| Budget Amount *help |
¥27,300,000 (Direct Cost: ¥21,000,000、Indirect Cost: ¥6,300,000)
Fiscal Year 2014: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
Fiscal Year 2013: ¥5,850,000 (Direct Cost: ¥4,500,000、Indirect Cost: ¥1,350,000)
Fiscal Year 2012: ¥18,980,000 (Direct Cost: ¥14,600,000、Indirect Cost: ¥4,380,000)
|
|---|
| Outline of Final Research Achievements |
In order to produce nano-helices from copper (Cu) by glancing angle deposition (GLAD), a vacuum evaporation system capable of both cooling a substrate and measuring its temperature was developed. Using this system, a thin film consisting of arrays of Cu nano-helices was successfully formed on silicon substrates by maintaining the substrate temperature at Ts/Tm < 0.22 (Ts: substrate temperature, Tm: melting temperature of target material). Additionally, the mechanical properties of nano-helices were examined. Although the nano-helix produced by GLAD possessed high yield stress, its elastic deformation property was governed only by the shape. The thin film consisting of Cu nano-helices exhibited large allowable fracture strain, and did not show fatigue fracture at N = 1×10＾6 cycles.
|
