2012

    • Author(s)
      小金丸正明,吉田圭佑,多田直弘,池田徹,宮崎則幸,友景肇
    • Journal Title

      エレクトロニクス実装学会誌

      Volume: Vol. 15, No. 6 Pages: 483-491

    • NAID

      10030878367

    • Related Report
      2012 Research-status Report
    • Peer Reviewed
  • [Journal Article] Strain Measurement in Micro-electronic Packages Using Digital Image Correlation Method2011

    • Author(s)
      Toru Ikeda, Toshifumi Kanno, Nobuyuki Shishido, Noriyuki Miyazaki, Hiroyuki Tanaka and Takuya Hatao
    • Journal Title

      Welding International

      Volume: Vol.25,No.11 Pages: 844-850

    • NAID

      10026555765

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Device Simulation for Evaluating Effects of Inplane Biaxial Mechanical Stess on n-Type Silicon Semiconductor2011

    • Author(s)
      Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
    • Journal Title

      IEEE Transactions on Electron Devices

      Volume: Vol.58,No.8 Pages: 2525-2536

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors2011

    • Author(s)
      Masaaki KOGANEMARU, Keisuke YOSHIDA, Naohiro TADA, u IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
    • Journal Title

      Proceedings of The ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS (InterPACK 2011)

      Volume: IPACK2011-52150 Pages: 1-8

    • Related Report
      2011 Research-status Report
    • Peer Reviewed
  • [Journal Article] Device Simulation for Evaluating Effects of Inplane Biaxial Mechanical Stress on n-Type Silicon Semiconductor Devices2011

    • Author(s)
      Masaaki Koganemaru, Keisuke Yoshida, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
    • Journal Title

      IEEE Trans. on Electron Devices

      Volume: Vol. 58, No.8 Pages: 2525-2536

    • Related Report
      2011 Research-status Report
    • Peer Reviewed
  • [Presentation] Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs : The inpaacts of stress-induced change of intrinsic carriear density2013

    • Author(s)
      Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
    • Organizer
      The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)
    • Place of Presentation
      Burlingame, CA, USA
    • Related Report
      2013 Final Research Report
  • [Presentation] Reliablility evaluation of a 3D SIC package by the combination of the SEM-DIC and the FEM2013

    • Author(s)
      Toru Ikeda, Masatoshi Oka and Noriyuki Miyazaki
    • Organizer
      The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)
    • Place of Presentation
      Burlingame, CA, USA
    • Related Report
      2013 Annual Research Report 2013 Final Research Report
  • [Presentation] Nonlinear FEA for a 3D SIC package improved by the digital image correlation with SEM2013

    • Author(s)
      Toru Ikeda, Masatashi Oka, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada and Morihiro Kada
    • Organizer
      International Conference on Electronics Packaging in Osaka, ICEP2013 Proceedings
    • Related Report
      2013 Final Research Report
  • [Presentation] Nonlinear FEA for a 3D SIC package improved by the digital image correlation with SEM2013

    • Author(s)
      Toru Ikeda, Masatashi Oka, Noriyuki Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada and Morihiro Kada
    • Organizer
      International Conference on Electronics Packaging (ICEP2013)
    • Place of Presentation
      大阪
    • Related Report
      2013 Annual Research Report
  • [Presentation] Device simulation for effecs of mechanical stress on electrical performances of NMOSFETs: The inpaacts of stress-induced change of intrinsic carriear density2013

    • Author(s)
      Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki
    • Organizer
      The ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2013)
    • Place of Presentation
      Burlingame, CA, USA
    • Related Report
      2013 Annual Research Report
  • [Presentation] Warpage Analyses of a Stacked Package Considering the Change of Visco-elastic Material Properties of Resin during Thermal History2013

    • Author(s)
      Toru Ikeda, Shinya Kawahara, Noriyuki Miyazaki, Takuya Hatao
    • Organizer
      The 15th International Conference on Electronic Materials and Packaging / The 12th International Symposium on Microelectronics and Packaging (EMAP/ISMP 2013)
    • Place of Presentation
      Seoul Korea
    • Related Report
      2013 Annual Research Report
  • [Presentation] デジタル画像相関法を用いたひずみ計測による微細電子実装部の非線形有限要素法の精度改善2012

    • Author(s)
      池田徹
    • Organizer
      Marc Users Meeting 2012 in Fukuoka
    • Place of Presentation
      福岡
    • Year and Date
      2012-11-22
    • Related Report
      2013 Final Research Report
    • Invited
  • [Presentation] Numerical Evaluation of Correlation between Stress Concentration and Electronic Characteristics on nMOSFETs2012

