High radiation resistant CMOS integrated circuits using Wide-Band Gap SiC Semiconductor
Project/Area Number |
25420331
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Research Category |
Grant-in-Aid for Scientific Research (C)
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Allocation Type | Multi-year Fund |
Section | 一般 |
Research Field |
Electron device/Electronic equipment
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Research Institution | Hiroshima University |
Principal Investigator |
Shin-Ichiro Kuroki 広島大学, ナノデバイス・バイオ融合科学研究所, 准教授 (70400281)
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Project Period (FY) |
2013-04-01 – 2016-03-31
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Project Status |
Completed (Fiscal Year 2015)
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Budget Amount *help |
¥5,070,000 (Direct Cost: ¥3,900,000、Indirect Cost: ¥1,170,000)
Fiscal Year 2015: ¥1,690,000 (Direct Cost: ¥1,300,000、Indirect Cost: ¥390,000)
Fiscal Year 2014: ¥1,430,000 (Direct Cost: ¥1,100,000、Indirect Cost: ¥330,000)
Fiscal Year 2013: ¥1,950,000 (Direct Cost: ¥1,500,000、Indirect Cost: ¥450,000)
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Keywords | 極限環境エレクトロニクス / シリコンカーバイド / 集積回路 / MOSFET / 耐放射線 / 耐高温 / 原子力発電所廃炉 / シリコンカーバイド極限環境エレクトロニクス / CMOS集積回路 |
Outline of Final Research Achievements |
Radiation-hardened electronics has been required for the decommissioning of the Fukushima-1 plant accident. . 4H-SiC with wide-bandgap energy is one of the candidate for base semiconductor for the radiation-hardened electronics. In this work, 4H-SiC nMOSFETs with As-doped S/D and NbNi silicide contacts were demonstrated in harsh environments of high gamma-ray radiation up to over 100 Mrad and high-temperature up to 450°C. For an integrated logic circuits, pseudo-CMOS and nMOS inverters were also demonstrated.
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Report
(4 results)
Research Products
(37 results)
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[Journal Article] Characterization of 4H-SiC nMOSFETs in Harsh Environments, High-Temperature and High Gamma-Ray Radiation2016
Author(s)
S-I. Kuroki, H. Nagatsuma, M. De Silva, S. Ishikawa, T. Maeda, H. Sezaki, T. Kikkawa, T. Makino, T. Ohshima, M. Ostling, and C.-M. Zetterling
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Journal Title
Mat. Sci. Forum
Volume: 858
Pages: 864-867
DOI
Related Report
Peer Reviewed / Int'l Joint Research / Acknowledgement Compliant
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[Presentation] 4H-SiC MOSFETs for power and harsh environment electronics2016
Author(s)
Shin-Ichiro. Kuroki, Hirofumi Nagatsuma, Milantha De Silva, Seiji Ishikawa, Tomonori Maeda, Hiroshi Sezaki, Takamaro Kikkawa, Takahiro Makino, Takashi Ohshima, Mikael Ostling, and Carl-Mikael Zetterling
Organizer
Annual World Congress of Smart Materials 2016-Develop New Path of Smartness
Place of Presentation
Singapore
Year and Date
2016-03-04
Related Report
Int'l Joint Research / Invited
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[Presentation] Characterization of 4H-SiC nMOSFETs in Harsh Environments; High-Temperature and High Gamma-Ray Radiation2015
Author(s)
S-I. Kuroki, H. Nagatsuma, M. De Silva, S. Ishikawa, T. Maeda, H. Sezaki, T. Kikkawa, T. Makino, T. Ohshima, M. Ostling, and C.-M. Zetterling
Organizer
The International Conference on Silicon Carbide and Related Materials 2015(ICSCRM2015, シリコンカーバイト及び関連材料に関する国際会議)
Place of Presentation
Giardini Naxos, Italy
Year and Date
2015-10-04
Related Report
Int'l Joint Research
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[Presentation] 4H-SiC nMOSFETs with As-doped S/D and NbNi silicide ohmic contacts2015
Author(s)
H. Nagatsuma, S-I. Kuroki, M. De Silva, S. Ishikawa, T. Maeda, H. Sezaki, T, Kikkawa, M. Ostling, and C.-M. Zetterling
Organizer
The International Conference on Silicon Carbide and Related Materials 2015(ICSCRM2015, シリコンカーバイト及び関連材料に関する国際会議)
Place of Presentation
Giardini Naxos, Italy
Year and Date
2015-10-04
Related Report
Int'l Joint Research
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[Presentation] 4H-SiC nMOSFETs with As-doped S/D and NbNi silicide2015
Author(s)
Hirofumi Nagatsuma, Shin-Ichiro Kuroki, Milantha De Silva, Seiji Ishikawa, Tomonori Maeda, Hiroshi Sezaki, Takamaro Kikkawa, Mikael Ostling and Carl-Mikael Zetterling
Organizer
International Workshop on Nanodevice Technologies 2015
Place of Presentation
東広島市
Year and Date
2015-03-03
Related Report
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