New Network Polymers Using Low Temperature Curable Novel Thermosetting Imide Compound
| Project/Area Number |
25410234
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| Research Category |
Grant-in-Aid for Scientific Research (C)
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| Allocation Type | Multi-year Fund |
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| Section | 一般 |
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| Research Field |
Polymer/Textile materials
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| Research Institution | Osaka Municipal Technical Research Institute |
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Principal Investigator |
Kimura Hajime 地方独立行政法人大阪市立工業研究所, 有機材料研究部, 研究主任 (60416287)
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| Co-Investigator(Kenkyū-buntansha) |
大塚 恵子 地方独立行政法人大阪市立工業研究所, 有機材料研究部, 研究室長 (50416286)
松本 明博 地方独立行政法人大阪市立工業研究所, 企画部, 部長 (40416285)
大石 好行 岩手大学, 理工学部, 教授 (90194076)
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| Research Collaborator |
Ishida Yuichi 宇宙航空研究開発機構
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| Project Period (FY) |
2013-04-01 – 2017-03-31
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| Project Status |
Completed (Fiscal Year 2016)
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| Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2015: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2014: ¥650,000 (Direct Cost: ¥500,000、Indirect Cost: ¥150,000)
Fiscal Year 2013: ¥3,770,000 (Direct Cost: ¥2,900,000、Indirect Cost: ¥870,000)
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| Keywords | 熱硬化性イミド / フェニルエチニル / フェニルエチニルカルボニル / 熱硬化性樹脂 / イミド / 低温硬化 |
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| Outline of Final Research Achievements |
A novel thermosetting imide compound having a respective phenylethynyl carbonyl group at both terminal ends was newly synthesized from an acid anhydride having a phenylethynyl carbonyl group and various diamine compounds. The thermosetting behavior of the obtained novel thermosetting imide compound having phenylethynyl carbonyl groups was analyzed through differential scanning calorimetry measurements and infrared spectroscopic analysis. As a result, it became clear that a curing reaction of phenylethynyl carbonyl groups proceeds at approximately 200C, and that the curing reaction thereof proceeds at a temperature that is lower by 150C or more compared to that of phenylethynyl groups. Moreover, a network polymer obtained from a thermosetting imide compound having respective phenylethynyl carbonyl groups at both terminal ends exhibited extremely superior heat resistance and thermal decomposition resistance.
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Report
(5 results)
Research Products
(34 results)
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[Patent(Industrial Property Rights)] 特許2013
Inventor(s)
木村 肇, 大塚 恵子, 松本 明博, 扇 剛士，大橋 康典
Industrial Property Rights Holder
ハリマ化成株式会社、地方独立行政法人大阪市立工業研究所
Industrial Property Rights Type
特許
Filing Date
2013-10-17
Related Report
Overseas
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[Patent(Industrial Property Rights)] 特許2013
Inventor(s)
大塚 恵子, 木村 肇, 松本 明博, 樫野 智將, 高浜 啓造
Industrial Property Rights Holder
住友べークライト株式会社、地方独立行政法人大阪市立工業研究所
Industrial Property Rights Type
特許
Industrial Property Number
2013-216986
Filing Date
2013-10-16
Related Report