    • Author(s)
      Naohiro Tada, Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
    • Organizer
      International Computational Mechanics Symposium 2012 (ICMS2012)
    • Place of Presentation
      Kobe Japan
    • Year and Date
      2012-10-11
    • Related Report
      2013 Final Research Report
  • [Presentation] Improvement of the Accuracy of Nonlinear Finite Element Analysis for a 3D SIC Package Using SEM and DICM2012

    • Author(s)
      Masatoshi Oka, Shinya Kawahara, Toru Ikeda, Noriyuki Miyazaki, Hiroyuki Tanaka and Takuya Hatao
    • Organizer
      International Computational Mechanics Symposium 2012 (ICMS2012)
    • Place of Presentation
      Kobe Japan
    • Year and Date
      2012-10-11
    • Related Report
      2013 Final Research Report
  • [Presentation] nMOSFET 内部の応力分布と電気特性との相関に関するデバイスシミュレーション2012

    • Author(s)
      小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇
    • Organizer
      日本機械学会第25回計算力学講演会講演論文集
    • Place of Presentation
      神戸市
    • Year and Date
      2012-10-06
    • Related Report
      2013 Final Research Report
  • [Presentation] SEM-DICM を用いた3D-SIC 模擬チップのひずみ計測と有限要素解析精度の向上2012

    • Author(s)
      池田徹, 岡大智, 宮崎則幸, 田中宏之, 畑尾卓也
    • Organizer
      日本機械学会第25回計算力学講演会講演論文集
    • Place of Presentation
      神戸市
    • Year and Date
      2012-10-06
    • Related Report
      2013 Final Research Report
  • [Presentation] SEMを用いたデジタル画像相関法による熱ひずみ計測を用いた三次元積層チップの非線形有限要素解析精度評価2012

    • Author(s)
      岡大智, 池田徹, 宮崎則幸, 松本圭司, 小原さゆり, 折井靖光, 山田文明, 嘉田守弘
    • Organizer
      日本機械学会M&M2012材料力学カンファレンス
    • Place of Presentation
      松山市
    • Year and Date
      2012-09-24
    • Related Report
      2013 Final Research Report
  • [Presentation] Numerical Study on Impact of Mechanical Stress in the Regions of High Current Density in n-type MOS Devices2012

    • Author(s)
      Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
    • Organizer
      4th Electronics System Integration technologies Conference (ESTC 2012)
    • Place of Presentation
      Amsterdam, The Netherlands
    • Year and Date
      2012-09-19
    • Related Report
      2013 Final Research Report
  • [Presentation] Takuya Hatao Reliability Evaluation of a New 3D SIC Package by FEM and Thermal -Strain Measurement with Digital Image Correlation Using SEM2012

    • Author(s)
      Toru Ikeda, Masatoshi Oka, Noriyuki Miyazaki, Hiroyuki Tanaka
    • Organizer
      The 14th International Conference on Electronic Meterials and Packaging (EMAP 2012)
    • Place of Presentation
      Hong Kong
    • Year and Date
      2012-09-15
    • Related Report
      2013 Final Research Report
  • [Presentation] SEMとデジタル画像相関法によるひずみ計測を利用した三次元積層チップの非線形有限要素解析の精度向上2012

    • Author(s)
      岡大智, 河原真哉, 池田徹, 宮崎則幸, 松本圭二, 小原さゆり, 折井靖光, 山田文明, 嘉田守弘
    • Organizer
      第22回マイクロエレクトロニクスシンポジウム (MES2012)
    • Place of Presentation
      堺市
    • Year and Date
      2012-09-13
    • Related Report
      2013 Final Research Report
  • [Presentation] デバイス内部の応力集中と真性キャリア濃度変化を考慮したnMOSFET の電気特性変動でバイスシミュレーション2012

    • Author(s)
      多田直弘, 小金丸正明, 池田徹, 宮崎則幸, 友景肇
    • Organizer
      第22回マイクロエレクトロニクスシンポジウム (MES2012)
    • Place of Presentation
      堺市
    • Year and Date
      2012-09-13
    • Related Report
      2013 Final Research Report
  • [Presentation] Improvement of Nonlinear Finite Element Analyses of Electronic Packaging Using the Strain Measurement with the Digital Image Correlation2012

    • Author(s)
      Noriyuki Miyazaki, Toru Ikeda and Masatoshi Oka
    • Organizer
      10th World Congress on Computational Mechanics
    • Place of Presentation
      Sao Paulo, Brazil
    • Year and Date
      2012-07-12
    • Related Report
      2013 Final Research Report
  • [Presentation] Device Simulation of Stress Effect on Electrical Performances of Semiconductor Devices : Impact of Mechanical Stress in the Region of High Current Density in the Devices2012

