Room temperature and ambient condition joint materials fabrication with metal nano-inks

• Project/Area Number: 23656464
• Research Category: Grant-in-Aid for Challenging Exploratory Research
• Allocation Type: Multi-year Fund
• Research Field: Material processing/treatments
• Research Institution: Osaka University
• Principal Investigator: SUGANUMA Katsuaki 大阪大学, 産業科学研究所, 教授 (10154444)
• Project Period (FY): 2011 – 2012
• Project Status: Completed (Fiscal Year 2012)
• Budget Amount: ¥3,640,000 (Direct Cost: ¥2,800,000、Indirect Cost: ¥840,000); Fiscal Year 2012: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000); Fiscal Year 2011: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
• Keywords: 常温接合 / 拡散接合 / ナノ粒子 / 低エネルギー

Research Abstract

The jointing properties of silver nano-inks at a low or room temperature are investigated using the room temperature sintering and wiring techniques of silver nano-particles. The shear strength and the electrical resistance of the jointing were evaluated as an optimization solvent dispersion of silver nanoparticles and surface state of the substrate. As results of this study, a design guideline of room-temperature jointing was obtained.

Research Products

• [Journal Article] Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices (2013)
  • Author(s): Soichi Sakamoto
  • Journal Title: Journal of Materials Science: Materials in Electronics Volume: - Issue: 7 Pages: 2593-2601
  • DOI: 10.1007/s10854-013-1138-x
  • Peer Reviewed
• [Journal Article] Microstructural stability of Ag sinter joining in thermal cycling (2013)
  • Author(s): Soichi Sakamoto, Tohru Sugahara, Katsuaki Suganuma
  • Journal Title: Journal of Materials Science: Materials in Electronics Volume: 24 Pages: 1332-1340
  • Peer Reviewed
• [Journal Article] Low Temperature and Low Pressure Die Bonding Using Thin Ag-flake and Ag-particle Pastes for Power Devices (2013)
  • Author(s): Soichi Sakamoto
  • Journal Title: Transactions on Components, Packaging and Manufacturing Technology Volume: -
  • Peer Reviewed
• [Journal Article] Low-temperature low-pressure die attach with hybrid silver particle paste (2012)
  • Author(s): Katsuaki Suganuma, Soichi Sakamoto, Noriko Kagami, Daisuke Wakuda, Keun-Soo Kim, Masaya Nogi
  • Journal Title: Microelectronics Reliability Volume: 52 Pages: 375-380
  • Peer Reviewed
• [Journal Article] Stretchable fine fiber with high conductivity fabricated by injection forming (2011)
  • Author(s): Daisuke Wakuda and Katsuaki Suganuma
  • Journal Title: Applied PhysicsLetters Volume: 98 Pages: 73304-73304
  • Peer Reviewed
• [Journal Article] Low Temperature and Low Pressure Die Bonding Using Thin Ag-flake and Ag-particle Pastes for Power Devices
  • Author(s): Soichi Sakamoto, and Katsuaki Suganuma
  • Journal Title: Transactions on Components, Packaging and Manufacturing Technology Volume: (in press)
  • Peer Reviewed
• [Presentation] Thermomechanical Reliability of Ag Sinter Joining in Thermal Cycling (2012)
  • Author(s): Soichi Sakamoto, Shijo Nagao, Toru Sugahara, and Katsuaki Suganuma
  • Organizer: 8th Handai Nanoscience and Nanotechnology
  • Place of Presentation: International Symposium, Osaka, Japan
  • Year and Date: 2012-10-11
• [Presentation] Thermo Mechanical Reliability of Low Energy Ag Die Bonding (2012)
  • Author(s): Tohru Sugahara, Soichi Sakamoto, and Katsuaki Suganuma
  • Organizer: International Welding / Joining Conference Korea 2012
  • Place of Presentation: Jeju, Korea
• [Presentation] Thermo mechanical reliability of low-temperature low-pressure die bonding using thin Ag flake pastes (2012)
  • Author(s): Soichi Sakamoto, and Katsuaki Suganuma
  • Organizer: 2012 7th International Conference on Integrated Power Electronics Systems
  • Place of Presentation: Nuremberg, Germany
• [Presentation] Thermo Mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes (2012)
  • Author(s): Soichi Sakamoto, and Katsuaki. Suganuma
  • Organizer: The 15th SANKEN International Symposium / The 10th SANKEN Nanotechnology Symposium
  • Place of Presentation: Osaka, Japan
• [Presentation] Thermomechanical Reliability of Ag Sinter Joining in Thermal Cycling (2012)
  • Author(s): Soichi Sakamoto
  • Organizer: 8th Handai Nanoscience and Nanotechnology, International Symposium
  • Place of Presentation: Osaka
• [Presentation] Thermo Mechanical Reliability of Low Energy Ag Die Bonding (2012)
  • Author(s): Tohru Sugahara
  • Organizer: International Welding / Joining Conference Korea 2012
  • Place of Presentation: Korea
  • Invited
• [Presentation] Low temperature die-bonding with Ag flakes (2011)
  • Author(s): Soichi Sakamoto, and Katsuaki. Suganuma
  • Organizer: European Microelectronics and Packaging Conference 2011
  • Place of Presentation: Brighton, UK
• [Presentation] Die bonding materials for low temperature joinning with Ag flakes (2011)
  • Author(s): Soichi Sakamoto, and Katsuaki. Suganuma
  • Organizer: MES2011
  • Place of Presentation: Osaka, Japan
• [Book] 鉛フリーはんだ付け入門 (2013)
  • Author(s): 菅沼 克昭
  • Publisher: 大阪大学出版会