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Vapor-assisted hybrid bonding of organic/inorganic substrates at low temperature and atmospheric pressure

Research Project

Project/Area Number 23686057
Research Category

Grant-in-Aid for Young Scientists (A)

Allocation TypeSingle-year Grants
Research Field Electron device/Electronic equipment
Research InstitutionNational Institute for Materials Science

Principal Investigator

SHIGETOU Akitsu  独立行政法人物質・材料研究機構, 環境・エネルギー材料部門 ハイブリッド材料ユニット, 主任研究員 (70469758)

Project Period (FY) 2011-04-01 – 2014-03-31
Project Status Completed (Fiscal Year 2013)
Budget Amount *help
¥28,340,000 (Direct Cost: ¥21,800,000、Indirect Cost: ¥6,540,000)
Fiscal Year 2013: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
Fiscal Year 2012: ¥5,330,000 (Direct Cost: ¥4,100,000、Indirect Cost: ¥1,230,000)
Fiscal Year 2011: ¥20,280,000 (Direct Cost: ¥15,600,000、Indirect Cost: ¥4,680,000)
Keywords接合 / 実装 / 低温 / 大気圧 / 異種材料 / ハイブリッド / MEMS / インターコネクション / ヘテロインテグレーション / インターコネクト
Research Abstract

Vapor-assisted hybrid bondings of Cu, Ti, glass, quartz, and polydimethylsiloxane (PDMS) were realized at 150 C and atmospheric pressure. Unlike the conventional Ar fast atom beam bombardment in high vacuum, we utilized the vacuum ultraviolet (VUV) irradiation in the nitrogen gas. We found out that the initial surface contaminants were successfully removed, a part of metal oxide was reduced due probably to the hydrogen radical created from the residual water. For such surfaces, the molecular water was coordinated and created thin bridging layer, where the hydrogen bond contributed to the initial contact between surfaces, followed by the dehydration shrinkage to make the interfacial structure stable. All the starting materials were tightly bonded; in particular, the interface between PDMS substrates indicated considerably small loss of transparency among 380 - 1000 nm. Moreover, this method was applied for the interconnection of ultrathin graphite electrodes.

Report

(4 results)
  • 2013 Annual Research Report   Final Research Report ( PDF )
  • 2012 Annual Research Report
  • 2011 Annual Research Report
  • Research Products

    (77 results)

All 2014 2013 2012 2011 Other

All Journal Article (16 results) (of which Peer Reviewed: 16 results) Presentation (45 results) (of which Invited: 13 results) Book (6 results) Remarks (6 results) Patent(Industrial Property Rights) (4 results) (of which Overseas: 2 results)

  • [Journal Article] Graphene–Graphene Monolayer Direct Bonding at Room Temperature Using Vacuum Ultraviolet/Vapor-Assisted Method2014

    • Author(s)
      A. Mano, J. Mizuno, S. Shoji, and A
    • Journal Title

      Appl. Phy. Lett

      Volume: (appear)

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Hybrid Au-Adhesive Bonding by Using Planar Adhesive Structure for 3D LSI2014

    • Author(s)
      M. Nimura, J. Mizuno, A. Shigetou. (other authors)
    • Journal Title

      IEEE Transactions on Components, Packaging, and Manufacturing Technology

      Volume: vol. 4 Pages: 762-768

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Hybrid Au-Adhesive Bonding by Using Planar Adhesive Structure for 3D LSI2014

    • Author(s)
      M. Nimura, J. Mizuno, A. Shigetou et. al.
    • Journal Title

      IEEE Transactions on Components, Packaging, and Manufacturing Technology

      Volume: -

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Study on Hybrid Au-Underfill resin Bonding Method with Lock-and-key Structure for 3D Integration2013

    • Author(s)
      M. Nimura, J. Mizuno, A. Shigetou, (other authors)
    • Journal Title

      IEEE Transactions on Components, Packaging, and Manufacturing Technology

      Volume: vol. 3, No. 4

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Vacuum Ultraviolet Irradiation Treatment for Reducing Gold - Gold Bonding Temperature2013

