Local modification of thin film metal by laser peening
| Project/Area Number |
24760070
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Materials/Mechanics of materials
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| Research Institution | Tokyo Institute of Technology |
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Principal Investigator |
AONO Yuko 東京工業大学, 理工学研究科, 助教 (20610033)
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| Project Period (FY) |
2012-04-01 – 2014-03-31
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| Project Status |
Completed (Fiscal Year 2013)
|
| Budget Amount *help |
¥4,550,000 (Direct Cost: ¥3,500,000、Indirect Cost: ¥1,050,000)
Fiscal Year 2013: ¥1,820,000 (Direct Cost: ¥1,400,000、Indirect Cost: ¥420,000)
Fiscal Year 2012: ¥2,730,000 (Direct Cost: ¥2,100,000、Indirect Cost: ¥630,000)
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| Keywords | レーザピーニング / 薄膜金属材料 |
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| Research Abstract |
Laser peening (LP) is a surface treatment method for improving mechanical properties. Conventionally, LP has been applied to bulk material and the treatment is conducted under water medium to prevent expansion of plasma.
In this research, to apply this treatment to thin film metals is objective. The LP has possibility to be a novel treatment method of thin film metal, however the conventional wet-condition treatment is not suitable for thin films. Therefore, LP under dry condition is proposed.
Dry LP uses transparent solid material instead of water for medium. Glass is chosen for the solid medium of dry LP because it shows higher improvement of hardness than that of conventional wet LP. In addition, air gap between specimen and solid medium is considered. As results, the peening effect is confirmed less than 0.1mm of the gap thickness. Finally, the proposed dry LP is applied to thin copper film deposited by sputtering and hardness of the film is improved.
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Report
(3 results)
Research Products
(6 results)
