Solid-Phase Bonding at Low Temperature in Metals with Ultrahigh Density Lattice Defects Formed by Severe Plastic Deformation
| Project/Area Number |
23656460
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Material processing/treatments
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| Research Institution | Toyohashi University of Technology |
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Principal Investigator |
TODAKA Yoshikazu 豊橋技術科学大学, 大学院・工学研究科, 准教授 (50345956)
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| Project Period (FY) |
2011 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
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| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2012: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2011: ¥2,340,000 (Direct Cost: ¥1,800,000、Indirect Cost: ¥540,000)
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| Keywords | 接合・溶接 / ナノ組織 / 格子欠陥 / 巨大ひずみ加工 / 構造・機能材料 / 材料加工・処理 / 表面・界面物性 / 拡散 |
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| Research Abstract |
Solid-phase bonding at low temperature was carried out in pure Fe with ultrahigh density lattice defects formed by HPT (high-pressure torsion) - straining which is one of severe plastic deformation processes. The tensile strength, TS, in the HPT-processed (HPTed) Fe was TS 1.4 Gpa, and also kept the high strength of TS 1.0 Gpa after annealing at 300 ℃. The solid-phase bonding of the HPTed Fe and the HPTed Fe specimens occurred slightly at 300 ℃. On the other hand, the HPTed Fe and the non-HPTed Fe specimens could not be bonded at 300 ℃.
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Report
(3 results)
Research Products
(12 results)
