Development of an ultra-smooth polishing technique required for thediamond power device fabrication
| Project/Area Number |
23656110
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | Kumamoto University |
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Principal Investigator |
KUBOTA Akihisa 熊本大学, 大学院・自然科学研究科, 准教授 (80404325)
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| Project Period (FY) |
2011 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2012: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2011: ¥2,600,000 (Direct Cost: ¥2,000,000、Indirect Cost: ¥600,000)
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| Keywords | 超精密加工 / 研磨 / ダイヤモンド / 精密研磨 / 精密部品加工 / 先端機能デバイス |
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| Research Abstract |
To satisfy the demand for diamond substrates in power semiconductor device fabrication,we have developed a novel polishing method utilizing reactive species generated on Fecatalyst surface in hydrogen peroxide solution and applied the proposed technique toflatten a single-crystal diamond substrate. As a result, the whole area on the diamondsurface could be equally smoothed and an atomically smooth surface with an rmsroughness of 0.082 nm is obtained by our proposed method.
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Report
(3 results)
Research Products
(24 results)
