Room temperature and ambient condition joint materials fabrication with metal nano-inks
| Project/Area Number |
23656464
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Multi-year Fund |
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| Research Field |
Material processing/treatments
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| Research Institution | Osaka University |
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Principal Investigator |
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| Project Period (FY) |
2011 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
|
| Budget Amount *help |
¥3,640,000 (Direct Cost: ¥2,800,000、Indirect Cost: ¥840,000)
Fiscal Year 2012: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2011: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
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| Keywords | 常温接合 / 拡散接合 / ナノ粒子 / 低エネルギー |
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| Research Abstract |
The jointing properties of silver nano-inks at a low or room temperature are investigated using the room temperature sintering and wiring techniques of silver nano-particles. The shear strength and the electrical resistance of the jointing were evaluated as an optimization solvent dispersion of silver nanoparticles and surface state of the substrate. As results of this study, a design guideline of room-temperature jointing was obtained.
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Report
(3 results)
Research Products
(15 results)
