| Project/Area Number |
23656101
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Chiba University |
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Principal Investigator |
MORITA Noboru 千葉大学, 大学院・工学研究科, 教授 (30239660)
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| Co-Investigator(Kenkyū-buntansha) |
HIDAI Hirofumi 千葉大学, 大学院・工学研究科, 准教授 (60313334)
MATSUSAKA Souta 千葉大学, 大学院・工学研究科, 助教 (30334171)
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| Project Period (FY) |
2011 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
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| Budget Amount *help |
¥2,990,000 (Direct Cost: ¥2,300,000、Indirect Cost: ¥690,000)
Fiscal Year 2012: ¥1,040,000 (Direct Cost: ¥800,000、Indirect Cost: ¥240,000)
Fiscal Year 2011: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
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| Keywords | ナノ / マイクロ加工 / AFM / LSI回路 / 故障診断 / ダイヤモンド / マイクロ・ナノ加工 / LSI / 故障解析 |
|---|
| Research Abstract |
A new fault detection/diagnosis method of multi-layered interconnection in LSI circuit was developed using diamond tools attached on AFM cantilevers. The effects of configuration of a cutting edge and stiffness of a cantilever on removal characteristics of a surface thin layer were investigated. As a result, the removed depth of more than 3.0 μm was achieved by utilizing a high stiffness cantilever. And also, the precise control of applied load to cantilever enabled the observation and evaluation of buried wires at intended removed depth. The present study provides more reliable fault detection/diagnosis method than conventional removal methods such as chemical etching and mechanical polishing.
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