    • Author(s)
      A. Okada, S. Shoji, M. Nimura1, A. Shigetou, K. Sakuma and J. Mizuno
    • Journal Title

      Materials Transactions

      Volume: Vol. 54, No. 11

    • NAID

      130004824999

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Study on Hybrid Au-Underfill resin Bonding Method with Lock-and-key Structure for 3D Integration2013

    • Author(s)
      M. Nimura, J. Mizuno, A. Shigetou et. al.
    • Journal Title

      IEEE Transactions on Components, Packaging, and Manufacturing Technology

      Volume: 3 Issue: 4 Pages: 558-565

    • DOI

      10.1109/tcpmt.2013.2240566

    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Vacuum Ultraviolet Irradiation Treatment for Reducing Gold–Gold Bonding Temperature2013

    • Author(s)
      A. Okada, S. Shoji, M. Nimura, A. Shigetou et. al.
    • Journal Title

      MATERIALS TRANSACTIONS

      Volume: 54 Issue: 11 Pages: 2139-2143

    • DOI

      10.2320/matertrans.MF201313

    • NAID

      130004824999

    • ISSN
      1345-9678, 1347-5320
    • Related Report
      2013 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Study on Hybrid Au-underfill resin Bonding Method with Lock-and-key Structure for 3D Integration2013

    • Author(s)
      Masatsugu Nimura
    • Journal Title

      IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY

      Volume: 00 Pages: 0-0

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150 C and Atmospheric Pressure2012

    • Author(s)
      A. Shigetou and T. Suga
    • Journal Title

      Journal of Electronic Materials

      Volume: Vol. 41, No. 8 Pages: 2274-2280

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Eco-Friendly Bonding Technologies for Hybrid Integration2012

    • Author(s)
      A. Shigetou, J. Mizuno, and K. Yasuda
    • Journal Title

      Surface Mount Technology(韓国尖端社)(Ohm社共同出版)

      Volume: No. 8 Pages: 60-65

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] 環境調和型実装技術:省エネルギ,新材料,新しい技術第二部低環境負荷な接合手法による異種材料のハイブリッド化2012

    • Author(s)
      重藤暁津,水野潤,安田清和
    • Journal Title

      エレクトロニクス実装学会誌

      Volume: vol. 15, No. 1

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Nanoadhesion Layer for Enhanced Si-Si and Si-SiN Wafer Bonding2012

    • Author(s)
      R. Kondou, C. Wang, A. Shigetou, and T. Suga
    • Journal Title

      Journal of Microelectronics Reliability

      Volume: vol. 52, No. 2 Pages: 342-346

    • Related Report
      2013 Final Research Report
    • Peer Reviewed
  • [Journal Article] Eco-friendly bonding technologies for hybrid integration2012

    • Author(s)
      Akitsu Shigetou
    • Journal Title

      表面実装技術(韓国語,韓国 尖端社)

      Volume: 8 Pages: 60-65

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO2, and Polyimide at 150 C and Atmospheric Pressure2012

    • Author(s)
      Akitsu Shigetou
    • Journal Title

      JOURNAL OF ELECTRONIC MATERIALS

      Volume: 41 Issue: 8 Pages: 2274-2280

    • DOI

      10.1007/s11664-012-2091-9

    • Related Report
      2012 Annual Research Report
    • Peer Reviewed
  • [Journal Article] Low Temperature Processing for Microelectronics and Microsystems Packaging2012

    • Author(s)
      Ryuichi Kondou
    • Journal Title

      Microelectronics Reliability

      Volume: 52 Issue: 2 Pages: 342-346

    • DOI

      10.1016/j.microrel.2010.12.006

    • Related Report
      2011 Annual Research Report
    • Peer Reviewed
  • [Journal Article] 低環境負荷な接合手法による異種材料のハイブリッド化2012

    • Author(s)
      重藤暁津
    • Journal Title

      JOURNAL OF JAPAN INSTITUTE OF ELECTRONICS PACKAGING

      Volume: 15 Pages: 29-33

    • Related Report
      2011 Annual Research Report
    • Peer Reviewed
  • [Presentation] 真空紫外光照射を用いた有機/無機基板材料の大気圧低温混載接合2013

