| Project/Area Number |
24760171
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| Research Category |
Grant-in-Aid for Young Scientists (B)
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| Allocation Type | Multi-year Fund |
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| Research Field |
Thermal engineering
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| Research Institution | Kumamoto University |
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Principal Investigator |
KOITO Yasushi 熊本大学, 自然科学研究科, 准教授 (70347003)
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| Project Period (FY) |
2012-04-01 – 2014-03-31
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| Project Status |
Completed (Fiscal Year 2013)
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| Budget Amount *help |
¥4,290,000 (Direct Cost: ¥3,300,000、Indirect Cost: ¥990,000)
Fiscal Year 2013: ¥780,000 (Direct Cost: ¥600,000、Indirect Cost: ¥180,000)
Fiscal Year 2012: ¥3,510,000 (Direct Cost: ¥2,700,000、Indirect Cost: ¥810,000)
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| Keywords | ヒートパイプ / 熱サイフォン / 熱輸送機器 / 伝熱促進 / サーマルマネージメント / 電子機器冷却 / 電子基板 / 複合基板 / 熱輸送 |
|---|
| Research Abstract |
In order to develop a wiring board having micro heat pipes, a thermosyphon, a capillary-wick and an oscillation heat pipes are fabricated on a surface of a plastic board, and their heat transfer characteristics are investigated by experiments. In experiments, the phenomena inside the heat pipe are observed and the transient variation of temperatures is measured. Moreover, the effective thermal conductivity of the heat pipe is evaluated. From the experimental results, the effectiveness of the phase-change heat transfer inside the plastic board is confirmed.
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