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ニアスレッショルド電圧動作で切り拓く耐タンパコンピューティング基盤
Research Project
All
Fiscal Year 2024
grantAwardInfo
Project/Area Number
23K28053
Research Category
Grant-in-Aid for Scientific Research (B)
Allocation Type
Multi-year Fund
Section
一般
Review Section
Basic Section 60040:Computer system-related
Basic Section 60090:High performance computing-related
Sections That Are Subject to Joint Review: Basic Section60040:Computer system-related , Basic Section60090:High performance computing-related
Research Institution
Osaka University
Principal Investigator
塩見 準
大阪大学, 大学院情報科学研究科, 准教授 (40809795)
Project Period (FY)
2024-02-28 – 2026-03-31
Project Status
Adopted (Fiscal Year 2024)
Budget Amount
*help
¥12,220,000 (Direct Cost: ¥9,400,000、Indirect Cost: ¥2,820,000)
Fiscal Year 2025: ¥5,980,000 (Direct Cost: ¥4,600,000、Indirect Cost: ¥1,380,000)
Fiscal Year 2024: ¥6,240,000 (Direct Cost: ¥4,800,000、Indirect Cost: ¥1,440,000)