    • Author(s)
      重藤暁津
    • Organizer
      社)エレクトロニクス実装学会2013ワークショップ
    • Place of Presentation
      静岡
    • Year and Date
      2013-10-18
    • Related Report
      2013 Final Research Report
  • [Presentation] 有機・無機材料ハイブリッド化のための大気圧低温接合手法2013

    • Author(s)
      重藤暁津
    • Organizer
      日立研究所有機材料研究会
    • Place of Presentation
      東京
    • Year and Date
      2013-09-27
    • Related Report
      2013 Final Research Report
  • [Presentation] 低温大気圧で実行可能な有機・無機混載材料創製のためのハイブリッド接合技術2013

    • Author(s)
      重藤暁津
    • Organizer
      科学研究費補助金新学術領域生物規範高額合同研究会
    • Place of Presentation
      沖縄
    • Year and Date
      2013-07-02
    • Related Report
      2013 Final Research Report
  • [Presentation] 大気圧低温接合技術による異種材料ハイブリッド化の展望2013

    • Author(s)
      重藤暁津
    • Organizer
      (独)日本学術振興会システムデザイン・インテグレーション第177委員会第28回研究会
    • Place of Presentation
      東京
    • Year and Date
      2013-06-18
    • Related Report
      2013 Final Research Report
  • [Presentation] Bonding method in low temperature, atmospheric pressure, and low toxicity conditions for hybrid materials2013

    • Author(s)
      A. Shigetou
    • Organizer
      IZM Workshop on Nanotechnology and Environmental Engineering
    • Place of Presentation
      Berlin, Germany
    • Year and Date
      2013-05-24
    • Related Report
      2013 Final Research Report
  • [Presentation] VUV-assisted hybrid bonding of organic/inorganic substrate at atmospheric pressure2013

    • Author(s)
      A. Shigetou
    • Organizer
      IEEE CPMT International Conference on Electronics Packaging (ICEP)
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2013-04-13
    • Related Report
      2013 Final Research Report
  • [Presentation] 大気圧低温で実行可能な異種材料混載接合手法2013

    • Author(s)
      重藤暁津
    • Organizer
      (社)エレクトロニクス実装学会第4回公開研究会部品内蔵基板の最新技術
    • Place of Presentation
      東京
    • Year and Date
      2013-02-14
    • Related Report
      2013 Final Research Report
  • [Presentation] VUV-assisted hybrid bonding of organic/inorganic substrate at atmospheric pressure2013

    • Author(s)
      A. Shigetou, A. Mano, and J. Mizuno
    • Organizer
      IEEE CPMT International Conference on Electronics Packaging
    • Place of Presentation
      大阪国際会議場,大阪,日本
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] Bonding method in low temperature, atmospheric pressure, and low toxicity conditions for hybrid materials2013

    • Author(s)
      A. Shigetou
    • Organizer
      IZM Workshop on Nanotechnology and Environmental Engineering
    • Place of Presentation
      IZM Berlin, Germany
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] 真空紫外光照射を用いた有機/無機基板材料の大気圧低温混載接合2013

    • Author(s)
      重藤 暁津
    • Organizer
      社)エレクトロニクス実装学会2013ワークショップ
    • Place of Presentation
      ラフォーレ修善寺,静岡,日本
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] 有機・無機材料ハイブリッド化のための大気圧低温接合手法2013

    • Author(s)
      重藤 暁津
    • Organizer
      日立研究所 有機材料研究会
    • Place of Presentation
      日立,茨城,日本
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] 大気圧低温接合技術による異種材料ハイブリッド化の展望2013

    • Author(s)
      重藤 暁津
    • Organizer
      独)日本学術振興会 システムデザイン・インテグレーション第177委員会 第28回研究会
    • Place of Presentation
      学術振興会館,東京,日本
    • Related Report
      2013 Annual Research Report
    • Invited
  • [Presentation] Graphene-graphene room temperature direct bonding by using VUV/vapor-assisted at atmospheric pressure2013

