| Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2015: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2014: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2013: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2012: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
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| Outline of Final Research Achievements |
To achieve a high efficiency and high reliability of SiC power module which is expected to be a next generation power module, it is important to achieve high functionality of the resin/metal interface. The aim of this study is to create high-performance heterogeneous interfaces. Mechanical properties which are elastic modulus, tensile strength, fracture strain, fatigue properties and viscoelastic properties of cured thin-film of resin have been investigated. The effects of additives such as SiO2 filler and coupling agent on the mechanical properties have been also investigated. In addition, adhesive strength of a resin/copper interface and its degradation behaviors under high temperature and high-humidity/temperature conditions have been investigated. The results indicate that the preservation of coupling effect at high temperatures is effective to inhibit the degradation of the adhesive strength.
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