Development of the thermal contact sensor for inspection of defects on wafer surface
| Project/Area Number |
23860005
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| Research Category |
Grant-in-Aid for Research Activity Start-up
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| Allocation Type | Single-year Grants |
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| Research Field |
Design engineering/Machine functional elements/Tribology
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| Research Institution | Tohoku University |
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Principal Investigator |
SHIMIZU Yuki 東北大学, 大学院・工学研究科, 准教授 (70606384)
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| Project Period (FY) |
2011 – 2012
|
| Project Status |
Completed (Fiscal Year 2012)
|
| Budget Amount *help |
¥2,990,000 (Direct Cost: ¥2,300,000、Indirect Cost: ¥690,000)
Fiscal Year 2012: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2011: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
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| Keywords | 接触センサ / 摩擦熱 / デフェクト / ウエハ検査 / FEM |
|---|
| Research Abstract |
A feasibility of newly-proposed concept for the detection of small defects on smoothly-finished surfaces has been investigated. An estimated temperature rise of the thermal element, which would detect small amount of frictional heat due to contact with a defect was analyzed based on FEM simulations. In addition, experiments were carried out with fabricated prototype of the thermal element to confirm the feasibility of the proposed concept.
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Report
(3 results)
Research Products
(25 results)