    • Author(s)
      A. Mano, A. Shigetou, J. Mizuno, and S. Shoji
    • Organizer
      IEEE WaferBond 2013
    • Place of Presentation
      ストックホルム国立大学,Stockholm, Sweden
    • Related Report
      2013 Annual Research Report
  • [Presentation] VUV-Assisted Low Temperature Bonding For Organic/Inorganic Hybrid Integration at Atmospheric Pressure2013

    • Author(s)
      A. Shigetou, A Mano, J. Mizuno
    • Organizer
      IEEE CPMT Symposium Japan
    • Place of Presentation
      京都大学,京都,日本
    • Related Report
      2013 Annual Research Report
  • [Presentation] Room Temperature Bonding of Polymer/Polymer and Polymer/Glass using modified Surface Activation Bonding Method2013

    • Author(s)
      T. Matsumae, M. Fujino, A. Shigetou et. al.
    • Organizer
      IEEE CPMT ICEP 2013
    • Place of Presentation
      大阪国際会議場,大阪,日本
    • Related Report
      2013 Annual Research Report
  • [Presentation] Hybrid Au-Au Bonding Technology using Planar Adhesive Structure for 3D Integration2013

    • Author(s)
      M. Nimura, J. Mizuno, A. Shigetou et. al.
    • Organizer
      IEEE CPMT ICEP 2013
    • Place of Presentation
      大阪国際会議場,大阪,日本
    • Related Report
      2013 Annual Research Report
  • [Presentation] 中間層を用いた表面活性化手法によるポリマー/ポリマーおよびポリマー/ガラス常温接合2013

    • Author(s)
      松前貴司
    • Organizer
      エレクトロニクス実装学会春期講演大会
    • Place of Presentation
      東北大学
    • Related Report
      2012 Annual Research Report
  • [Presentation] 真空紫外光照射を利用した金属,樹脂基板の大気圧混載接合2013

    • Author(s)
      重藤暁津
    • Organizer
      エレクトロニクス実装学会春期講演大会
    • Place of Presentation
      東北大学
    • Related Report
      2012 Annual Research Report
  • [Presentation] 大気圧低温で実行可能な異種材料混載接合手法2013

    • Author(s)
      重藤暁津
    • Organizer
      エレクトロニクス実装学会 第4回公開研究会 部品内蔵基板の最新技術
    • Place of Presentation
      回路会館,東京
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] Hybrid Bonding in Ambient Air–A Feasible Tool for Mixed Integrations2012

    • Author(s)
      A. Shigetou
    • Organizer
      IEEE/CPMT Society Evening Meeting, IEEE CPMT Japan Chapter
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2012-10-12
    • Related Report
      2013 Final Research Report
  • [Presentation] UV/Vapor-Assisted表面改質による透明有機/無機基板の低温大気圧接合2012

    • Author(s)
      重藤暁津
    • Organizer
      第196回有機エレクトロニクス材料研究会,社団法人有機エレクトロニクス材料研究会
    • Place of Presentation
      東京
    • Year and Date
      2012-10-05
    • Related Report
      2013 Final Research Report
  • [Presentation] Low Temperature Hybrid Bonding of Organic/Inorganic Substrates at Atmospheric Pressure2012

    • Author(s)
      A. Shigetou
    • Organizer
      Proceedings of IMAPS 45^<th> International Symposium on Microelectronics
    • Place of Presentation
      San Diego, USA
    • Year and Date
      2012-09-12
    • Related Report
      2013 Final Research Report
  • [Presentation] Vapor-Assisted Hybrid Bonding of Inorganic/Organic Substrates for 3D Hetero-Integration2012

    • Author(s)
      A. Shigetou and T. Suga
    • Organizer
      Proceedings of IEEE/CPMT 3^<rd> International Workshop on LTB-3D
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2012-05-22
    • Related Report
      2013 Final Research Report
  • [Presentation] Hybrid bonding in ambient air – a feasible tool for mixed integrations2012

