| Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2015: ¥1,170,000 (Direct Cost: ¥900,000、Indirect Cost: ¥270,000)
Fiscal Year 2014: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2013: ¥2,470,000 (Direct Cost: ¥1,900,000、Indirect Cost: ¥570,000)
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| Outline of Final Research Achievements |
In this work, we carried out the basic study on the introduction of the interface control layer and post-heat treatment condition in order to realize a high-quality insulating film / SiC structure. We investigated in the Si (100) substrate without using the SiC substrate in this study. The interface control layer formation was carried out by catalytic decomposition of NH3 gas by heating the filament. The optimal condition was revealed as follows; filament temperature: 1600 ° C., the substrate temperature: 200 ° C, treatment time: 30 min. In addition, we examine the optimal conditions of the post-heat treatment in a nitrogen atmosphere. It was found that it is possible to reduce the interface state density by the treatment for 60 minutes at 400 ℃.
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