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Development of a Spiral Ultrasonic Assisted Grinding Technique for High Efficiency and High Quality Machining of Sapphire Wafer

Research Project

Project/Area Number 25420059
Research Category

Grant-in-Aid for Scientific Research (C)

Allocation TypeMulti-year Fund
Section一般
Research Field Production engineering/Processing studies
Research InstitutionAkita Prefectural University

Principal Investigator

WU YONGBO  秋田県立大学, システム科学技術学部, 教授 (10302176)

Co-Investigator(Kenkyū-buntansha) FUJIMOTO MASAKAZU  青山学院大学, 理工学部, 助教 (00581290)
Project Period (FY) 2013-04-01 – 2016-03-31
Project Status Completed (Fiscal Year 2015)
Budget Amount *help
¥5,200,000 (Direct Cost: ¥4,000,000、Indirect Cost: ¥1,200,000)
Fiscal Year 2015: ¥1,300,000 (Direct Cost: ¥1,000,000、Indirect Cost: ¥300,000)
Fiscal Year 2014: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Fiscal Year 2013: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
Keywords機械工作 / 生産工学 / 研削 / 超音波 / サファイア / LED / 機械工作・生産工学
Outline of Final Research Achievements

A spiral ultrasonic assisted grinding technique was proposed and an experiment setup was constructed. Then, scratching tests and grinding experiments of sapphire material were performed followed by fractal analysison work-surface formation. The results showed that with ultrasonication (1) the critical depth of cut increases by around 30% and the grinding force decreases by more than 30%; (2)with the resin-bond diamond wheel the grain cutting edge becomes small and its number increases, whilst with the vitrified-bond wheel good working surface is maintained and the wheel wear is reduced followed by the improvement in work-surface quality; (3)the fractal analysis demonstrated that the surface roughness and the material removal mode can be characterized by fractal dimension.
In addition, for the practical use of the proposed technique, a new ultrasonic unit with the vacuum mechanism for fixing the workpiece was successfully produced and its performance was confirmed.

Report

(4 results)
  • 2015 Annual Research Report   Final Research Report ( PDF )
  • 2014 Research-status Report
  • 2013 Research-status Report
  • Research Products

    (19 results)

All 2016 2015 2014 2013

All Journal Article (9 results) (of which Int'l Joint Research: 1 results,  Open Access: 1 results,  Acknowledgement Compliant: 2 results,  Peer Reviewed: 7 results) Presentation (10 results) (of which Int'l Joint Research: 2 results)

  • [Journal Article] Investigation on surface formation mechanism in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire based on fractal analysis method2016

    • Author(s)
      Qiuyan Wang, Zhiqiang Liang, Xibin Wang, Tianfeng Zhou, Wenxiang Zhao, Yongbo Wu, Li Jiao
    • Journal Title

      Int. J. of Advanced Manufacturing Technology

      Volume: 未定

    • Related Report
      2015 Annual Research Report
    • Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
  • [Journal Article] 二次元(楕円)超音波微振動を援用した高能率研削2015

    • Author(s)
      野村光由,呉勇波
    • Journal Title

      超音波テクノ

      Volume: 27 Pages: 27-31

    • Related Report
      2015 Annual Research Report
    • Open Access / Acknowledgement Compliant
  • [Journal Article] Fractal analysis of surface topography in ground monocrystal sapphire2015

    • Author(s)
      Qiuyan Wang, Zhiqiang Liang, Xibin Wang, Wenxiang Zhao, Yongbo Wu and Tianfeng Zhou
    • Journal Title

      Applied Surface Science

      Volume: 327 Pages: 182-189

    • Related Report
      2014 Research-status Report
    • Peer Reviewed
  • [Journal Article] Research on Fractal Characterization in Grinding of Monocrystal Sapphire2014

    • Author(s)
      Wang Qiuyan, Zhao Wenxiang, Liang Zhiqiang, Wang Xibin, Jiao Li and Wu Yongbo
    • Journal Title

      Materials Science Forum

      Volume: 800-801 Pages: 186-190

    • Related Report
      2014 Research-status Report
    • Peer Reviewed
  • [Journal Article] A three-dimensional Fractal Analysis Method for Ground Monocrystal Sapphire Surface2014

    • Author(s)
      Wang Qiuyan, Liang Zhiqiang, Wang Xibin, Zhao Wenxiang, Wu Yongbo, Jiao Li and Xie Lijing
    • Journal Title

      Advanced Materials Research

      Volume: 1017 Pages: 187-192

    • Related Report
      2014 Research-status Report
    • Peer Reviewed
  • [Journal Article] Grinding force characteristics in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire2014

    • Author(s)
      Zhiqiang Liang, Xibin Wang, Yongbo Wu, Li Jiao, Wenxiang Zhao, Tianfeng Zhou
    • Journal Title

      Int. J. of Abrasive Technology

      Volume: in press

    • Related Report
      2013 Research-status Report
    • Peer Reviewed
  • [Journal Article] Experimental Study on Brittle - Ductile Transition in Elliptical Ultrasonic Assisted Grinding (EUAG) of Monocrystal Sapphire using Single Diamond Abrasive Grain2013

    • Author(s)
      Zhiqiang Liang, Xibin Wang, Yongbo Wu, Lijing Xie, Li Jiao, Wenxiang Zhao
    • Journal Title