    • Author(s)
      Akitsu Shigetou
    • Organizer
      IEEE CPMT Society Evening Meeting
    • Place of Presentation
      東京工業大学
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] UV/Vapor-Assisted表面改質による 透明有機/無機基板の低温大気圧接合2012

    • Author(s)
      重藤暁津
    • Organizer
      第196回有機エレクトロニクス材料研究会
    • Place of Presentation
      早稲田大学
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] Low Temperature Hybrid Bonding of Organic/Inorganic Substrates at Atmospheric Pressure2012

    • Author(s)
      Akitsu Shigetou
    • Organizer
      45th International Symposium on Microelectronics
    • Place of Presentation
      Town & Country Resort & Convention Center,San DIego,USA
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] Hybrid Bonding of Organic/Inorganic Substrates in Ambient Air for Eco-Friendly 3D Integration of Microelectronics2012

    • Author(s)
      Akitsu Shigetou
    • Organizer
      Electronics Goes Green 2012
    • Place of Presentation
      Seminaris Dahlem Cube,Berlin,Germany
    • Related Report
      2012 Annual Research Report
  • [Presentation] UV/Vapor-Assisted Hybrid Bonding Technology as a Tool for Future Nanopackaging2012

    • Author(s)
      Akitsu Shigetou
    • Organizer
      IEEE NANO
    • Place of Presentation
      International Convention Center,BIrmingham,UK
    • Related Report
      2012 Annual Research Report
  • [Presentation] Vapor-assisted hybrid bonding of inorganic/organic substrates for 3D hetero-integration2012

    • Author(s)
      Akitsu Shigetou
    • Organizer
      3rd IEEE International Workshop on LTB-3D
    • Place of Presentation
      東京大学
    • Related Report
      2012 Annual Research Report
    • Invited
  • [Presentation] Study of surface treatment process using VUV/O3 treatment for Au-Au bonding2012

    • Author(s)
      Jun Mizuno
    • Organizer
      Japan society for the promotion of science
    • Place of Presentation
      Hotel Nikko Toyohashi,愛知
    • Related Report
      2012 Annual Research Report
  • [Presentation] Hybrid Au-Underfill Resin Bonding with Lock-and-Key Structure2012

    • Author(s)
      Masatsugu Nimura
    • Organizer
      62nd Electronics Components and Technology Conference (ECTC)
    • Place of Presentation
      Sheraton San Diego,San Diego,USA
    • Related Report
      2012 Annual Research Report
  • [Presentation] Hybrid solder-adhesive bonding using simple resin planarization technique for 3D LSI2012

    • Author(s)
      Masatsugu Nimura
    • Organizer
      3rd IEEE International Workshop on LTB-3D
    • Place of Presentation
      東京大学
    • Related Report
      2012 Annual Research Report
  • [Presentation] Low temperature Au-Au flip chip bonding with VUV/O3 treatment for 3D integration2012

    • Author(s)
      Akiko Okada
    • Organizer
      3rd IEEE International Workshop on LTB-3D
    • Place of Presentation
      東京大学
    • Related Report
      2012 Annual Research Report
  • [Presentation] Sn-Auフリップチップ接合における界面への真空紫外光およびギ酸を用いたフラックスッレス接合技術の基礎検討2012

    • Author(s)
      宇波奈保子
    • Organizer
      MATE 2012 エレクトロニクスにおけるマイクロ接合・実装技術シンポジウム
    • Place of Presentation
      パシフィコ横浜,横浜,日本(Japan)
    • Related Report
      2011 Annual Research Report
  • [Presentation] Low Temperatures Hybrid Bonding in Ambient Air for Homo/Heterogeneous 3D Integration2011

    • Author(s)
      A. Shigetou
    • Organizer
      1st LRSM–NIMS Materials Workshop
    • Place of Presentation
      Ibaraki, Japan
    • Year and Date
      2011-12-21
    • Related Report
      2013 Final Research Report
  • [Presentation] Low Temperatures Hybrid Bonding in Ambient Air for Homo/Heterogeneous 3D Integration2011

