Stiffness Measurement for a cell using multi DOF micro force sensor
Project/Area Number |
24760208
|
Research Category |
Grant-in-Aid for Young Scientists (B)
|
Allocation Type | Multi-year Fund |
Research Field |
Intelligent mechanics/Mechanical systems
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Research Institution | Meijo University (2013) Osaka University (2012) |
Principal Investigator |
OHARA Kenichi 名城大学, 理工学部, 准教授 (50517886)
|
Project Period (FY) |
2012-04-01 – 2014-03-31
|
Project Status |
Completed (Fiscal Year 2013)
|
Budget Amount *help |
¥4,680,000 (Direct Cost: ¥3,600,000、Indirect Cost: ¥1,080,000)
Fiscal Year 2013: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2012: ¥3,250,000 (Direct Cost: ¥2,500,000、Indirect Cost: ¥750,000)
|
Keywords | 微小力センサ / マイクロマニピュレーション / 自動化 / 細胞剛性計測 / マイクロハンド |
Research Abstract |
In this research, we developed multi DOF stiffness measurement system for a cell using two-fingered microhand. In this system, micro force sensors are attached to each finger on two-fingered microhand. By using this system, multi DOF measurement for a cell could be realized. Moreover, this scheme also realized automated stable cell manipulation. Sensor information from each sensor can be used to obtain grasping position for a target cell. Through these research results, high speed cell manipulation and stiffness measurement compared with previous research have been realize. Additionally, new end-effector of two-fingered microhand, which has micro force sensor on it, was considered. And, we confirm the manufacturing procedure for the end effector. Based on this evaluation, the possibility of end effectors with multi DOF micro force sensor is also confirmed.
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Report
(3 results)
Research Products
(13 results)
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[Presentation] Automated Cell Stiffness Measurement with Two-Fingered Microhand using Micro Force Sensor2014
Author(s)
Hiroyuki Yabugaki, Kenichi Ohara, Masaru Kojima, Mitsuhiro Horade, Kazuto Kamiyama, Shinji Sakai, Takanori Kihara, Yasushi Mae, Tamio Tanikawa, and Tatsuo Arai
Organizer
International Conference on IEEE/ASME International Conference on Advanced Intelligent Mechatronics
Place of Presentation
Besancon, France
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