| Project/Area Number |
23656465
|
|---|
| Research Category |
Grant-in-Aid for Challenging Exploratory Research
|
| Allocation Type | Multi-year Fund |
|---|
| Research Field |
Material processing/treatments
|
|---|
| Research Institution | Osaka University |
|---|
Principal Investigator |
|
|---|
| Co-Investigator(Renkei-kenkyūsha) |
TAKENAKA Kosuke 大阪大学, 接合科学研究所, 助教 (60432423)
|
|---|
| Project Period (FY) |
2011 – 2012
|
| Project Status |
Completed (Fiscal Year 2012)
|
| Budget Amount *help |
¥3,900,000 (Direct Cost: ¥3,000,000、Indirect Cost: ¥900,000)
Fiscal Year 2012: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2011: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
|
|---|
| Keywords | プラズマ加工 / 無機/有機界面 / 無機/有機積層 / 無機／有機界面 / 無機／有機積層 |
|---|
| Research Abstract |
This research project has been carried out to seek for breakthroughs toovercome constraints involved in plasma processes for formation of functional inorganic layeron organic layer through integrated reaction studies on plasma interactions with nanolayers atsurface and interface. The results obtained from this project have indicated feasibility of lowdamage plasma process to reduce the damage-layer thickness as thin as a few nm especiallyvia controlling the energy of ion bombardment during the reactive plasma process.
|