    • Author(s)
      A. Shigetou
    • Organizer
      1st Fraunhofer IZM & NIMS workshop
    • Place of Presentation
      Ibaraki, Japan
    • Year and Date
      2011-11-15
    • Related Report
      2013 Final Research Report
  • [Presentation] 大気圧低温接合技術の系譜,原理,技術動向2011

    • Author(s)
      重藤暁津
    • Organizer
      東京エレクトロン九州合同研究会
    • Place of Presentation
      熊本
    • Year and Date
      2011-11-11
    • Related Report
      2013 Final Research Report
  • [Presentation] 有機・無機基板混載のための接合技術2011

    • Author(s)
      重藤暁津
    • Organizer
      社団法人有機エレクトロニクス研究会,190回研究会3次元実装技術の最新情報~トレンド・最新技術・応用
    • Place of Presentation
      東京
    • Year and Date
      2011-10-14
    • Related Report
      2013 Final Research Report
  • [Presentation] Low-Temperature Homo/Hetero - geneous Bonding in Ambient Air for Future 3D-TSV2011

    • Author(s)
      A. Shigetou
    • Organizer
      SEMATECH Symposium Japan and ISMI Regional Meeting Series
    • Place of Presentation
      Tokyo, Japan
    • Year and Date
      2011-06-23
    • Related Report
      2013 Final Research Report
  • [Presentation] Vapor-Assisted Surface Activation Bonding for Low-Temperature Hetero Integration in Ambient Air2011

    • Author(s)
      A. Shigetou
    • Organizer
      CRC Press 2011 CMOS Emerging Technology Meeting
    • Place of Presentation
      British Colombia, CA
    • Year and Date
      2011-06-17
    • Related Report
      2013 Final Research Report
  • [Presentation] Homo/Heterogeneous Bonding of Cu, SiO2, and Polyimide by Low Temperature Vapor- Assisted Surface Activation Method2011

    • Author(s)
      Akitsu Shigetou
    • Organizer
      61st Electronic Components and Technology Conference (ECTC)
    • Place of Presentation
      Walt Disney World Swan and Dolphin Resort,Lake Buena Vista, Florida,USA
    • Related Report
      2011 Annual Research Report
  • [Presentation] Vapor-Assisted Surface Activation Bonding for Low-Temperature Hetero Integration in Ambient Air2011

    • Author(s)
      Akitsu Shigetou
    • Organizer
      2011 CMOS Emerging Technology Meeting
    • Place of Presentation
      Hilton Resort,Whistler, British Colombia,Canada
    • Related Report
      2011 Annual Research Report
    • Invited
  • [Presentation] Low-Temperature Homo/Heterogeneous Bonding in Ambient Air for Future 3D-TSV2011

    • Author(s)
      Akitsu Shigetou
    • Organizer
      SEMATECH Symposium Japan and ISMI Regional Meeting Series
    • Place of Presentation
      東京コンファレンスセンター品川,東京,日本
    • Related Report
      2011 Annual Research Report
    • Invited
  • [Presentation] 有機/無機基板混載のための接合技術2011

    • Author(s)
      重藤暁津
    • Organizer
      有機エレクトロニクス材料研究会
    • Place of Presentation
      早稲田大学 研究開発センター,東京,日本
    • Related Report
      2011 Annual Research Report
    • Invited
  • [Presentation] Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment2011

    • Author(s)
      Naoko Unami
    • Organizer
      International symposium on Advanced Packaging Materials
    • Place of Presentation
      Silicon Valley,San Jose, CA,USA
    • Related Report
      2011 Annual Research Report
  • [Book] ハイブリッド材料創製のツールとしての接合技術,"PEN NEWS LETTER 9月号web版2013

    • Author(s)
      重藤暁津
    • Related Report
      2013 Final Research Report
  • [Book] ハイブリッド材料創製のツールとしての接合技術2013

    • Author(s)
      重藤 暁津
    • Total Pages
      4
    • Publisher
      PEN NEWS LETTER(ISSN 2185 - 3231)
    • Related Report
      2013 Annual Research Report
  • [Book] 日経BP電子版2013

