Interconnect formation for high-band-width packaging
| Project/Area Number |
23656213
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Electronic materials/Electric materials
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| Research Institution | University of Yamanashi |
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Principal Investigator |
KONDOH Eiichi 山梨大学, 医学工学総合研究部, 教授 (70304871)
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| Project Period (FY) |
2011 – 2012
|
| Project Status |
Completed (Fiscal Year 2012)
|
| Budget Amount *help |
¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2012: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
Fiscal Year 2011: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
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| Keywords | 粘菌 / 配線 / 超臨界流体 / メタライズ / 金属錯体 / 生物摸倣 |
|---|
| Research Abstract |
Bio veins such as amoeboid organism form an efficient network. A high speedelectronic circuit can be fabricated via giving electric conductivity to the bio veins. Inthis work, bio vein surfaces were were metallized using a metal deposition techniquefrom supercritical fluids, where a metal chelate was reduced by hydrogen dissolved inthe fulid. A few of micron-thick Cu or Pt was successfully deposited on non-conductivebio veins without special pretreatment. The tissues did not show a significantdegeneration upto about 200℃.
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Report
(3 results)
Research Products
(22 results)
