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Development of Reliability Evaluation Technique for Fatigue Failure in Electronic Packages by Applying Integrated Nondestructive Monitoring Based on Synchrotron Radiation Micro-tomography

Research Project

Project/Area Number 24560120
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Materials/Mechanics of materials
Research InstitutionToyama Industrial Technology Center,

Principal Investigator

SAYAMA Toshihiko  富山県工業技術センター, 機械電子研究所 機械システム課, 課長 (40416128)

Co-Investigator(Kenkyū-buntansha) TSURITANI Hiroyuki  富山県工業技術センター, 機械電子研究所機械システム課, 主任研究員 (70416147)
Co-Investigator(Renkei-kenkyūsha) KENTARO Uesugi  財団法人高輝度光科学研究センター, 利用研究促進部門イメージングチーム, 研究員 (80344399)
MORI Takao  富山県立大学, 工学部, 教授 (30275078)
Project Period (FY) 2012-04-01 – 2015-03-31
Project Status Completed (Fiscal Year 2014)
Budget Amount *help
¥5,460,000 (Direct Cost: ¥4,200,000、Indirect Cost: ¥1,260,000)
Fiscal Year 2014: ¥910,000 (Direct Cost: ¥700,000、Indirect Cost: ¥210,000)
Fiscal Year 2013: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2012: ¥3,380,000 (Direct Cost: ¥2,600,000、Indirect Cost: ¥780,000)
Keywords信頼性設計 / 高密度実装 / マイクロ接合部 / X線マイクロCT / 放射光 / はんだ / 熱疲労 / 寿命評価 / 電子デバイス・機器 / モニタリング / 放射光CT / エレクトロニクス実装 / X線マイクロCT / ヘルスモニタリング
Outline of Final Research Achievements

In this work, synchrotron radiation laminography technique was firstly applied to the nondestructive observation and evaluation of actual micro-joints on printed circuit boards. The developed technology realized nondestructive monitoring of the joints through the fatigue process, in which the joints deform, the cracks initiate, propagate, and reach to failure, and then led to the integrated estimation of the fatigue lifetime. This result will widely contribute to the improvement of the reliability and the development of electronic equipment.

Report

(4 results)
  • 2014 Annual Research Report   Final Research Report ( PDF )
  • 2013 Research-status Report
  • 2012 Research-status Report
  • Research Products

    (11 results)

All 2016 2015 2014 2013 2012

All Journal Article (1 results) (of which Peer Reviewed: 1 results,  Open Access: 1 results) Presentation (10 results)

  • [Journal Article] マイクロ接合部の疲労損傷評価のための非破壊ひずみ測定の可能性試験2016

    • Author(s)
      岡本佳之, 高柳毅, 釣谷浩之, 佐山利彦, 上杉健太朗, 星野真人, 長瀬達則, 森孝男
    • Journal Title

      SPring-8利用研究成果集(電子ジャーナル)

      Volume: 4

    • NAID

      130007969228

    • Related Report
      2014 Annual Research Report
    • Peer Reviewed / Open Access
  • [Presentation] Nondestructive Observation of Thermal Fatigue Crack Propagation in FBGA and Die Attached Solder Joints by Synchrotron Radiation X-Ray Laminography2015

    • Author(s)
      Tsuritani, H., Sayama, T., Okamoto, Y., Takayanagi, T., Hoshino, M., Uesugi, K., Hanamura, T., and Mori, T.
    • Organizer
      ASME InterPACK2015
    • Place of Presentation
      San Francisco
    • Year and Date
      2015-07-06 – 2015-07-09
    • Related Report
      2014 Annual Research Report
  • [Presentation] Evaluation of Fatigue Crack Initiation and Propagation in Thin Solder Joints by Using Lap-joint Shear Specimen with High Stiffness Fixtures2015

    • Author(s)
      Sayama, T., Okamoto, Y., Kinoshita, M., and Mori, T.
    • Organizer
      ASME InterPACK2015
    • Place of Presentation
      San Francisco
    • Year and Date
      2015-07-06 – 2015-07-09
    • Related Report
      2014 Annual Research Report
  • [Presentation] ダイアタッチはんだ接合部における熱疲労き裂進展の放射光X線ラミノグラフィによる非破壊観察2015

    • Author(s)
      釣谷浩之, 花村拓哉, 佐山利彦, 岡本佳之, 高柳毅, 星野真人, 上杉健太朗, 森孝男
    • Organizer
      第29回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東京大学
    • Year and Date
      2015-03-16 – 2015-03-18
    • Related Report
      2014 Annual Research Report
  • [Presentation] 高剛性ラップジョイントせん断試験によるはんだ接合部の疲労き裂発生寿命評価2014

    • Author(s)
      木下雅巧, 佐山利彦, 釣谷浩之, 岡本佳之, 森孝男
    • Organizer
      日本機械学会2014年度年次大会
    • Place of Presentation
      東京電機大学
    • Year and Date
      2014-09-07 – 2014-09-10
    • Related Report
      2014 Annual Research Report
  • [Presentation] 放射光X線ラミノグラフィを用いたフリップチップはんだ接合部における熱疲労き裂進展過程のモニタリングの可能性評価2014

    • Author(s)
      釣谷浩之
    • Organizer
      第28回エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      拓殖大学
    • Related Report
      2013 Research-status Report
  • [Presentation] Application of synchrotron radiation X-ray laminography to nondestructive evaluation of the fatigue crack propagation process in flip chip solder joints2013

    • Author(s)
      Hiroyuki Tsuritani
    • Organizer
      ASME InterPACK2013
    • Place of Presentation
      San Francisco
    • Related Report
      2013 Research-status Report
  • [Presentation] 放射光X線を光源とするマイクロCTおよびラミノグラフィによるはんだ接合部における熱疲労き裂の検出能力2013

    • Author(s)
      釣谷浩之
    • Organizer
      日本機械学会M&M2013材料力学カンファレンス
    • Place of Presentation
      岐阜大学
    • Related Report
      2013 Research-status Report
  • [Presentation] Nondestructive observation of fatigue crack propagation process in some solder joints by synchrotron radiation X-ray micro-tomography2013

    • Author(s)
      Hiroyuki Tsuritani
    • Organizer
      IEEE CPMT Symposium Japan 2013
    • Place of Presentation
      京都大学
    • Related Report
      2013 Research-status Report
  • [Presentation] 放射光X線ラミノグラフィを用いたフリップチップはんだ接合部における疲労き裂進展過程のモニタリングの可能性評価2013

    • Author(s)
      釣谷 浩之
    • Organizer
      第27回 エレクトロニクス実装学会春季講演大会
    • Place of Presentation
      東北大学
    • Related Report
      2012 Research-status Report
  • [Presentation] 放射光X線ラミノグラフィによるフリップチップはんだ接合部の熱疲労き裂進展評価2012

    • Author(s)
      釣谷 浩之
    • Organizer
      第22回マイクロエレクトロニクスシンポジウム(MES2012)
    • Place of Presentation
      大阪府立大学
    • Related Report
      2012 Research-status Report

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Published: 2013-05-31   Modified: 2019-07-29  

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