| Project/Area Number |
24656139
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| Research Category |
Grant-in-Aid for Challenging Exploratory Research
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| Allocation Type | Single-year Grants |
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| Research Field |
Thermal engineering
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| Research Institution | Kyushu University |
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Principal Investigator |
TAKAMATSU Hiroshi 九州大学, 工学(系)研究科(研究院), 教授 (20179550)
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| Co-Investigator(Renkei-kenkyūsha) |
FUKUNAGA Takanobu 九州大学, 大学院工学研究院, 技術職員 (60591196)
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| Project Period (FY) |
2012-04-01 – 2014-03-31
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| Project Status |
Completed (Fiscal Year 2013)
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| Budget Amount *help |
¥4,030,000 (Direct Cost: ¥3,100,000、Indirect Cost: ¥930,000)
Fiscal Year 2013: ¥1,560,000 (Direct Cost: ¥1,200,000、Indirect Cost: ¥360,000)
Fiscal Year 2012: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
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| Keywords | 熱物性 / 測定法 / 薄膜 / 面方向熱伝導率 / センサ / MEMS / 電子デバイス / MEMSセンサ / 熱物性測定法 |
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| Research Abstract |
The objective of the present study was to develop a new method for measuring in-plane thermal conductivity of thin films that are commonly used in the electronic devices. In the proposed method, the temperature of an electrically heated micro-beam-type sensor, a 10 micron long free-standing platinum sensor 40 nm in thickness, is measured in a vacuum chamber. The in-plane thermal conductivity is evaluated from the difference in the temperature rise of the sensor between before and after deposition of a sample film on the top of the sensor. The present study demonstrated the feasibility of the method by measuring a 20 nm thick gold film fabricated by PVD as a sample. The measured thermal conductivity was approximately 30% of the literature value of bulk gold and increased by 7 % after annealing at 140 ºC for 2 hr.
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