      International Journal of Machine Tools and Manufacture

      Volume: 71 Pages: 44-51

    • Related Report
      2013 Research-status Report
    • Peer Reviewed
  • [Journal Article] An experimental investigation on effective friction coefficient in Elliptical Ultrasonic Assisted Grinding (EUAG) of monocrystal sapphire2013

    • Author(s)
      Zhiqiang Liang, Xibin Wang, Yongbo Wu, Lijing Xie, Li Jiao, Wenxiang Zhao
    • Journal Title

      Int. J. Nanomanufacturing

      Volume: Vol.9, Nos.5/6 Pages: 477-485

    • Related Report
      2013 Research-status Report
    • Peer Reviewed
  • [Journal Article] 結晶硬脆材料のスパイラル超音波援用研削2013

    • Author(s)
      呉 勇波
    • Journal Title

      砥粒加工学会誌

      Volume: Vol.57, No.7 Pages: 43-49

    • Related Report
      2013 Research-status Report
  • [Presentation] Grinding performance of spiral ultrasonic assisted grinding for monocrystal sapphire using vitrified diamond wheel2015

    • Author(s)
      Takuya Miura, Yongbo Wu, Masakazu Fujimoto, Mitsuyoshi Nomura and Zhiqiang Liang
    • Organizer
      LEM21
    • Place of Presentation
      京都市
    • Year and Date
      2015-10-18
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] 単結晶サファイアのスパイラル超音波援用研削―超音波振動がダイヤモンド砥石に及ぼす効果―2015

    • Author(s)
      三浦拓也,呉勇波,野村光由
    • Organizer
      2015年度JSPE秋季大会学術講演会
    • Place of Presentation
      東北大学川内キャンパス
    • Year and Date
      2015-09-04
    • Related Report
      2015 Annual Research Report
  • [Presentation] Research on surface formation mechanism in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using structure function fractal method2015

    • Author(s)
      Qiuyan Wang, Zhiqiang Liang, Xibin Wang, Wenxiang Zhao, Yongbo Wu, Li Jiao and Tianfeng Zhou
    • Organizer
      10th ASME 2015 Manufacturing Science and Engineering Conference (MSEC2015)
    • Place of Presentation
      Charlotte, North Carolina, USA
    • Year and Date
      2015-06-05
    • Related Report
      2015 Annual Research Report
    • Int'l Joint Research
  • [Presentation] サファイアのスパイラル超音波援用研削の研究―ビトリファイドダイヤモンド砥石の加工特性―2015

    • Author(s)
      三浦拓也,呉 勇波,藤本正和,野村光由,梁志強
    • Organizer
      JSME東北学生会第45回学生員卒業研究発表講演会
    • Place of Presentation
      八戸高専
    • Year and Date
      2015-03-10
    • Related Report
      2014 Research-status Report
  • [Presentation] サファイアウエハのスパイラル超音波援用研削における砥石摩耗特性―ビトリファイドダイヤモンド砥石の作業面トポグラフィ―2014

    • Author(s)
      藤本正和,呉勇波,野村光由,三浦拓也,梁志強
    • Organizer
      JSME第10回生産加工・工作機械部門講演会
    • Place of Presentation
      徳島大学常三島C
    • Year and Date
      2014-11-15 – 2014-11-16
    • Related Report
      2014 Research-status Report
  • [Presentation] サファイアウエハのスパイラル超音波援用研削に関する基礎研究―レジンボンドダイヤモンド砥石における砥石切れ刃挙動―2014

    • Author(s)
      藤本正和,呉勇波,野村光由,三浦拓也,梁志強
    • Organizer
      2014年度砥粒加工学会学術講演会(ABTEC2014)
    • Place of Presentation
      岩手大学工学部
    • Year and Date
      2014-09-09 – 2014-09-11
    • Related Report
      2014 Research-status Report
  • [Presentation] サファイアウエハのスパイラル超音波援用研削における材料除去機構-単粒スクラッチ試験による延性/脆性モードの遷移について-2014

    • Author(s)
      藤本正和,呉 勇波,野村光由,梁 志強
    • Organizer
      2014年度JSPE春季大会学術講演会
    • Place of Presentation
      東京大学本郷キャンパス
    • Related Report
      2013 Research-status Report
  • [Presentation] 単結晶材料のスパイラル超音波援用研削における材料除去機構2013

    • Author(s)
      藤本正和,呉勇波,野村光由,梁志強
    • Organizer
      2013年度砥粒加工学会学術講演会(ABTEC2013)
    • Place of Presentation
      日本大学理工学部
    • Related Report
      2013 Research-status Report
  • [Presentation] Experimental investigation of material removal mechanism in ultrasonic assisted grinding of SiC ceramics using a single diamond tool2013

    • Author(s)
      J. Cao, Y. Wu, H. Guo, M. Fujimoto and M. Nomura
    • Organizer
      国際会議LEM21
    • Place of Presentation
      宮城県松島町
    • Related Report
      2013 Research-status Report
  • [Presentation] Surface topography of small diameter diamond wheel in ultrasonic assisted grinding,2013

    • Author(s)
      M. Fujimoto, Y. Wu, M. Nomura, H. Kanai and M. Jin, Surface topography of small diameter diamond wheel in ultrasonic assisted grinding
    • Organizer
      国際会議LEM21
    • Place of Presentation
      宮城県松島町
    • Related Report
      2013 Research-status Report

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Published: 2014-07-25   Modified: 2019-07-29  

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