    • Author(s)
      Masaaki Koganemaru, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
    • Organizer
      10th World Congress on Computational Mechanics
    • Place of Presentation
      Sao Paulo, Brazil
    • Year and Date
      2012-07-12
    • Related Report
      2013 Final Research Report
  • [Presentation] Combination between the Nonlinear Finite Element Analyses and the Strain Measurement Using the Digital Image Correlation for a New 3D SIC Package2012

    • Author(s)
      Toru Ikeda, Masatoshi Oka, Shinya Kawahara, Noriyukiu Miyazaki, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Famada Yamada and Morihiro Kada and M. Kada
    • Organizer
      IEEE International 3D System Integration Conference (IEEE 3DIC 2011)
    • Place of Presentation
      Osaka, Japan
    • Year and Date
      2012-02-01
    • Related Report
      2013 Final Research Report
  • [Presentation] デジタル画像相関法によるひずみ計測を用いた三次元積層チップの微細接合部のひずみ評価2012

    • Author(s)
      岡大智, 池田徹, 宮崎則幸
    • Organizer
      第18回エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム (Mate 2012)
    • Place of Presentation
      横浜市
    • Year and Date
      2012-01-31
    • Related Report
      2013 Final Research Report
  • [Presentation] Device Simulation of Stress Effect on Electrical Performances of Semiconductor Devices : Impact of Mechanical Stress in the Region of High Current Density in the Devices2012

    • Author(s)
      Masaaki KOGANEMARU, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
    • Organizer
      10th World Congress on Computational Mechanics
    • Place of Presentation
      サンパウロ
    • Related Report
      2012 Research-status Report
  • [Presentation] デバイス内部の応力集中と真性キャリア濃度変化を考慮したnMOSFETの電気特性変動でバイスシミュレーション2012

    • Author(s)
      多田直弘, 小金丸正明, 池田 徹, 宮崎 則幸, 友景 肇
    • Organizer
      第22回マイクロエレクトロニクスシンポジウム (MES2012)
    • Place of Presentation
      堺市大阪府立大学
    • Related Report
      2012 Research-status Report
  • [Presentation] Numerical Study on Impact of Mechanical Stress in the Regions of High Current Density in n-type MOS Devices2012

    • Author(s)
      Masaaki KOGANEMARU, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
    • Organizer
      4th Electronics System Integration technologies Conference (ESTC 2012)
    • Place of Presentation
      アムステルダム
    • Related Report
      2012 Research-status Report
  • [Presentation] nMOSFET 内部の応力分布と電気特性との相関に関するデバイスシミュレーション2012

    • Author(s)
      小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇
    • Organizer
      日本機械学会第25回計算力学講演会
    • Place of Presentation
      神戸市
    • Related Report
      2012 Research-status Report
  • [Presentation] Numerical Evaluation of Correlation between Stress Concentration and Electronic Characteristics on nMOSFETs2012

    • Author(s)
      Naohiro TADA, Masaaki KOGANEMARU, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
    • Organizer
      International Computational Mechanics Symposium 2012 (ICMS2012)
    • Place of Presentation
      神戸市
    • Related Report
      2012 Research-status Report
  • [Presentation] Numerical Study on Impact of Uniaxial Stress on n-type Silicon MOS Devices2011

    • Author(s)
      Masaaki Koganemau, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
    • Organizer
      The13th International Conference on Electronics Materials and Packaging (EMAP2011)
    • Place of Presentation
      Kyoto Japan
    • Year and Date
      2011-12-14
    • Related Report
      2013 Final Research Report
  • [Presentation] Improvement of the Accuracy of the Nonlinear Finite Element Analyses for a New 3D SIC Package Using the Thermal Strain Measurement with the Digital Image Correlation2011

    • Author(s)
      Masatoshi Oka, Shinya Kawahara, Toru Ikeda and Noriyuki Miyazaki
    • Organizer
      The13th International Conference on Electronics Materials and Packaging (EMAP2011)
    • Place of Presentation
      Kyoto Japan
    • Year and Date
      2011-12-14
    • Related Report
      2013 Final Research Report
  • [Presentation] Improvement of the Nonlinear Finite Element Analyses for a 3D SIC using the Strain Measurement by the Digital Image Correlation2011

