Silicon Slicing for UltrathinKerf Loss
| Project/Area Number |
23760116
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Production engineering/Processing studies
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| Research Institution | University of Miyazaki (2012)
Kyushu University (2011) |
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Principal Investigator |
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| Project Period (FY) |
2011 – 2012
|
| Project Status |
Completed (Fiscal Year 2012)
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| Budget Amount *help |
¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000)
Fiscal Year 2012: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2011: ¥3,640,000 (Direct Cost: ¥2,800,000、Indirect Cost: ¥840,000)
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| Keywords | シリコンスライシング / カーフロス / 炭素繊維 / ワイヤ放電加工 / ワイヤ放電スライシング / ワイヤソースライシング |
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| Research Abstract |
Revelation of characteristics for various electric discharge machining parameters in slicing of silicon was tackled, and theguideline for good slicing of silicon was shown. Then, the prototypic wire electric discharge machine for using carbon fiber as electrode was developed. Further, processing conditions suitable for using carbon fiber as electrode were investigated. The way for realization of ultrathin kerf loss which was useless parts removed as chip by wire electric discharge machine with carbon fiber electrode was paved.
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Report
(3 results)
Research Products
(6 results)