    • Author(s)
      低温.大気圧下の異種材料接合技術に熱い注目,課題は信頼性評価手法の確立 - IEEE CPMT ICEP速報記事
    • Total Pages
      3
    • Publisher
      日経BP
    • Related Report
      2013 Annual Research Report
  • [Book] 3次元SiPのためのバンプレスインタコネクト,"16章, 3次元システムインパッケージと材料技術2012

    • Author(s)
      重藤暁津, 26名
    • Publisher
      シーエムシー出版
    • Related Report
      2013 Final Research Report
  • [Book] 3次元システムインパッケージと材料技術2012

    • Author(s)
      重藤暁津 他26名共同執筆
    • Total Pages
      294
    • Publisher
      シーエムシー出版
    • Related Report
      2012 Annual Research Report
  • [Book] Surface Modification Bonding at Low Temperature for Three-Dimensional Hetero-Integration,"3D Integration for VLSI Systems2011

    • Author(s)
      A. Shigetoul. (other 13 authors, no order)
    • Publisher
      Pan Stanford Publishing
    • Related Report
      2013 Final Research Report
  • [Remarks] ICEP 2013 IEEE CPMT Japan Chapter Young Award, for"VUV/O2 treatment for reduction of Au-Au bonding temperature, Toyama, Japan 2014/04

    • Related Report
      2013 Final Research Report
  • [Remarks] Best Poster Conference Paper, IEEE/IOP, for"UV/Vapor-Assisted Hybrid Bonding as a Took for Future Nanopackaing, Birmingham, UK 2012/08

    • Related Report
      2013 Final Research Report
  • [Remarks] Best Presentation Award, IEEE CPMT Japan Society, for"Hybrid Solder-Adhesive Bonding Using Simple Resin Planarization Technique for 3D LSI," Planarization Technique for 3D LSI,, Tokyo, Japan, 2012/05

    • Related Report
      2013 Final Research Report
  • [Remarks] 異なる材質水で接着, 日刊工業新聞, 012/10/25

    • Related Report
      2013 Final Research Report
  • [Remarks] 低温.大気圧下の異種材料接合技術に熱い注目,課題は信頼性評価手法の確立, 日経BP電子版IEEE CPMT ICEP速報記事,2013/04/12

    • Related Report
      2013 Final Research Report
  • [Remarks] 物材機構、異なる材料を水で接合する技術開発(日刊工業新聞記事)

    • URL

      http://www.nikkan.co.jp/news/nkx0820121025eaac.html

    • Related Report
      2012 Annual Research Report
  • [Patent(Industrial Property Rights)] 金属材の拡散接合方法および金属材の拡散接合装置 発明者:重藤暁津,岡田愛姫子,水野潤,庄子習一 権利者2013

    • Industrial Property Rights Holder
      独立行政法人物質材料研究機構,早稲 田大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-03-26
    • Related Report
      2013 Final Research Report
    • Overseas
  • [Patent(Industrial Property Rights)] 接合装置と接合方法2013

    • Inventor(s)
      重藤暁津,水野潤,庄子習一
    • Industrial Property Rights Holder
      独立行政法人物質材料研究機構,早稲田大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-09-05
    • Related Report
      2013 Final Research Report
    • Overseas
  • [Patent(Industrial Property Rights)] 金属材の拡散接合方法および金属材の拡散接合装置2013

    • Inventor(s)
      重藤暁津,水野潤,庄子習一
    • Industrial Property Rights Holder
      独立行政法人物質材料研究機構,早稲田大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-09-05
    • Related Report
      2013 Annual Research Report
  • [Patent(Industrial Property Rights)] 金属材の拡散接合方法および金属材の拡散接合装置2013

    • Inventor(s)
      重藤暁津,水野潤,岡田愛姫子,仁村将次,庄子習一
    • Industrial Property Rights Holder
      独立行政法人物質・材料研究機構,学校法人早稲田大学
    • Industrial Property Rights Type
      特許
    • Filing Date
      2013-03-26
    • Related Report
      2012 Annual Research Report

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Published: 2011-04-06   Modified: 2019-07-29  

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