    • Author(s)
      Toru Ikeda, Shinya Kawahara, Masatoshi Oka, Noriyuki Miyazaki
    • Organizer
      International Conference on Materials and Reliability 2011 (ICMR2011)
    • Place of Presentation
      Busan, Korea
    • Year and Date
      2011-11-22
    • Related Report
      2013 Final Research Report
  • [Presentation] デジタル画像相関法による次世代三次元積層チップ断面のひずみ計測を用いた非線形有限要素法解析精度の向上2011

    • Author(s)
      岡大智, 河原真哉, 池田徹, 宮崎則幸
    • Organizer
      日本機械学会第24回計算力学講演会
    • Place of Presentation
      岡山市
    • Year and Date
      2011-10-08
    • Related Report
      2013 Final Research Report
  • [Presentation] デバイスシミュレーションによるnMOSFETへの一軸応力負荷の影響評価2011

    • Author(s)
      多田直弘, 小金丸正明, 池田徹, 宮崎則幸, 友景肇
    • Organizer
      日本機械学会第24回計算力学講演会
    • Place of Presentation
      岡山市
    • Year and Date
      2011-10-08
    • Related Report
      2013 Final Research Report 2011 Research-status Report
  • [Presentation] Evaluation of Uniaxial-Stress Effects on DC Characteristics of n-type Metal Oxide Semiconductor Field Effect Transistors2011

    • Author(s)
      Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
    • Organizer
      International Conference on Advanced Technology in Experimental Mechanics (ATEM'11)
    • Place of Presentation
      Kobe, Japan
    • Year and Date
      2011-09-21
    • Related Report
      2013 Final Research Report
  • [Presentation] nMOSFETにおける1軸応力の影響評価2011

    • Author(s)
      小金丸正明, 多田直弘, 池田徹, 宮崎則幸, 友景肇
    • Organizer
      第21回マイクロエレクトロニクスシンポジウム (MES2011)
    • Place of Presentation
      吹田市
    • Year and Date
      2011-09-08
    • Related Report
      2013 Final Research Report
  • [Presentation] デジタル画像相関法による熱ひずみ計測を用いた次世代三次元積層チップの非線形有限要素解析精度の改善2011

    • Author(s)
      岡 大智, 河原真哉, 池田 徹, 宮崎則幸
    • Organizer
      日本機械学会M&M2010材料力学カンファレンス
    • Place of Presentation
      北九州市
    • Year and Date
      2011-07-16
    • Related Report
      2013 Final Research Report
  • [Presentation] The ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems2011

    • Author(s)
      Masaaki Koganemaru, Keisuke Yoshida, Naohiro Tada, Toru Ikeda, Noriyuki Miyazaki and Hajime Tomokage
    • Organizer
      MEMS and NEMS (InterPACK 2011)
    • Place of Presentation
      Portland, USA
    • Year and Date
      2011-07-06
    • Related Report
      2013 Final Research Report
  • [Presentation] Experimental and Numerical Study on Uniaxial-Stress Effects of N-Type Metal-Oxide-Semiconductor Field Effect Transistors2011

    • Author(s)
      Masaaki KOGANEMARU, Keisuke YOSHIDA, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
    • Organizer
      ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS
    • Place of Presentation
      ポートランド
    • Related Report
      2011 Research-status Report
  • [Presentation] nMOSFETにおける1軸応力の影響評価2011

    • Author(s)
      小金丸正明,多田直弘,池田 徹,宮崎則幸,友景 肇
    • Organizer
      第21回マイクロエレクトロニクスシンポジウム (MES2011)
    • Place of Presentation
      大阪府吹田市
    • Related Report
      2011 Research-status Report
  • [Presentation] Evaluation of Uniaxial-Stress Effects on DC Characteristics of n-type Metal Oxide Semiconductor Field Effect Transistors2011

    • Author(s)
      Masaaki KOGANEMARU, Keisuke YOSHIDA, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
    • Organizer
      International Conference on Advanced Technology in Experimental Mechanics (ATEM’11)(招待講演)
    • Place of Presentation
      神戸市
    • Related Report
      2011 Research-status Report
  • [Presentation] Numerical Study on Impact of Uniaxial Stress on n-type Silicon MOS Devices2011

    • Author(s)
      Masaaki KOGANEMARU, Naohiro TADA, Toru IKEDA, Noriyuki MIYAZAKI and Hajime TOMOKAGE
    • Organizer
      The13th International Conference on Electronics Materials and Packaging (EMAP2011)
    • Place of Presentation
      京都市
    • Related Report
      2011 Research-status Report

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Published: 2011-08-05   Modified: 2019-07-29  

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