Evaluation of Mechanical Properties of Thin film Structure by UsingMEMS Technology
| Project/Area Number |
23760103
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Ritsumeikan University |
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Principal Investigator |
ANDO Taeko 立命館大学, 理工学部, 准教授 (70335074)
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| Project Period (FY) |
2011 – 2012
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| Project Status |
Completed (Fiscal Year 2012)
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| Budget Amount *help |
¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000)
Fiscal Year 2012: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2011: ¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000)
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| Keywords | マイクロマシン / マイクロ材料 / 破壊力学 / 半導体材料 / 単結晶シリコン / 機械的特性 / ヤング率 / 引張強度 / 不純物濃度 / マイクロ材料力学 / MEMS / 破壊特性 / 脆性延性遷移 |
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| Research Abstract |
The objective of this study is to reveal the factor influencing the fracture property of single crystal silicon in micro- and nano-scale. We have developed the tensile testing device for dealing with microscale samples. Concentration of impurities (B and Ge) in three testing material were different from each other. Measured Young’s modulus and fracture strength decreased with increasing the impurities concentration.
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Report
(3 results)
Research Products
(4 results)
